Lin; Chiu-Shun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chiu-Shun.The latest application filed is for "metal bump structure for use in driver ic and method for forming the same".

Company Profile

0.7.8

Lin; Chiu-Shun - Tainan TW
Lin; Chiu-Shun - Tainan City TW
Lin; Chiu-Shun - Tainan County N/A TW
Lin; Chiu-Shun - Hsinhua TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal bump structure for use in driver IC and method for forming the same Grant 10,128,348 - Lin November 13, 2	2018-11-13
Metal bump structure for use in driver IC and method for forming the same Grant 9,450,061 - Lin September 20, 2	2016-09-20
Metal Bump Structure For Use In Driver Ic And Method For Forming The Same App 20140327133 - Lin; Chiu-Shun	2014-11-06
Metal Bump Structure For Use In Driver Ic And Method For Forming The Same App 20140327134 - Lin; Chiu-Shun	2014-11-06
Chip structure and chip package structure Grant 8,618,678 - Lin December 31, 2	2013-12-31
COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof Grant 7,906,374 - Lin , et al. March 15, 2	2011-03-15
Semiconductor Device Having At Least One Bump Without Overlapping Specific Pad Or Directly Contacting Specific Pad App 20100264522 - Chen; Chien-Pin ; et al.	2010-10-21
Chip Structure And Chip Package Structure App 20100109157 - Lin; Chiu-Shun	2010-05-06
Cof Packaging Structure, Method Of Manufacturing The Cof Packaging Structure, And Method For Assembling A Driver Ic And The Cof Packaging Structure Thereof App 20090206472 - Lin; Chiu-Shun ; et al.	2009-08-20
Semiconductor Device And Method Of Bump Formation App 20090091028 - Lin; Chiu-Shun ; et al.	2009-04-09
Substrate with slot Grant 7,449,770 - Lin , et al. November 11, 2	2008-11-11
Substrate with slot App 20060175088 - Lin; Chiu-Shun ; et al.	2006-08-10
Bonding pad and chip structure Grant 7,064,449 - Lin , et al. June 20, 2	2006-06-20
Bonding Pad And Chip Structure App 20060006531 - Lin; Chiu-Shun ; et al.	2006-01-12

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