LIN; Chih-An

Patent Applications and Registrations

Patent applications and USPTO patent grants for LIN; Chih-An.The latest application filed is for "method for improving substitution rate and/or substitution efficiency of hyaluronan-drug conjugates".

Company Profile

0.6.10

LIN; Chih-An - Taipei City TW
Lin; Chih-An - Chong-He TW
LIN; Chih-An - New Taipei City TW
Lin; Chih-An - New Taipei TW
Lin; Chih-An - Taipei TW
Lin; Chih-An - Chong-He City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Improving Substitution Rate And/or Substitution Efficiency Of Hyaluronan-drug Conjugates App 20210369852 - LEE; Szu-Yuan ; et al.	2021-12-02
Hyaluronan Conjugates And Uses Thereof App 20200376132 - LEE; Szu-Yuan ; et al.	2020-12-03
Double patterning strategy for contact hole and trench in photolithography Grant 9,323,155 - Chen , et al. April 26, 2	2016-04-26
Compositions And Methods For Cmp Of Tungsten Materials App 20150259804 - LIN; Chih-An ; et al.	2015-09-17
Double Patterning Strategy For Contact Hole And Trench In Photolithography App 20140272714 - CHEN; CHUN-KUANG ; et al.	2014-09-18
Keyboard Button Structure App 20140174901 - Lin; Chih-An	2014-06-26
Double patterning strategy for contact hole and trench in photolithography Grant 8,741,552 - Chen , et al. June 3, 2	2014-06-03
Composition And Method For Polishing Aluminum Semiconductor Substrates App 20140103250 - CUI; Ji ; et al.	2014-04-17
Composition and method for polishing aluminum semiconductor substrates Grant 8,623,766 - Cui , et al. January 7, 2	2014-01-07
Composition And Method For Polishing Aluminum Semiconductor Substrates App 20130072021 - Cui; Ji ; et al.	2013-03-21
High etch resistant material for double patterning Grant 8,158,335 - Yeh , et al. April 17, 2	2012-04-17
Double Patterning Strategy For Contact Hole And Trench In Photolithography App 20100310995 - Chen; Chun-Kuang ; et al.	2010-12-09
High Etch Resistant Material For Double Patterning App 20100068656 - Yeh; Hsiao-Wei ; et al.	2010-03-18

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