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name:-0.088397979736328
name:-0.065335988998413
name:-0.011924982070923
Lin; Chung-Hsien Patent Filings

Lin; Chung-Hsien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chung-Hsien.The latest application filed is for "sensor with integrated heater".

Company Profile
12.74.85
  • Lin; Chung-Hsien - Hsinchu TW
  • Lin; Chung-Hsien - Hsinchu City TW
  • Lin; Chung Hsien - Taichung City TW
  • Lin; Chung-Hsien - Hsin-Chu TW
  • Lin; Chung-Hsien - Hsinchu City 300 TW
  • Lin; Chung-Hsien - Taichung N/A TW
  • Lin; Chung-Hsien - Zhongli TW
  • LIN; Chung-Hsien - Zhongli City TW
  • Lin; Chung-Hsien - Hsinchu Science Park Hsinchu N/A TW
  • Lin; Chung-Hsien - Taipei Hsien TW
  • Lin; Chung-Hsien - Yongkang City TW
  • Lin; Chung-Hsien - Kaohsiung TW
  • Lin; Chung-Hsien - Ta-Li City TW
  • Lin; Chung-Hsien - Taipei City TW
  • LIN; CHUNG-HSIEN - Tu-Cheng TW
  • Lin; Chung-Hsien - Yonghe City TW
  • Lin; Chung-Hsien - Taipei TW
  • Lin; Chung-Hsien - Banchiau TW
  • Lin, Chung-Hsien - Banchiau City TW
  • Lin, Chung-Hsien - Cha-I City TW
  • Lin, Chung-Hsien - Pan Chaio City TW
  • Lin, Chung-Hsien - Chia-I City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Pressure sensor with improve hermeticity
Grant 11,326,972 - Yen , et al. May 10, 2
2022-05-10
Sensor With Integrated Heater
App 20220098030 - Yen; Pei-Wen ;   et al.
2022-03-31
Edge Patterns Of Microelectromechanical Systems (mems) Microphone Backplate Holes
App 20220070568 - Tang; Tsung Lin ;   et al.
2022-03-03
Sensor with integrated heater
Grant 11,225,409 - Yen , et al. January 18, 2
2022-01-18
MEMS devices and methods of forming same
Grant 11,180,365 - Liang , et al. November 23, 2
2021-11-23
Deformable membrane and a compensating structure thereof
Grant 11,027,967 - Lin , et al. June 8, 2
2021-06-08
Pressure Sensor With Improve Hermeticity
App 20200363281 - Yen; Pei-Wen ;   et al.
2020-11-19
Pressure sensor
Grant 10,816,422 - Lin , et al. October 27, 2
2020-10-27
Pressure sensor
Grant 10,712,218 - Schumm , et al.
2020-07-14
Sensor With Integrated Heater
App 20200087142 - Yen; Pei-Wen ;   et al.
2020-03-19
Movable Needle Valve of Hot-Runner Mold
App 20200070393 - Lin; Chung Hsien
2020-03-05
MEMS Devices and Methods of Forming Same
App 20200062588 - Liang; Kai-Chih ;   et al.
2020-02-27
Liquid Detection In A Sensor Environment And Remedial Action Thereof
App 20200033217 - MICLAUS; Calin ;   et al.
2020-01-30
Deformable Membrane And A Compensating Structure Thereof
App 20190345024 - LIN; Chung-Hsien ;   et al.
2019-11-14
MEMS devices and methods of forming same
Grant 10,457,550 - Liang , et al. Oc
2019-10-29
Pressure Sensor
App 20190226932 - SCHUMM; Johannes ;   et al.
2019-07-25
Pressure sensor
Grant 10,254,185 - Schumm , et al.
2019-04-09
MEMS Devices and Methods of Forming Same
App 20190047851 - Liang; Kai-Chih ;   et al.
2019-02-14
MEMS devices and fabrication methods thereof
Grant 10,160,633 - Chu , et al. Dec
2018-12-25
Reduced stress pressure sensor
Grant 10,161,817 - Mayer , et al. Dec
2018-12-25
MEMS devices and fabrication methods thereof
Grant 10,155,655 - Chu , et al. Dec
2018-12-18
Method for fabricating MEMS switch with reduced dielectric charging effect
Grant 10,134,552 - Chu , et al. November 20, 2
2018-11-20
MEMS devices and methods of forming same
Grant 10,099,919 - Liang , et al. October 16, 2
2018-10-16
Semiconductor devices with moving members and methods for making the same
Grant 10,087,069 - Chu , et al. October 2, 2
2018-10-02
Pressure Sensor
App 20180202882 - Schumm; Johannes ;   et al.
