Lin; Chia-Min

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chia-Min.The latest application filed is for "three-dimensional integrated circuit structures and methods of forming the same".

Company Profile

3.11.14

Lin; Chia-Min - Hsinchu TW
Lin; Chia Min - Hsinchu County TW
Lin; Chia-Min - Tainan TW
Lin; Chia Min - Hsinchu County 308 TW
Lin; Chia-Min - Tainan City TW
Lin; Chia-Min - Baoshan Township TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device Grant 11,446,851 - Weng , et al. September 20, 2	2022-09-20
Three-dimensional Integrated Circuit Structures And Methods Of Forming The Same App 20220238407 - Lin; Chia-Min ; et al.	2022-07-28
Three-dimensional integrated circuit structures and methods of forming the same Grant 11,309,226 - Lin , et al. April 19, 2	2022-04-19
Semiconductor package and method of forming the same Grant 11,075,131 - Tsai , et al. July 27, 2	2021-07-27
Three-dimensional Integrated Circuit Structures And Methods Of Forming The Same App 20210193544 - Lin; Chia-Min ; et al.	2021-06-24
Semiconductor Package And Method Of Forming The Same App 20210057298 - Tsai; Yi-Da ; et al.	2021-02-25
Molding Apparatus, Manufacturing Method Of Molded Semiconductor Device And Molded Semiconductor Device App 20200338796 - Weng; Sheng-Feng ; et al.	2020-10-29
Pressure sensor Grant 10,816,422 - Lin , et al. October 27, 2	2020-10-27
Method of placing macro cells and a simulated-evolution-based macro refinement method Grant 10,769,341 - Lin , et al. Sep	2020-09-08
Method of macro placement and a non-transitory computer readable medium thereof Grant 10,372,861 - Lin , et al.	2019-08-06
Pressure sensor Grant 10,254,185 - Schumm , et al.	2019-04-09
Pressure Sensor App 20180202882 - Schumm; Johannes ; et al.	2018-07-19
Method Of Macro Placement And A Non-transitory Computer Readable Medium Thereof App 20180150583 - Lin; Chia-Min ; et al.	2018-05-31
Pressure sensor Grant 9,958,349 - Schumm , et al. May 1, 2	2018-05-01
Pressure Sensor App 20170167933 - LIN; Chung-Hsien ; et al.	2017-06-15
Pressure sensor with deformable membrane and method of manufacture Grant 9,581,512 - Lin , et al. February 28, 2	2017-02-28
Pressure Sensor App 20160290883 - Schumm; Johannes ; et al.	2016-10-06
Multi-point temperature sensing method for integrated circuit chip and system of the same Grant 9,448,122 - Chang , et al. September 20, 2	2016-09-20
Pressure Sensor App 20150122041 - LIN; Chung-Hsien ; et al.	2015-05-07
Pressure Sensor App 20150122042 - LIN; Chung-Hsien ; et al.	2015-05-07
Fixed-outline floorplanning approach for mixed-size modules Grant 8,966,428 - Lin , et al. February 24, 2	2015-02-24
Fixed-outline Floorplanning Approach For Mixed-size Modules App 20150012901 - LIN; CHIA-MIN ; et al.	2015-01-08
Multi-point Temperature Sensing Method For Integrated Circuit Chip And System Of The Same App 20140341258 - CHANG; SOON-JYH ; et al.	2014-11-20
System And Method For Chemical-mechanical Planarization Of A Metal Layer App 20140091477 - Wu; Yung-Hsu ; et al.	2014-04-03

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