Lin; Chun-Tang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chun-Tang.The latest application filed is for "chip matching system and method thereof".

Company Profile

5.33.47

Lin; Chun-Tang - Taichung TW
Lin; Chun-Tang - Taichung City TW
Lin; Chun-Tang - Taichung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip Matching System And Method Thereof App 20220068680 - Yen; Wu-Hung ; et al.	2022-03-03
Electronic package and substrate structure having chamfers Grant 11,227,842 - Wang , et al. January 18, 2	2022-01-18
Method For Fabricating Substrate Structure App 20210296261 - Wang; Po-Hao ; et al.	2021-09-23
Substrate structure, electronic package having the same, and method for fabricating the same Grant 11,056,442 - Wang , et al. July 6, 2	2021-07-06
Electronic Package And Substrate Structure Having Chamfers App 20200350261 - Wang; Po-Hao ; et al.	2020-11-05
Substrate structure having chamfers Grant 10,763,223 - Wang , et al. Sep	2020-09-01
Method Of Manufacturing Substrate Structure With Filling Material Formed In Concave Portion App 20200091059 - Lin; Chang-Fu ; et al.	2020-03-19
Substrate structure with filling material formed in concave portion Grant 10,522,453 - Lin , et al. Dec	2019-12-31
Fabrication method of electronic package Grant 10,403,567 - Chen , et al. Sep	2019-09-03
Substrate Structure, Electronic Package Having The Same, And Method For Fabricating The Same App 20180254250 - Wang; Po-Hao ; et al.	2018-09-06
Fabrication Method Of Electronic Package App 20180130727 - Chen; Yan-Heng ; et al.	2018-05-10
Electronic package and fabrication method thereof Grant 9,899,303 - Chen , et al. February 20, 2	2018-02-20
Package structure and fabrication method thereof Grant 9,842,758 - Chen , et al. December 12, 2	2017-12-12
Electronic Package And Substrate Structure App 20170309579 - Wang; Po-Hao ; et al.	2017-10-26
Semiconductor package and fabrication method thereof Grant 9,754,898 - Chan , et al. September 5, 2	2017-09-05
Substrate Structure And Method Of Manufacturing The Same App 20170207161 - Lin; Chang-Fu ; et al.	2017-07-20
Method Of Fabricating Semiconductor Package App 20170148761 - Ma; Guang-Hwa ; et al.	2017-05-25
Fabrication method of semiconductor package Grant 9,627,226 - Lin , et al. April 18, 2	2017-04-18
Package structure and fabrication method thereof Grant 9,607,974 - Lin , et al. March 28, 2	2017-03-28
Conductive via structure and fabrication method thereof Grant 9,607,941 - Chen , et al. March 28, 2	2017-03-28
Method of fabricating semiconductor package having an interposer structure Grant 9,548,220 - Chuang , et al. January 17, 2	2017-01-17
Package structure and fabrication method thereof Grant 9,515,040 - Chen , et al. December 6, 2	2016-12-06
Method of fabricating semiconductor package Grant 9,418,874 - Chen , et al. August 16, 2	2016-08-16
Fabrication method of semiconductor package having embedded semiconductor elements Grant 9,397,081 - Chen , et al. July 19, 2	2016-07-19
Fabrication Method Of Semiconductor Package App 20160204093 - Lin; Chun-Tang ; et al.	2016-07-14
Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers Grant 9,349,705 - Chan , et al. May 24, 2	2016-05-24
Package Structure And Fabrication Method Thereof App 20160141227 - Lin; Chun-Tang ; et al.	2016-05-19
Fabrication Method Of Semiconductor Package Having Embedded Semiconductor Elements App 20160141281 - Chen; Yan-Heng ; et al.	2016-05-19
Fabrication method of semiconductor package Grant 9,337,061 - Chen , et al. May 10, 2	2016-05-10
Package Structure And Fabrication Method Thereof App 20160126126 - Chen; Yan-Heng ; et al.	2016-05-05
Method Of Fabricating Semiconductor Package Having An Interposer Structure App 20160118271 - Chuang; Kuan-Wei ; et al.	2016-04-28
Semiconductor package and fabrication method thereof Grant 9,324,582 - Lin , et al. April 26, 2	2016-04-26
Electronic Package And Fabrication Method Thereof App 20160111359 - Chen; Yan-Heng ; et al.	2016-04-21
Semiconductor Package, Carrier Structure And Fabrication Method Thereof App 20160079110 - Chuang; Kuan-Wei ; et al.	2016-03-17
Fabrication method of semiconductor package Grant 9,269,693 - Chan , et al. February 23, 2	2016-02-23
Semiconductor package, and interposer structure of the semiconductor package Grant 9,257,381 - Chuang , et al. February 9, 2	2016-02-09
Package Structure And Fabrication Method Thereof App 20160013146 - Chen; Yan-Heng ; et al.	2016-01-14