2018-07-19
Pressure sensor
Grant 9,958,349 - Schumm , et al. May 1, 2
2018-05-01
Multiple bonding in wafer level packaging
Grant 9,873,610 - Lin , et al. January 23, 2
2018-01-23
Semiconductor Devices with Moving Members and Methods for Making the Same
App 20170166435 - Chu; Chia-Hua ;   et al.
2017-06-15
Pressure Sensor
App 20170167933 - LIN; Chung-Hsien ;   et al.
2017-06-15
Mechanisms for performing a photolithography process with a surface modifying treatment on an exposed photoresist layer
Grant 9,625,822 - Tsai , et al. April 18, 2
2017-04-18
Gate structure of open-chamber hot-runner mold
Grant 9,623,597 - Lin April 18, 2
2017-04-18
Dual layer microelectromechanical systems device and method of manufacturing same
Grant 9,617,147 - Chu , et al. April 11, 2
2017-04-11
Mems Devices And Methods Of Forming Same
App 20170066647 - Liang; Kai-Chih ;   et al.
2017-03-09
Semiconductor devices with moving members and methods for making the same
Grant 9,586,811 - Chu , et al. March 7, 2
2017-03-07
Pressure sensor with deformable membrane and method of manufacture
Grant 9,581,512 - Lin , et al. February 28, 2
2017-02-28
MEMS device with release aperture
Grant 9,550,666 - Lin , et al. January 24, 2
2017-01-24
Gate Structure Of Open-chamber Hot-runner Mold
App 20170015034 - LIN; CHUNG-HSIEN
2017-01-19
MEMS Devices and Fabrication Methods Thereof
App 20170008758 - Chu; Chia-Hua ;   et al.
2017-01-12
MEMS Devices and Fabrication Methods Thereof
App 20170001860 - Chu; Chia-Hua ;   et al.
2017-01-05
MEMS devices and methods of forming same
Grant 9,499,396 - Liang , et al. November 22, 2
2016-11-22
Pressure Sensor
App 20160290883 - Schumm; Johannes ;   et al.
2016-10-06
MEMS devices and fabrication methods thereof
Grant 9,452,924 - Chu , et al. September 27, 2
2016-09-27
MEMS devices and fabrication methods thereof
Grant 9,450,109 - Chu , et al. September 20, 2
2016-09-20
Hermetic wafer level packaging
Grant 9,337,168 - Chu , et al. May 10, 2
2016-05-10
Measurement device
Grant 9,140,578 - Wang , et al. September 22, 2
2015-09-22
Measurement device
Grant 9,134,141 - Lin , et al. September 15, 2
2015-09-15
MEMS structure with adaptable inter-substrate bond
Grant 9,133,017 - Liang , et al. September 15, 2
2015-09-15
Dual Layer Microelectromechanical Systems Device and Method of Manufacturing Same
App 20150217996 - Chu; Chia-Hua ;   et al.
2015-08-06
MEMS Device with Release Aperture
App 20150166334 - Lin; Chung-Hsien ;   et al.
2015-06-18
MEMS Devices and Methods of Forming Same
App 20150158723 - Liang; Kai-Chih ;   et al.
2015-06-11
Pressure Sensor
App 20150122042 - LIN; Chung-Hsien ;   et al.
2015-05-07
Pressure Sensor
App 20150122041 - LIN; Chung-Hsien ;   et al.
2015-05-07
Pressure Sensor
App 20150122038 - MAYER; Felix ;   et al.
2015-05-07
Mechanisms For Performing A Photolithography Process
App 20150116679 - TSAI; Chi-Cheng ;   et al.
2015-04-30
Dual layer microelectromechanical systems device and method of manufacturing same
Grant 9,006,015 - Chu , et al. April 14, 2
2015-04-14
MEMS devices and methods of forming same
Grant 8,987,059 - Liang , et al. March 24, 2
2015-03-24
MEMS device with release aperture
Grant 8,962,367 - Lin , et al. February 24, 2
2015-02-24
MEMS Structure with Adaptable Inter-Substrate Bond
App 20140353776 - Liang; Kai-Chih ;   et al.
2014-12-04
MEMS vacuum level monitor in sealed package
Grant 8,887,573 - Chen , et al. November 18, 2
2014-11-18
MEMS Switch with Reduced Dielectric Charging Effect
App 20140331484 - Chu; Chia-Hua ;   et al.
2014-11-13
MEMS Device with Release Aperture
App 20140287548 - Lin; Chung-Hsien ;   et al.
