loadpatents
Patent applications and USPTO patent grants for Lin; Chen-Shen.The latest application filed is for "metallic article".
Patent | Date |
---|---|
Manufacturing method for metallic housing of electronic device Grant 10,124,405 - Wang , et al. November 13, 2 | 2018-11-13 |
Manufacturing method for metallic housing of electronic device Grant 10,040,120 - Wang , et al. August 7, 2 | 2018-08-07 |
Metallic Article App 20180141114 - YANG; JUN-JUN ;   et al. | 2018-05-24 |
Metallic article and method for manufacturing metallic article Grant 9,901,979 - Yang , et al. February 27, 2 | 2018-02-27 |
Folding Stool App 20160309903 - HUANG; BO ;   et al. | 2016-10-27 |
Manufacturing Method For Metallic Housing Of Electronic Device App 20160263650 - WANG; CAI-HUA ;   et al. | 2016-09-15 |
Manufacturing Method For Metallic Housing Of Electronic Device App 20160207104 - WANG; CAI-HUA ;   et al. | 2016-07-21 |
Metallic housing of electronic device and manufacturing method thereof Grant 9,370,823 - Wang , et al. June 21, 2 | 2016-06-21 |
Metallic housing of electronic device and manufacturing method thereof Grant 9,358,606 - Wang , et al. June 7, 2 | 2016-06-07 |
Metallic Article And Method For Manufacturing Metallic Article App 20150306661 - YANG; JUN-JUN ;   et al. | 2015-10-29 |
Metallic Housing Of Electronic Device And Manufacturing Method Thereof App 20150021064 - WANG; CAI-HUA ;   et al. | 2015-01-22 |
Metallic Housing Of Electronic Device And Manufacturing Method Thereof App 20150021065 - WANG; CAI-HUA ;   et al. | 2015-01-22 |
Mold for manufacturing heat dissipation apparatus Grant 7,740,050 - Cheng , et al. June 22, 2 | 2010-06-22 |
Heat dissipation apparatus Grant 7,537,049 - Cheng , et al. May 26, 2 | 2009-05-26 |
Heat dissipation assembly Grant 7,460,370 - Cheng , et al. December 2, 2 | 2008-12-02 |
Mold And Method For Manufacturing Heat Dissipation Apparatus App 20080156452 - CHENG; NIEN-TIEN ;   et al. | 2008-07-03 |
Heat dissipation assembly App 20070279866 - Cheng; Nien-Tien ;   et al. | 2007-12-06 |
Heat Dissipation Apparatus App 20070251676 - CHENG; NIEN-TIEN ;   et al. | 2007-11-01 |
Heat Dissipation Apparatus App 20070195500 - CHENG; NIEN-TIEN ;   et al. | 2007-08-23 |
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