Lin; Chia-Fang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chia-Fang.The latest application filed is for "interconnect structure, interconnect layout structure, and manufacturing method thereof".

Company Profile

1.6.6

Lin; Chia-Fang - Hsinchu TW
Lin; Chia-Fang - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnect structure, interconnect layout structure, and manufacturing method thereof Grant 10,847,412 - Chen , et al. November 24, 2	2020-11-24
Interconnect structure Grant 10,658,232 - Chen , et al.	2020-05-19
Interconnect Structure, Interconnect Layout Structure, And Manufacturing Method Thereof App 20190214292 - Chen; Tong-Yu ; et al.	2019-07-11
Interconnect structure, interconnect layout structure, and manufacturing method thereof Grant 10,276,429 - Chen , et al.	2019-04-30
Interconnect Structure App 20180366364 - Chen; Tong-Yu ; et al.	2018-12-20
Interconnect Structure, Interconnect Layout Structure, And Manufacturing Method Thereof App 20170194191 - Chen; Tong-Yu ; et al.	2017-07-06
Semiconductor device having through silicon trench shielding structure surrounding RF circuit Grant 9,123,730 - Kuo , et al. September 1, 2	2015-09-01
Semiconductor Device Having Shielding Structure App 20150014828 - Kuo; Chien-Li ; et al.	2015-01-15
TSV structure and method for forming the same Grant 8,519,515 - Kuo , et al. August 27, 2	2013-08-27
Tsv Structure And Method For Forming The Same App 20120261826 - Kuo; Chien-Li ; et al.	2012-10-18
Integrated Lithography Equipment And Lithography Process Thereof App 20110081617 - Lin; Chia-Fang ; et al.	2011-04-07

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