2014-09-25
MEMS switch with reduced dielectric charging effect
Grant 8,797,127 - Chu , et al. August 5, 2
2014-08-05
Dual Layer Microelectromechanical Systems Device and Method of Manufacturing Same
App 20140206123 - Chu; Chia-Hua ;   et al.
2014-07-24
Method of manufacturing a MEMS device
Grant 8,763,220 - Chung , et al. July 1, 2
2014-07-01
Measurement Device
App 20140159709 - LIN; Chung-Hsien ;   et al.
2014-06-12
Measurement Device
App 20140159708 - WANG; Deng-Mao ;   et al.
2014-06-12
MEMS structure with adaptable inter-substrate bond
Grant 8,748,205 - Liang , et al. June 10, 2
2014-06-10
Mems Structure With Adaptable Inter-substrate Bond
App 20140151821 - Liang; Kai-Chih ;   et al.
2014-06-05
Hermetic Wafer Level Packaging
App 20140154841 - Chu; Richard ;   et al.
2014-06-05
MEMS devices and methods for forming the same
Grant 8,729,646 - Chu , et al. May 20, 2
2014-05-20
MEMS device with release aperture
Grant 8,716,051 - Lin , et al. May 6, 2
2014-05-06
Wafer level packaging
Grant 8,709,849 - Cheng , et al. April 29, 2
2014-04-29
Microstructure device with an improved anchor
Grant 8,704,317 - Lin , et al. April 22, 2
2014-04-22
MEMS Devices and Fabrication Methods Thereof
App 20140103461 - Chu; Chia-Hua ;   et al.
2014-04-17
MEMS Devices and Methods for Forming the Same
App 20140042562 - Chu; Chia-Hua ;   et al.
2014-02-13
Hermetic wafer level packaging
Grant 8,648,468 - Chu , et al. February 11, 2
2014-02-11
MEMS device etch stop
Grant 8,633,554 - Chu , et al. January 21, 2
2014-01-21
Wafer level packaging
Grant 8,629,517 - Cheng , et al. January 14, 2
2014-01-14
MEMS Devices and Fabrication Methods Thereof
App 20130334620 - Chu; Chia-Hua ;   et al.
2013-12-19
Multiple Bonding In Wafer Level Packaging
App 20130285170 - Lin; Chung-Hsien ;   et al.
2013-10-31
Temperature stabilitized MEMS
Grant 8,569,808 - Chen , et al. October 29, 2
2013-10-29
Temperature Stabilitized Mems
App 20130264610 - CHEN; Tung-Tsun ;   et al.
2013-10-10
Microstructure with an enhanced anchor
Grant 8,551,798 - Lin , et al. October 8, 2
2013-10-08
MEMS device having chip scale packaging
Grant 8,525,278 - Chu , et al. September 3, 2
2013-09-03
Mems Vacuum Level Monitor In Sealed Package
App 20130213139 - CHEN; Tung-Tsun ;   et al.
2013-08-22
Multiple bonding in wafer level packaging
Grant 8,486,744 - Lin , et al. July 16, 2
2013-07-16
MEMS Devices and Methods of Forming Same
App 20130168852 - Liang; Kai-Chih ;   et al.
2013-07-04
Mems Kinetic Energy Conversion
App 20130147317 - Chung; Tien-Kan ;   et al.
2013-06-13
Mems Device Etch Stop
App 20130140653 - Chu; Chia-Hua ;   et al.
2013-06-06
Overlay mark enhancement feature
Grant 8,455,982 - Chen , et al. June 4, 2
2013-06-04
Microstructure Device with an Improved Anchor
App 20130126989 - Lin; Chung-Hsien ;   et al.
2013-05-23
Wafer Level Packaging
App 20130099332 - Cheng; Chun-Wen ;   et al.
2013-04-25
Wafer Level Packaging
App 20130102101 - Cheng; Chun-Wen ;   et al.
2013-04-25
MEMS kinetic energy conversion
Grant 8,410,665 - Chung , et al. April 2, 2
2013-04-02
Mems Device Having Chip Scale Packaging
App 20130043547 - Chu; Chia-Hua ;   et al.
2013-02-21
MEMS device etch stop
Grant 8,368,152 - Chu , et al. February 5, 2
2013-02-05
Microstructure device with an improved anchor
Grant 8,343,789 - Lin , et al. January 1, 2
2013-01-01
Semiconductor Devices With Moving Members and Methods for Making the Same
App 20120313235 - Chu; Chia-Hua ;   et al.
2012-12-13
Wafer level packaging
Grant 8,330,559 - Cheng , et al. December 11, 2
2012-12-11
Mems Device Etch Stop
App 20120261830 - Chu; Chia-Hua ;   et al.
