loadpatents
Patent applications and USPTO patent grants for Lin; Chia-Min.The latest application filed is for "three-dimensional integrated circuit structures and methods of forming the same".
Patent | Date |
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Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device Grant 11,446,851 - Weng , et al. September 20, 2 | 2022-09-20 |
Three-dimensional Integrated Circuit Structures And Methods Of Forming The Same App 20220238407 - Lin; Chia-Min ;   et al. | 2022-07-28 |
Three-dimensional integrated circuit structures and methods of forming the same Grant 11,309,226 - Lin , et al. April 19, 2 | 2022-04-19 |
Semiconductor package and method of forming the same Grant 11,075,131 - Tsai , et al. July 27, 2 | 2021-07-27 |
Three-dimensional Integrated Circuit Structures And Methods Of Forming The Same App 20210193544 - Lin; Chia-Min ;   et al. | 2021-06-24 |
Semiconductor Package And Method Of Forming The Same App 20210057298 - Tsai; Yi-Da ;   et al. | 2021-02-25 |
Molding Apparatus, Manufacturing Method Of Molded Semiconductor Device And Molded Semiconductor Device App 20200338796 - Weng; Sheng-Feng ;   et al. | 2020-10-29 |
Pressure sensor Grant 10,816,422 - Lin , et al. October 27, 2 | 2020-10-27 |
Method of placing macro cells and a simulated-evolution-based macro refinement method Grant 10,769,341 - Lin , et al. Sep | 2020-09-08 |
Method of macro placement and a non-transitory computer readable medium thereof Grant 10,372,861 - Lin , et al. | 2019-08-06 |
Pressure sensor Grant 10,254,185 - Schumm , et al. | 2019-04-09 |
Pressure Sensor App 20180202882 - Schumm; Johannes ;   et al. | 2018-07-19 |
Method Of Macro Placement And A Non-transitory Computer Readable Medium Thereof App 20180150583 - Lin; Chia-Min ;   et al. | 2018-05-31 |
Pressure sensor Grant 9,958,349 - Schumm , et al. May 1, 2 | 2018-05-01 |
Pressure Sensor App 20170167933 - LIN; Chung-Hsien ;   et al. | 2017-06-15 |
Pressure sensor with deformable membrane and method of manufacture Grant 9,581,512 - Lin , et al. February 28, 2 | 2017-02-28 |
Pressure Sensor App 20160290883 - Schumm; Johannes ;   et al. | 2016-10-06 |
Multi-point temperature sensing method for integrated circuit chip and system of the same Grant 9,448,122 - Chang , et al. September 20, 2 | 2016-09-20 |
Pressure Sensor App 20150122041 - LIN; Chung-Hsien ;   et al. | 2015-05-07 |
Pressure Sensor App 20150122042 - LIN; Chung-Hsien ;   et al. | 2015-05-07 |
Fixed-outline floorplanning approach for mixed-size modules Grant 8,966,428 - Lin , et al. February 24, 2 | 2015-02-24 |
Fixed-outline Floorplanning Approach For Mixed-size Modules App 20150012901 - LIN; CHIA-MIN ;   et al. | 2015-01-08 |
Multi-point Temperature Sensing Method For Integrated Circuit Chip And System Of The Same App 20140341258 - CHANG; SOON-JYH ;   et al. | 2014-11-20 |
System And Method For Chemical-mechanical Planarization Of A Metal Layer App 20140091477 - Wu; Yung-Hsu ;   et al. | 2014-04-03 |
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