Lin; Daniel Yong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Daniel Yong.The latest application filed is for "packaged semiconductor device with a particle roughened surface".

Company Profile

2.6.5

Lin; Daniel Yong - Plano TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged semiconductor device with a reflow wall Grant 11,437,333 - Gupta , et al. September 6, 2	2022-09-06
Packaged semiconductor device with a particle roughened surface Grant 11,062,982 - Gupta , et al. July 13, 2	2021-07-13
Packaged Semiconductor Device With A Particle Roughened Surface App 20200083149 - Gupta; Vikas ; et al.	2020-03-12
Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer Grant 10,573,586 - Cook , et al. Feb	2020-02-25
Packaged semiconductor device with a particle roughened surface Grant 10,475,729 - Gupta , et al. Nov	2019-11-12
Packaged Semiconductor Device With A Particle Roughened Surface App 20190157195 - Gupta; Vikas ; et al.	2019-05-23
Packaged semiconductor device with a particle roughened surface Grant 10,186,478 - Gupta , et al. Ja	2019-01-22
Packaged Semiconductor Device Having Patterned Conductance Dual-Material Nanoparticle Adhesion Layer App 20180240741 - Cook; Benjamin Stassen ; et al.	2018-08-23
Packaged Semiconductor Device With A Reflow Wall App 20180190608 - Gupta; Vikas ; et al.	2018-07-05
Packaged Semiconductor Device With A Particle Roughened Surface App 20180190577 - Gupta; Vikas ; et al.	2018-07-05
Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer Grant 9,941,194 - Cook , et al. April 10, 2	2018-04-10

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