2012-10-18
Package systems having a conductive element through a substrate thereof and manufacturing methods of the same
Grant 8,232,614 - Chu , et al. July 31, 2
2012-07-31
Frequency Generator
App 20120187983 - LIN; Chung-Hsien ;   et al.
2012-07-26
Mems Kinetic Energy Conversion
App 20120161582 - CHUNG; TIEN-KAN ;   et al.
2012-06-28
Overlay Mark Enhancement Feature
App 20120153441 - Chen; Meng-Wei ;   et al.
2012-06-21
Mems Switch With Reduced Dielectric Charging Effect
App 20120125747 - Chu; Chia-Hua ;   et al.
2012-05-24
Mems Device With Release Aperture
App 20120098074 - Lin; Chung-Hsien ;   et al.
2012-04-26
Overlay mark enhancement feature
Grant 8,148,232 - Chen , et al. April 3, 2
2012-04-03
Multiple Bonding In Wafer Level Packaging
App 20120074590 - Lin; Chung-Hsien ;   et al.
2012-03-29
Microstructure With An Enhanced Anchor
App 20120068276 - Lin; Chung-Hsien ;   et al.
2012-03-22
Wafer Level Packaging
App 20120061776 - Cheng; Chun-Wen ;   et al.
2012-03-15
Microstructure Device With An Improved Anchor
App 20120043626 - Lin; Chung-Hsien ;   et al.
2012-02-23
Overlay Mark Enhancement Feature
App 20120038021 - Chen; Meng-Wei ;   et al.
2012-02-16
Hermetic Wafer Level Packaging
App 20120025389 - Chu; Richard ;   et al.
2012-02-02
Optical recording apparatus and method for optimizing recording signal
Grant 7,986,600 - Wang , et al. July 26, 2
2011-07-26
Double Mold Locking Apparatus
App 20110059200 - Lin; Jung-Teng ;   et al.
2011-03-10
Prestress-adjustable piezoelectric gripping device
Grant 7,855,491 - Hsueh , et al. December 21, 2
2010-12-21
Prestress-adjustable Piezoelectric Gripping Device
App 20100109477 - Hsueh; Po-Wen ;   et al.
2010-05-06
Computer mouse with less friction
App 20100060580 - Lin; Chung-Hsien
2010-03-11
Method Of Reducing Offset Voltage In A Microelectromechanical Device
App 20100039424 - Pao; Feng Ming ;   et al.
2010-02-18
Computer System With Processor Expansion Device
App 20080320196 - Lin; Chung-Hsien
2008-12-25
Optical Recording Apparatus And Method For Optimizing Recording Signal
App 20080298198 - WANG; CHUN-CHIEH ;   et al.
2008-12-04
Projectile Flier
App 20070281576 - Wu; Pao-Chang ;   et al.
2007-12-06
Film bulk acoustic device with integrated tunable and trimmable device
Grant 6,924,583 - Lin , et al. August 2, 2
2005-08-02
Apparatus for controlling rotational speed of motor
Grant 6,810,202 - Hsu , et al. October 26, 2
2004-10-26
System for controlling rotational speed of fan according to reference clock frequency
Grant 6,737,860 - Hsu , et al. May 18, 2
2004-05-18
Method for inductor trimming of the high frequency integrated passive devices
App 20040063039 - Liang, Shang-Yu ;   et al.
2004-04-01
Apparatus for controlling rotational speed of motor
App 20040052510 - Hsu, Chia-Chang ;   et al.
2004-03-18
Thin film acoustic wave device and the manufacturing method thereof
App 20040007940 - Tsai, Shu-Hui ;   et al.
2004-01-15
Motor monitoring system
App 20030227272 - Hsu, Chia-Chang ;   et al.
2003-12-11
Film bulk acoustic device with integrated tunable and trimmable device
App 20030205948 - Lin, Chung-Hsien ;   et al.
2003-11-06
Power protection
App 20030174453 - Hsu, Chia-Chang ;   et al.
2003-09-18
System for controlling rotational speed of fan
App 20030020460 - Hsu, Chia-Chang ;   et al.
2003-01-30
Method for manufacturing a film bulk acoustic wave filter
App 20030000058 - Tsai, Shu-Hui ;   et al.
2003-01-02
Manufacturing method for a high quality film bulk acoustic wave device
App 20020189062 - Lin, Chung-Hsien ;   et al.
2002-12-19
Micro-electro-mechanical high frequency switch and method for manufacturing the same
App 20020124385 - Tsai, Shu-Hui ;   et al.
2002-09-12

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