Lin; Chien-Min

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chien-Min.The latest application filed is for "chip package and manufacturing method thereof".

Company Profile

1.18.17

Lin; Chien-Min - Taoyuan TW
LIN; Chien-Min - Taoyuan City TW
Lin; Chien-Min - Hsinchu TW
Lin; Chien-Min - Hsinchu City TW
Lin; Chien-Min - Taichung TW
Lin; Chien-Min - Taipei TW
Lin; Chien-Min - Taichung County N/A TW
Lin; Chien-Min - Shindian TW
Lin; Chien-Min - Junghe TW
Lin, Chien-Min - Shindian City TW
Lin, Chien-Min - Junghe City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip package and manufacturing method thereof Grant 11,038,077 - Ho , et al. June 15, 2	2021-06-15
Chip Package And Manufacturing Method Thereof App 20190273175 - HO; Yen-Shih ; et al.	2019-09-05
Chip package and manufacturing method thereof Grant 9,947,716 - Ho , et al. April 17, 2	2018-04-17
On-chip electromagnetic bandgap (EBG) structure for noise suppression Grant 9,899,982 - Tsai , et al. February 20, 2	2018-02-20
On-chip Electromagnetic Bandgap (ebg) Structure For Noise Suppression App 20170149404 - Tsai; Ming Hsien ; et al.	2017-05-25
Chip Package And Manufacturing Method Thereof App 20170148844 - HO; Yen-Shih ; et al.	2017-05-25
Semiconductor structure and manufacturing method thereof Grant 9,613,904 - Chen , et al. April 4, 2	2017-04-04
Semiconductor Structure And Manufacturing Method Thereof App 20160329283 - CHEN; Yu-Tung ; et al.	2016-11-10
Chip package and method of manufacturing the same Grant 9,403,672 - Lin August 2, 2	2016-08-02
Chip package and method thereof Grant 9,334,156 - Lin , et al. May 10, 2	2016-05-10
Interposer And Fabrication Method Thereof App 20160050753 - Chan; Wen-Ching ; et al.	2016-02-18
Chip Package And Method Of Manufacturing The Same App 20160039663 - LIN; Chien-Min	2016-02-11
Chip Package And Method Thereof App 20160039662 - LIN; Chien-Min ; et al.	2016-02-11
3D IC configuration with contactless communication Grant 8,921,160 - Yang , et al. December 30, 2	2014-12-30
Crosstalk-free WLCSP structure for high frequency application Grant 8,669,658 - Tsai , et al. March 11, 2	2014-03-11
3d Ic Configuration With Contactless Communication App 20130302942 - YANG; Ping-Lin ; et al.	2013-11-14
3D IC configuration with contactless communication Grant 8,513,795 - Yang , et al. August 20, 2	2013-08-20
3d Ic Configuration With Contactless Communication App 20130161811 - YANG; Ping-Lin ; et al.	2013-06-27
On-chip inductor structure and method for manufacturing the same Grant 8,373,250 - Chao , et al. February 12, 2	2013-02-12
Capacitors with insulating layer having embedded dielectric rods Grant 7,679,926 - Hsu , et al. March 16, 2	2010-03-16
Capacitors with Insulating Layer Having Embedded Dielectric Rods App 20090050356 - Hsu; Kuo-Ching "Steven" ; et al.	2009-02-26
Crosstalk-Free WLCSP Structure for High Frequency Application App 20090026608 - Tsai; Mon-Chin ; et al.	2009-01-29
Portable electronic system equipped with a spare battery device Grant 7,136,682 - Lin November 14, 2	2006-11-14
Recharge apparatus for holding the rechargeable device Grant 6,816,740 - Lin November 9, 2	2004-11-09
Operating button with multiple functions for a handheld product Grant 6,622,920 - Ho , et al. September 23, 2	2003-09-23
Portable electronic system equipped with a spare battery device App 20030069050 - Lin, Chien-Min	2003-04-10
Stylus for personal digital assistant App 20020140684 - Lin, Chien-Min ; et al.	2002-10-03
Mechanism for ejecting stylus Grant 6,410,865 - Liu , et al. June 25, 2	2002-06-25
Mechanism For Ejecting Stylus App 20020060098 - Liu, Ta-Wei ; et al.	2002-05-23
Operating button with multiple functions equipped in the handheld product App 20020056617 - Ho, San-Chi ; et al.	2002-05-16
Recharge apparatus for holding the rechargeable device App 20010029195 - Lin, Chien-Min	2001-10-11

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