| Patent | Date |
|---|
Dartboard Structure And Method For Manufacturing The Same
App 20210302132 - TSAI; HUAI-FANG ; et al. | 2021-09-30 |
Chip packaging structure and manufacturing method for the same
Grant 10,651,146 - Lin | 2020-05-12 |
Semiconductor packaging structure and manufacturing method for the same
Grant 9,892,988 - Hu , et al. February 13, 2 | 2018-02-13 |
Metal top stacking package structure and method for manufacturing the same
Grant 9,887,145 - Lin February 6, 2 | 2018-02-06 |
Packaging structure for thin die and method for manufacturing the same
Grant 9,646,937 - Lin May 9, 2 | 2017-05-09 |
Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structure
Grant 9,607,933 - Lin March 28, 2 | 2017-03-28 |
Metal Top Stacking Package Structure and Method for Manufacturing the same
App 20160293509 - LIN; Diann-Fang | 2016-10-06 |
Multichip Stacking Package Structure And Method For Manufacturing The Same
App 20160240512 - LIN; Diann-Fang | 2016-08-18 |
Packaging Structure For Thin Die And Method For Manufacturing The Same
App 20150357288 - LIN; Diann-Fang | 2015-12-10 |
Micro electronic component structure
Grant 9,161,446 - Lin October 13, 2 | 2015-10-13 |
Lead Frame Structure For Quad Flat No-lead Package, Quad Flat No-lead Package And Method For Forming The Lead Frame Structure
App 20150228561 - LIN; DIANN FANG | 2015-08-13 |
Semiconductor Packaging Structure And Manufacturing Method For The Same
App 20150228596 - HU; Yu-Shan ; et al. | 2015-08-13 |
Method for manufacturing a chip packaging structure
Grant 8,962,390 - Lin February 24, 2 | 2015-02-24 |
Micro Electronic Component Structure
App 20140202754 - LIN; DIANN FANG | 2014-07-24 |
Package structure
Grant 8,749,048 - Lin , et al. June 10, 2 | 2014-06-10 |
Electrical Device With Connection Interface, Circuit Board Thereof, And Method For Manufacturing The Same
App 20130120947 - LIN; Diann-Fang | 2013-05-16 |
Chip Packaging Structure And Manufacturing Method For The Same
App 20130062783 - LIN; Diann-Fang | 2013-03-14 |
Method For Manufacturing A Chip Packaging Structure
App 20130065363 - Lin; Diann-Fang | 2013-03-14 |
Package structure and manufacturing method thereof
Grant 8,058,102 - Lin , et al. November 15, 2 | 2011-11-15 |
Conductor Package Structure And Method Of The Same
App 20110209908 - Lin; Diann-Fang ; et al. | 2011-09-01 |
Package Structure
App 20110193216 - Lin; Diann-Fang ; et al. | 2011-08-11 |
Conductor Package Structure And Method Of The Same
App 20110180891 - Lin; Diann-Fang ; et al. | 2011-07-28 |
Package Structure And Manufacturing Method Thereof
App 20110108977 - Lin; Diann-Fang ; et al. | 2011-05-12 |
Conductor Package Structure And Method Of The Same
App 20110031607 - Lin; Diann-Fang ; et al. | 2011-02-10 |
Conductor Package Structure And Method Of The Same
App 20110031594 - Lin; Diann-Fang ; et al. | 2011-02-10 |
Semiconductor device package with multi-chips and method of the same
Grant 7,763,494 - Yang , et al. July 27, 2 | 2010-07-27 |
Semiconductor device package having multi-chips with side-by-side configuration and method of the same
Grant 7,525,185 - Yang , et al. April 28, 2 | 2009-04-28 |
Image sensor module having build-in package cavity and the method of the same
Grant 7,498,556 - Yang , et al. March 3, 2 | 2009-03-03 |
Inter-connecting Structure For Semiconductor Device Package And Method Of The Same
App 20090008777 - Lin; Diann-Fang ; et al. | 2009-01-08 |
Semiconductor device package with multi-chips and method of the same
App 20080274593 - Yang; Wen-Kun ; et al. | 2008-11-06 |
Stack Package With Releasing Layer And Method For Forming The Same
App 20080265393 - Lin; Diann-Fang ; et al. | 2008-10-30 |
Semiconductor Device Package To Improve Functions Of Heat Sink And Ground Shield
App 20080258293 - YANG; Wen-Kun ; et al. | 2008-10-23 |
Semiconductor device package having multi-chips with side-by-side configuration and method of the same
App 20080251908 - Yang; Wen-Kun ; et al. | 2008-10-16 |
Semiconductor device package having multi-chips with side-by-side configuration and method of the same
App 20080230884 - Yang; Wen-Kun ; et al. | 2008-09-25 |
Semiconductor device package
App 20080224276 - Yang; Wen-Kun ; et al. | 2008-09-18 |
Image sensor module having build-in package cavity and the method of the same
App 20080224248 - Yang; Wen-Kun ; et al. | 2008-09-18 |
Package structure to improve the reliability for WLP
App 20080211080 - Yang; Wen-Kun ; et al. | 2008-09-04 |
Image Sensor Chip Scale Package Having Inter-adhesion With Gap And Method Of The Same
App 20080211075 - Yang; Wen-Kun ; et al. | 2008-09-04 |
Semiconductor Device Package With Die Receiving Through-hole And Connecting Through-hole And Method Of The Same
App 20080197478 - Yang; Wen-Kun ; et al. | 2008-08-21 |
Semiconductor device package with multi-chips and method of the same
App 20080197480 - Yang; Wen-Kun ; et al. | 2008-08-21 |
Semiconductor device package with multi-chips and method of the same
App 20080197474 - Yang; Wen-Kun ; et al. | 2008-08-21 |
Image sensor package with die receiving opening and method of the same
App 20080191333 - Yang; Wen-Kun ; et al. | 2008-08-14 |
Cmos Image Sensor Chip Scale Package With Die Receiving Opening And Method Of The Same
App 20080191335 - Yang; Wen-Kun ; et al. | 2008-08-14 |
Method and system for generating test pulses to test electronic elements
Grant 7,369,957 - Chang , et al. May 6, 2 | 2008-05-06 |
Cmos Image Sensor Chip Scale Package With Die Receiving Through-hole And Method Of The Same
App 20080083980 - Yang; Wen-Kun ; et al. | 2008-04-10 |
Method and system for generating test pulses to test electronic elements
App 20070156368 - Chang; Shih-Bou ; et al. | 2007-07-05 |
Apparatus and method of automatically cleaning a pick-up head
App 20060260648 - Lin; Diann-Fang ; et al. | 2006-11-23 |
Method and system for generating test pulses to test electronic elements
App 20050209805 - Chang, Shih-Bou ; et al. | 2005-09-22 |
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