Lin; Chien-Li
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Chien-Li.The latest application filed is for "copper plating method".
- Lin; Chien-Li - Fremont CA
| Patent | Date |
|---|---|
| Copper plating method Grant 9,797,047 - Chen , et al. October 24, 2 | 2017-10-24 |
| Copper Plating Method App 20150345030 - Chen; Chao-Peng ; et al. | 2015-12-03 |
| Copper plating method Grant 9,103,012 - Chen , et al. August 11, 2 | 2015-08-11 |
| Method of reducing main pole corrosion during aluminum oxide etch Grant 8,603,348 - Cheng , et al. December 10, 2 | 2013-12-10 |
| Method to reduce void formation during trapezoidal write pole plating in perpendicular recording Grant 8,273,233 - Chen , et al. September 25, 2 | 2012-09-25 |
| Copper plating method App 20120205344 - Chen; Chao-Peng ; et al. | 2012-08-16 |
| Method of reducing main pole corrosion during aluminum oxide etch App 20120181181 - Cheng; Chao-Peng ; et al. | 2012-07-19 |
| Rejuvenation method for ruthenium plating seed App 20110094888 - Chen; Chao-Peng ; et al. | 2011-04-28 |
| Novel method to reduce void formation during trapezoidal write pole plating in perpendicular recording App 20110011744 - Chen; Chao-Peng ; et al. | 2011-01-20 |
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