Lin; Ding-Yao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Ding-Yao.The latest application filed is for "led package improved structure and fabricating method thereof".
- Lin; Ding-Yao - TaoYuan County TW
- LIN; Ding-Yao - Taoyuan TW
| Patent | Date |
|---|---|
| LED package improved structure and fabricating method thereof Grant 9,263,654 - Hsing Chen , et al. February 16, 2 | 2016-02-16 |
| Light enhancing structure for a light emitting diode Grant 9,224,923 - Hsing Chen , et al. December 29, 2 | 2015-12-29 |
| Led Package Improved Structure And Fabricating Method Thereof App 20150357538 - HSING CHEN; Chen-Lun ; et al. | 2015-12-10 |
| Light emitting diode package structure Grant 9,117,731 - Hsing Chen , et al. August 25, 2 | 2015-08-25 |
| Light Enhancing Structure For A Light Emitting Diode App 20150091033 - HSING CHEN; Chen-Lun ; et al. | 2015-04-02 |
| Light Emitting Diode Package Structure App 20150091026 - HSING CHEN; Chen-Lun ; et al. | 2015-04-02 |
| Led Chip Package App 20150054017 - HSING CHEN; Chen-Lun ; et al. | 2015-02-26 |
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