loadpatents
name:-0.017096042633057
name:-0.014334917068481
name:-0.0013120174407959
Lin; Chen-Shen Patent Filings

Lin; Chen-Shen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chen-Shen.The latest application filed is for "metallic article".

Company Profile
0.8.11
  • Lin; Chen-Shen - New Taipei TW
  • Lin; Chen-Shen - Taipei Hsien TW
  • Lin; Chen-Shen - Tu-Cheng TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Manufacturing method for metallic housing of electronic device
Grant 10,124,405 - Wang , et al. November 13, 2
2018-11-13
Manufacturing method for metallic housing of electronic device
Grant 10,040,120 - Wang , et al. August 7, 2
2018-08-07
Metallic Article
App 20180141114 - YANG; JUN-JUN ;   et al.
2018-05-24
Metallic article and method for manufacturing metallic article
Grant 9,901,979 - Yang , et al. February 27, 2
2018-02-27
Folding Stool
App 20160309903 - HUANG; BO ;   et al.
2016-10-27
Manufacturing Method For Metallic Housing Of Electronic Device
App 20160263650 - WANG; CAI-HUA ;   et al.
2016-09-15
Manufacturing Method For Metallic Housing Of Electronic Device
App 20160207104 - WANG; CAI-HUA ;   et al.
2016-07-21
Metallic housing of electronic device and manufacturing method thereof
Grant 9,370,823 - Wang , et al. June 21, 2
2016-06-21
Metallic housing of electronic device and manufacturing method thereof
Grant 9,358,606 - Wang , et al. June 7, 2
2016-06-07
Metallic Article And Method For Manufacturing Metallic Article
App 20150306661 - YANG; JUN-JUN ;   et al.
2015-10-29
Metallic Housing Of Electronic Device And Manufacturing Method Thereof
App 20150021064 - WANG; CAI-HUA ;   et al.
2015-01-22
Metallic Housing Of Electronic Device And Manufacturing Method Thereof
App 20150021065 - WANG; CAI-HUA ;   et al.
2015-01-22
Mold for manufacturing heat dissipation apparatus
Grant 7,740,050 - Cheng , et al. June 22, 2
2010-06-22
Heat dissipation apparatus
Grant 7,537,049 - Cheng , et al. May 26, 2
2009-05-26
Heat dissipation assembly
Grant 7,460,370 - Cheng , et al. December 2, 2
2008-12-02
Mold And Method For Manufacturing Heat Dissipation Apparatus
App 20080156452 - CHENG; NIEN-TIEN ;   et al.
2008-07-03
Heat dissipation assembly
App 20070279866 - Cheng; Nien-Tien ;   et al.
2007-12-06
Heat Dissipation Apparatus
App 20070251676 - CHENG; NIEN-TIEN ;   et al.
2007-11-01
Heat Dissipation Apparatus
App 20070195500 - CHENG; NIEN-TIEN ;   et al.
2007-08-23

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