Method for fabricating semiconductor package Grant 9,224,646 - Chen , et al. December 29, 2	2015-12-29
Semiconductor package having embedded semiconductor elements Grant 9,177,859 - Chen , et al. November 3, 2	2015-11-03
Conductive Via Structure And Fabrication Method Thereof App 20150294938 - Chen; Yan-Heng ; et al.	2015-10-15
Method for fabricating semiconductor structure Grant 9,147,668 - Yeh , et al. September 29, 2	2015-09-29
Method Of Fabricating Semiconductor Package App 20150255311 - Chen; Wan-Ting ; et al.	2015-09-10
Semiconductor package and method of fabricating the same Grant 9,087,780 - Chen , et al. July 21, 2	2015-07-21
Semiconductor Package And Fabrication Method Thereof App 20150179597 - Li; Pai-Yuan ; et al.	2015-06-25
Method For Fabricating Semiconductor Package App 20150162301 - Huang; Huei-Nuan ; et al.	2015-06-11
Method Of Fabricating A Semiconductor Structure Having Conductive Bumps With A Plurality Of Metal Layers App 20150155258 - Chan; Chien-Feng ; et al.	2015-06-04
Fabrication Method Of Semiconductor Package App 20150132893 - Chan; Chien-Feng ; et al.	2015-05-14
Method of testing a semiconductor package Grant 8,987,012 - Huang , et al. March 24, 2	2015-03-24
Method For Fabricating Semiconductor Structure App 20150064850 - Yeh; Chi-Tung ; et al.	2015-03-05
Conductive bump structure with a plurality of metal layers Grant 8,952,537 - Chan , et al. February 10, 2	2015-02-10
Semiconductor package and fabrication method thereof Grant 8,952,528 - Chan , et al. February 10, 2	2015-02-10
Semiconductor Package And Method Of Fabricating The Same App 20150035164 - Ma; Guang-Hwa ; et al.	2015-02-05
Semiconductor Package And Method Of Fabricating The Same App 20150035163 - Ma; Guang-Hwa ; et al.	2015-02-05
Semiconductor Package And Method Of Fabricating The Same App 20150014864 - Chen; Wan-Ting ; et al.	2015-01-15
Fabrication method of semiconductor package Grant 8,895,367 - Huang , et al. November 25, 2	2014-11-25
Fabrication Method Of Semiconductor Package App 20140342505 - Chen; Yan-Heng ; et al.	2014-11-20
Method For Fabricating Semiconductor Package App 20140342506 - Chen; Yan-Heng ; et al.	2014-11-20
Semiconductor Package And Fabrication Method Thereof App 20140332976 - Chen; Yan-Heng ; et al.	2014-11-13
Semiconductor Package And Fabrication Method Thereof App 20140264928 - Lin; Chun-Tang ; et al.	2014-09-18
Semiconductor package and fabrication method thereof Grant 8,829,687 - Chan , et al. September 9, 2	2014-09-09
Semiconductor Package And Fabrication Method Thereof App 20140191386 - Lee; Mei-Chin ; et al.	2014-07-10
Semiconductor Package And Fabrication Method Thereof App 20140138791 - Chan; Chien-Feng ; et al.	2014-05-22
Method Of Testing A Semiconductor Package App 20140127838 - Huang; Pin-Cheng ; et al.	2014-05-08
Method Of Fabricating A Semiconductor Package App 20140127864 - Chuang; Kuan-Wei ; et al.	2014-05-08
Semiconductor Package And Fabrication Method Thereof App 20140084455 - Chan; Mu-Hsuan ; et al.	2014-03-27
Semiconductor Package And Fabrication Method Thereof App 20140084484 - Chan; Mu-Hsuan ; et al.	2014-03-27
Semiconductor Package And Fabrication Method Thereof App 20140077387 - Chuang; Kuan-Wei ; et al.	2014-03-20
Semiconductor Package, Method Of Fabricating The Semiconductor Package, And Interposer Structure Of The Semiconductor Package App 20140070424 - Chuang; Kuan-Wei ; et al.	2014-03-13
Semiconductor Package And Method Of Fabricating The Same App 20140027926 - Chen; Wang-Ting ; et al.	2014-01-30
Substrate Structure, Semiconductor Package And Methods Of Fabricating The Same App 20140008819 - Chan; Chien-Feng ; et al.	2014-01-09
Conductive Bump Structure And Method Of Fabricating A Semiconductor Structure App 20140008787 - Chan; Chien-Feng ; et al.	2014-01-09
Fabrication Method Of Semiconductor Package App 20130330883 - Huang; Jung-Pang ; et al.	2013-12-12
Semiconductor device and fabrication method thereof Grant 8,603,911 - Huang , et al. December 10, 2	2013-12-10
Packaging Substrate, Semiconductor Package And Fabrication Method Thereof App 20130256915 - Huang; Huei-Nuan ; et al.	2013-10-03
Semiconductor package and fabrication method thereof Grant 8,519,526 - Huang , et al. August 27, 2	2013-08-27
Semiconductor Device And Fabrication Method Thereof App 20120223425 - Huang; Hui-Min ; et al.	2012-09-06
Semiconductor Package And Fabrication Method Thereof App 20120161301 - Huang; Jung-Pang ; et al.	2012-06-28