Lin; Chia-Fu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chia-Fu.The latest application filed is for "fluxless bumping process".

Company Profile

0.18.14

Lin; Chia-Fu - Hsin-Chu N/A TW
Lin; Chia Fu - Hsinchu TW
Lin, Chia-Fu - Hsin-Chu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method to improve bump reliability for flip chip device Grant 8,497,584 - Chen , et al. July 30, 2	2013-07-30
Fluxless bumping process Grant 7,906,425 - Su , et al. March 15, 2	2011-03-15
Application of impressed-current cathodic protection to prevent metal corrosion and oxidation Grant 7,468,321 - Ching , et al. December 23, 2	2008-12-23
Application of impressed-current cathodic protection to prevent metal corrosion and oxidation Grant 7,276,454 - Ching , et al. October 2, 2	2007-10-02
Fluxless bumping process App 20070028445 - Su; Chao-Yuan ; et al.	2007-02-08
Fluxless bumping process Grant 7,134,199 - Su , et al. November 14, 2	2006-11-14
Application Of Impressed-current Cathodic Protection To Prevent Metal Corrosion And Oxidation App 20060194407 - Ching; Kai-Ming ; et al.	2006-08-31
Method of forming a solder ball using a thermally stable resinous protective layer Grant 6,974,659 - Su , et al. December 13, 2	2005-12-13
Flush system for dry film photoresist remover Grant 6,918,397 - Lin , et al. July 19, 2	2005-07-19
Fluxless bumping process using ions Grant 6,805,279 - Lee , et al. October 19, 2	2004-10-19
Stencil design for solder paste printing Grant 6,802,250 - Su , et al. October 12, 2	2004-10-12
Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication Grant 6,797,075 - Ching , et al. September 28, 2	2004-09-28
Novel method to improve bump reliability for flip chip device App 20040180296 - Chen, Yen-Ming ; et al.	2004-09-16
Microelectronic fabrication with corrosion inhibited bond pad Grant 6,765,277 - Chen , et al. July 20, 2	2004-07-20
Method for improving bump reliability for flip chip devices Grant 6,756,294 - Chen , et al. June 29, 2	2004-06-29
Method of making a wafer level chip scale package Grant 6,743,660 - Lee , et al. June 1, 2	2004-06-01
Application of impressed-current cathodic protection to prevent metal corrosion and oxidation App 20040087175 - Ching, Kai-Ming ; et al.	2004-05-06
DFR laminating and film removing system Grant 6,715,524 - Chen , et al. April 6, 2	2004-04-06
Bump reflow method by inert gas plasma Grant 6,712,260 - Kuo , et al. March 30, 2	2004-03-30
Fluxless bumping process using ions App 20040000580 - Lee, Hsin-Hui ; et al.	2004-01-01
Fluxless bumping process App 20030229986 - Su, Chao-Yuan ; et al.	2003-12-18
DFR laminating and film removing system App 20030226638 - Chen, Li-Chih ; et al.	2003-12-11
Stencil design for solder paste printing App 20030213384 - Su, Chao-Yuan ; et al.	2003-11-20
Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication App 20030209260 - Ching, Kai-Ming ; et al.	2003-11-13
Flush system for dry film photoresist remover App 20030196684 - Lin, Ta-Min ; et al.	2003-10-23
Method of measuring photoresist and bump misalignment Grant 6,636,313 - Chen , et al. October 21, 2	2003-10-21
Method to improve reliability for flip-chip device for limiting pad design Grant 6,602,775 - Chen , et al. August 5, 2	2003-08-05
Microelectronic fabrication with corrosion inhibited bond pad App 20030132497 - Chen, Yen-Ming ; et al.	2003-07-17
Method of measuring photoresist and bump misalignment App 20030133115 - Chen, Yen-Ming ; et al.	2003-07-17
Method of forming a solder ball using a thermally stable resinous protective layer App 20030134233 - Su, Chao-Yuan ; et al.	2003-07-17
Method of making a wafer level chip scale package App 20030134496 - Lee, Hsin-Hui ; et al.	2003-07-17

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.