loadpatents
Patent applications and USPTO patent grants for Lin; Feng-Lung.The latest application filed is for "method for integrated circuit manufacturing".
Patent | Date |
---|---|
Method for integrated circuit manufacturing Grant 10,747,938 - Wang , et al. A | 2020-08-18 |
Method for Integrated Circuit Manufacturing App 20190340330 - Wang; Hung-Chun ;   et al. | 2019-11-07 |
Method for integrated circuit manufacturing Grant 10,360,339 - Wang , et al. | 2019-07-23 |
Method for Integrated Circuit Manufacturing App 20160162627 - Wang; Hung-Chun ;   et al. | 2016-06-09 |
Method for integrated circuit manufacturing Grant 9,262,578 - Wang , et al. February 16, 2 | 2016-02-16 |
Method for Integrated Circuit Manufacturing App 20150310158 - Wang; Hung-Chun ;   et al. | 2015-10-29 |
Hybrid multi-layer mask Grant 8,202,681 - Lin , et al. June 19, 2 | 2012-06-19 |
Hybrid Multi-Layer Mask App 20110281208 - Lin; Feng-Lung ;   et al. | 2011-11-17 |
Multiple technology node mask Grant 8,007,966 - Lin , et al. August 30, 2 | 2011-08-30 |
Hybrid multi-layer mask Grant 8,003,281 - Lin , et al. August 23, 2 | 2011-08-23 |
Multiple Technology Node Mask App 20110113389 - Lin; Feng Lung ;   et al. | 2011-05-12 |
Multiple technology node mask Grant 7,875,406 - Lin , et al. January 25, 2 | 2011-01-25 |
Hybrid Multi-layer Mask App 20100047698 - Lin; Feng-Lung ;   et al. | 2010-02-25 |
Multiple Technology Node Mask App 20090246975 - Lin; Feng Lung ;   et al. | 2009-10-01 |
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