Lin; Chingfu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Chingfu.The latest application filed is for "dual damascene partial gap fill polymer fabrication process".
- Lin; Chingfu - Freemont CA
- Lin; Chingfu - Taipei TW
| Patent | Date |
|---|---|
| Reactive barrier/seed preclean process for damascene process Grant 7,273,808 - Lin September 25, 2 | 2007-09-25 |
| Dual damascene partial gap fill polymer fabrication process Grant 6,930,038 - Lin , et al. August 16, 2 | 2005-08-16 |
| Dual damascene partial gap fill polymer fabrication process App 20050085069 - Lin, Chingfu ; et al. | 2005-04-21 |
| Method for forming an opening in polymer-based dielectric App 20030199132 - Chen, Hsueh-Chung ; et al. | 2003-10-23 |
| Method for forming an opening in polymer-based dielectric App 20020177300 - Chen, Hsueh-Chung ; et al. | 2002-11-28 |
| Fabrication method of shallow trench isolation App 20020137305 - Lin, Bih-Tiao ; et al. | 2002-09-26 |
| Method of forming shallow trench isolation structure Grant 6,261,921 - Yen , et al. July 17, 2 | 2001-07-17 |
| Method For Planarizing Oxide Layer App 20010003066 - LIN, CHINGFU | 2001-06-07 |
| Method of manufacturing DRAM capacitor Grant 6,162,679 - Lin December 19, 2 | 2000-12-19 |
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