Lin; Chung-Yi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Chung-Yi.The latest application filed is for "package and package-on-package structure having elliptical columns and ellipsoid joint terminals".
Company Profile
6.31.43
- Lin; Chung-Yi - Hsinchu City TW
- Lin; Chung-Yi - Hsinchu TW
- Lin; Chung Yi - Hsinchu County TW
- LIN; Chung-Yi - New Taipei City TW
- Lin; Chung-Yi - New Taipei TW
- Lin; Chung-Yi - Hsin-Chu TW
- Lin; Chung-Yi - Kaohsiung TW
- Lin; Chung-Yi - Minhsiung Township TW
- LIN; Chung-Yi - Taoyuan County TW
- Lin; Chung-Yi - Xinfeng Township TW
- LIN; CHUNG-YI - Tu-Cheng TW
- Lin; Chung-Yi - Taipei TW
- Lin; Chung-Yi - Taipei Hsien TW
- LIN; Chung-Yi - Taichung County TW
- Lin; Chung-Yi - Shulin TW
- Lin; Chung-Yi - Shulin City TW
- Lin; Chung-Yi - Taipei City TW
- Lin; Chung-Yi - Tainan TW
- Lin; Chung-Yi - Shinying TW
- Lin; Chung-Yi - Yunghe City Taipei Hsien TW
Patent Activity
| Patent | Date |
|---|---|
| Package And Package-on-package Structure Having Elliptical Columns And Ellipsoid Joint Terminals App 20220301964 - Chiu; Sheng-Huan ; et al. | 2022-09-22 |
| Package and package-on-package structure having elliptical columns and ellipsoid joint terminals Grant 11,404,341 - Chiu , et al. August 2, 2 | 2022-08-02 |
| 3d Memory Device And Manufacturing Method Thereof App 20220238549 - Lin; Chung Yi ; et al. | 2022-07-28 |
| Memory Device And Sram Cell App 20220199630 - YE; Hung-Yu ; et al. | 2022-06-23 |
| Memory device, SRAM cell, and manufacturing method thereof Grant 11,282,843 - Ye , et al. March 22, 2 | 2022-03-22 |
| Memory Device, Sram Cell, And Manufacturing Method Thereof App 20210366916 - YE; Hung-Yu ; et al. | 2021-11-25 |
| Charging prevention method and structure Grant 11,036,911 - Lin , et al. June 15, 2 | 2021-06-15 |
| Respiratory System App 20210093825 - LIN; Chun-Yen ; et al. | 2021-04-01 |
| Charging Prevention Method and Structure App 20210097228 - Lin; Han-Chung ; et al. | 2021-04-01 |
| Inflation identification connector and air mattress system having same Grant 10,709,255 - Huang , et al. | 2020-07-14 |
| Package, Package-on-package Structure, And Method Of Manufacturing Package-on-package Structure App 20200194326 - Chiu; Sheng-Huan ; et al. | 2020-06-18 |
| Package and package-on-package structure having elliptical conductive columns Grant 10,573,573 - Chiu , et al. Feb | 2020-02-25 |
| Package, Package-on-package Structure, And Method Of Manufacturing Package-on-package Structure App 20190295913 - Chiu; Sheng-Huan ; et al. | 2019-09-26 |
| Inflation Identification Connector And Air Mattress System Having Same App 20190142180 - HUANG; DAVID ; et al. | 2019-05-16 |
| Semiconductor device and layout method Grant 10,164,002 - Chen , et al. Dec | 2018-12-25 |
| Semiconductor Device And Layout Method App 20180151665 - CHEN; WAN-TE ; et al. | 2018-05-31 |
| Exclusion zone for stress-sensitive circuit design Grant 9,691,749 - Su , et al. June 27, 2 | 2017-06-27 |
| Pivot shaft transmission device Grant 9,678,541 - Hsu , et al. June 13, 2 | 2017-06-13 |
| Optical waveguide structure and manufacturing method thereof Grant 9,563,015 - Chiu , et al. February 7, 2 | 2017-02-07 |
| Optical Waveguide Structure And Manufacturing Method Thereof App 20170023734 - CHIU; Yi-Jen ; et al. | 2017-01-26 |
| Pivot mechanism of synchronous hinge device Grant 9,524,000 - Hsu , et al. December 20, 2 | 2016-12-20 |
| Transmission device applied to pivot shaft mechanism Grant 9,462,713 - Hsu , et al. October 4, 2 | 2016-10-04 |
| Light-mixing flashlight Grant 9,341,323 - Wang , et al. May 17, 2 | 2016-05-17 |
| Dual-shaft synchronous transmission device Grant 9,310,849 - Hsu , et al. April 12, 2 | 2016-04-12 |
| Dual-shaft synchronous transmission fixing device Grant 9,309,705 - Hsu , et al. April 12, 2 | 2016-04-12 |
| Transmission Device Applied To Pivot Shaft Mechanism App 20160047156 - HSU; AN SZU ; et al. | 2016-02-18 |
| Pivot Shaft Transmission Device App 20160048175 - HSU; AN SZU ; et al. | 2016-02-18 |
| Dual-shaft Synchronous Transmission Fixing Device App 20160032633 - HSU; AN SZU ; et al. | 2016-02-04 |
| Pivot Mechanism Of Synchronous Hinge Device App 20160010374 - HSU; AN SZU ; et al. | 2016-01-14 |
| Dual-shaft Synchronous Transmission Device App 20160011632 - HSU; AN SZU ; et al. | 2016-01-14 |
| Protected solder ball joints in wafer level chip-scale packaging Grant 9,136,211 - Wang , et al. September 15, 2 | 2015-09-15 |
| Flyback power converter and electronic apparatus Grant 9,118,255 - Lin , et al. August 25, 2 | 2015-08-25 |
| Methods of patterning small via pitch dimensions Grant 9,099,530 - Lin , et al. August 4, 2 | 2015-08-04 |
| Holder Stand App 20150034778 - LIN; Chung-Yi ; et al. | 2015-02-05 |
| Exclusion Zone for Stress-Sensitive Circuit Design App 20140346644 - Su; Chao-Yuan ; et al. | 2014-11-27 |
| Exclusion zone for stress-sensitive circuit design Grant 8,829,653 - Su , et al. September 9, 2 | 2014-09-09 |
| Methods of Patterning Small Via Pitch Dimensions App 20140242794 - Lin; Chung-Yi ; et al. | 2014-08-28 |
| Methods of patterning small via pitch dimensions Grant 8,728,332 - Lin , et al. May 20, 2 | 2014-05-20 |
| Flyback Power Converter And Electronic Apparatus App 20140133192 - LIN; CHUNG-YI ; et al. | 2014-05-15 |
| Exclusion Zone for Stress-Sensitive Circuit Design App 20140087492 - Su; Chao-Yuan ; et al. | 2014-03-27 |
| Exclusion zone for stress-sensitive circuit design Grant 8,624,346 - Su , et al. January 7, 2 | 2014-01-07 |
| Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging App 20130299984 - Wang; Chung Yu ; et al. | 2013-11-14 |
| Methods Of Patterning Small Via Pitch Dimensions App 20130295769 - Lin; Chung-Yi ; et al. | 2013-11-07 |
| Protected solder ball joints in wafer level chip-scale packaging Grant 8,492,263 - Wang , et al. July 23, 2 | 2013-07-23 |
| Resource Sharing Devices App 20110185009 - Chang; Ming-Te ; et al. | 2011-07-28 |
| Hinge App 20110005034 - LIN; CHUNG-YI | 2011-01-13 |
| Hinge App 20100269296 - LIN; CHUNG-YI | 2010-10-28 |
| Method of tracking vocal target Grant 7,792,326 - Lin September 7, 2 | 2010-09-07 |
| Hinge for a tablet computer extension pad Grant 7,716,788 - Lin May 18, 2 | 2010-05-18 |
| Interference Assembly, Hinge Utilizing The Same, And Collapsible Device Utilizing The Hinge App 20100000049 - LIN; CHUNG-YI | 2010-01-07 |
| Method of forming overhang support for a stacked semiconductor device Grant 7,588,963 - Chao , et al. September 15, 2 | 2009-09-15 |
| Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging App 20090130840 - Wang; Chung Yu ; et al. | 2009-05-21 |
| Adjustable Multi-function Support Assembly App 20090084923 - LIN; Chung-Yi | 2009-04-02 |
| Hinge App 20090056073 - Lin; Chung-Yi | 2009-03-05 |
| Hinge For A Tablet Computer Extension Pad App 20090031532 - Lin; Chung-Yi | 2009-02-05 |
| Hinge with multiple stay positions App 20080244868 - Lin; Chung-Yi | 2008-10-09 |
| Pivotal device App 20080134468 - Chen; Jason ; et al. | 2008-06-12 |
| Heat stud for stacked chip package Grant 7,361,986 - Yuan , et al. April 22, 2 | 2008-04-22 |
| Method Of Tracking Vocal Target App 20080013786 - Lin; Chung-Yi | 2008-01-17 |
| Exclusion zone for stress-sensitive circuit design App 20070090547 - Su; Chao-Yuan ; et al. | 2007-04-26 |
| Thermally enhanced cavity down ball grid array package App 20070040269 - Tsao; Pei-Haw ; et al. | 2007-02-22 |
| Overhang support for a stacked semiconductor device, and method of forming thereof App 20060270112 - Chao; Te-Tsung ; et al. | 2006-11-30 |
| Structural design for flip-chip assembly Grant 7,138,300 - Yuan , et al. November 21, 2 | 2006-11-21 |
| Overhang support for a stacked semiconductor device, and method of forming thereof Grant 7,116,002 - Chao , et al. October 3, 2 | 2006-10-03 |
| Thermal expansion compensating flip chip ball grid array package structure App 20060118947 - Yuan; Tsorng-Dih ; et al. | 2006-06-08 |
| Heat stud for stacked chip package App 20060113663 - Yuan; Tsorng-Dih ; et al. | 2006-06-01 |
| Structural design for flip-chip assembly App 20060063300 - Yuan; Tsorng-Dih ; et al. | 2006-03-23 |
| Overhang support for a stacked semiconductor device, and method of forming thereof App 20050248019 - Chao, Te-Tsung ; et al. | 2005-11-10 |
| Automatic wall cleansing apparatus Grant 6,493,902 - Lin December 17, 2 | 2002-12-17 |
| Automatic wall cleansing apparatus App 20020112312 - Lin, Chung-Yi | 2002-08-22 |
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