Lin; Chen-Hua

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chen-Hua.The latest application filed is for "semiconductor structure and manufacturing method thereof".

Company Profile

14.24.36

Lin; Chen-Hua - Yunlin County TW
LIN; Chen-Hua - Douliu City TW
Lin; Chen-Hua - Douliu TW
Lin; Chen-Hua - Taoyuan County TW
Lin; Chen-Hua - New Taipei City TW
Lin; Chen-Hua - Yunlin Hsien TW
Lin, Chen-Hua - Douliou City TW
Lin; Chen-Hua - Tou Lin TW
Lin, Chen-Hua - Tou Lin City TW
Lin; Chen-hua - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package Grant 11,450,626 - Chen , et al. September 20, 2	2022-09-20
Semiconductor Structure And Manufacturing Method Thereof App 20220271024 - LU; HSIANG-TAI ; et al.	2022-08-25
Inductive Device App 20220231116 - CHOU; Wei-Yu ; et al.	2022-07-21
Dual Micro-electro Mechanical System And Manufacturing Method Thereof App 20220194783 - CHEN; Yang-Che ; et al.	2022-06-23
Semiconductor structure and manufacturing method thereof Grant 11,335,672 - Lu , et al. May 17, 2	2022-05-17
Inductive device Grant 11,322,576 - Chou , et al. May 3, 2	2022-05-03
Dual micro-electro mechanical system and manufacturing method thereof Grant 11,274,037 - Chen , et al. March 15, 2	2022-03-15
Semiconductor Package App 20220068845 - Chen; Yang-Che ; et al.	2022-03-03
Inductive Device App 20220037458 - CHOU; Wei-Yu ; et al.	2022-02-03
Method For Detecting Defects In Semiconductor Device App 20210366794 - CHEN; YANG-CHE ; et al.	2021-11-25
Semiconductor device having probe pads and seal ring Grant 11,088,037 - Chen , et al. August 10, 2	2021-08-10
Semiconductor Package And Method For Making The Same App 20210202329 - CHEN; Yang-Che ; et al.	2021-07-01
Dual Micro-electro Mechanical System And Manufacturing Method Thereof App 20210130167 - CHEN; Yang-Che ; et al.	2021-05-06
Semiconductor package and method for manufacturing the same Grant 10,937,772 - Chen , et al. March 2, 2	2021-03-02
Method for manufacturing semiconductor and structure thereof Grant 10,937,858 - Chen , et al. March 2, 2	2021-03-02
Semiconductor Package Structure And Method For Manufacturing The Same App 20200402892 - CHEN; YANG-CHE ; et al.	2020-12-24
Semiconductor Package And Method For Manufacturing The Same App 20200381409 - CHEN; YANG-CHE ; et al.	2020-12-03
Semiconductor Structure And Manufacturing Method Thereof App 20200357785 - LU; HSIANG-TAI ; et al.	2020-11-12
Semiconductor structure and manufacturing method thereof Grant 10,741,537 - Lu , et al. A	2020-08-11
Method For Manufacturing Semiconductor And Structure Thereof App 20200251552 - Kind Code	2020-08-06
Method of detecting delamination in an integrated circuit package structure Grant 10,699,977 - Chen , et al.	2020-06-30
Semiconductor Device With Enhanced Thermal Dissipation And Method For Making The Same App 20200135613 - CHEN; Yang-Che ; et al.	2020-04-30
Method for manufacturing semiconductor and structure thereof Grant 10,629,673 - Chen , et al.	2020-04-21
Method For Manufacturing Semiconductor And Structure Thereof App 20200098851 - CHEN; YANG-CHE ; et al.	2020-03-26
Semiconductor Device And Manufacturing Method Of The Same App 20200075435 - CHEN; YANG-CHE ; et al.	2020-03-05
Method Of Detecting Delamination In An Integrated Circuit Package Structure App 20190333829 - CHEN; Yang-Che ; et al.	2019-10-31
Integrated circuit package structure and testing method using the same Grant 10,347,548 - Chen , et al. July 9, 2	2019-07-09
Package structure and methods of forming same Grant 10,269,586 - Chou , et al.	2019-04-23
Semiconductor Structure And Manufacturing Method Thereof App 20180204828 - LU; HSIANG-TAI ; et al.	2018-07-19
Integrated Circuit Package Structure And Testing Method Using The Same App 20180156865 - Chen; Yang-Che ; et al.	2018-06-07
Mobile device and method for managing background data transmission thereof Grant 9,801,195 - Lin October 24, 2	2017-10-24
Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages Grant 9,786,567 - Wu , et al. October 10, 2	2017-10-10
Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages App 20170133282 - Wu; Wei-Cheng ; et al.	2017-05-11
Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages Grant 9,581,638 - Wu , et al. February 28, 2	2017-02-28
Moisture-resistant package Grant 9,061,887 - Lin , et al. June 23, 2	2015-06-23
Package Structure and Methods of Forming Same App 20150162220 - Chou; Bruce C.S. ; et al.	2015-06-11
Package structure and methods of forming same Grant 8,970,023 - Chou , et al. March 3, 2	2015-03-03
Mobile Device And Method For Managing Background Data Transmission Thereof App 20140307636 - Lin; Chen-Hua	2014-10-16
Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages App 20140266283 - Wu; Wei-Cheng ; et al.	2014-09-18
Package Structure and Methods of Forming Same App 20140217604 - Chou; Bruce C.S. ; et al.	2014-08-07
Moisture-resistant Package App 20130220874 - Lin; Chen Hua ; et al.	2013-08-29
Method Of Using Ground Penetrating Radar To Detect Corrosion Of Steel Bars In Ferroconcrete Components App 20120280849 - CHANG; Che-Way ; et al.	2012-11-08
Ink supply structure for inkjet printhead Grant 6,966,634 - Hsu , et al. November 22, 2	2005-11-22
Method of manufacturing a piezoelectric print-head Grant 6,857,186 - Lin , et al. February 22, 2	2005-02-22
Ink supply structure for inkjet printhead App 20040109042 - Hsu, Chi-Chung ; et al.	2004-06-10
Pressure chamber of a piezoelectric ink jet print head and fabrication method thereof App 20040104976 - Lin, Chen-Hua	2004-06-03
Piezoelectric ink jet print head and fabrication method for a vibrating layer thereof App 20040056930 - Tsai, Chih-Chang ; et al.	2004-03-25
Ink chamber structure for an inkjet printhead Grant 6,702,429 - Lin March 9, 2	2004-03-09
Process for producing inkjet printhead Grant 6,701,593 - Lin , et al. March 9, 2	2004-03-09
Ink supply structure for inkjet printhead Grant 6,682,177 - Hsu , et al. January 27, 2	2004-01-27
[piezoelectric Print-head And Method Of Manufacture] App 20030184619 - LIN, CHEN-HUA ; et al.	2003-10-02
Ink chamber structure for an inkjet printhead App 20030058298 - Lin, Chen-Hua	2003-03-27
Inkjet printhead chip App 20030052948 - Yang, Arnold Chang-Mou ; et al.	2003-03-20
Structure of an inkjet printhead chip and method for making the same App 20030052947 - Lin, Chen-Hua ; et al.	2003-03-20
Ink supply structure for inkjet printhead App 20030043234 - Hsu, Chi-Chung ; et al.	2003-03-06
Piezoelectric print-head and method of manufacture App 20030043237 - Lin, Chen-Hua ; et al.	2003-03-06
Cartridge having piezoelectric jet module and process for producing piezoelectric inkjet printhead App 20020089572 - Lin, Chen-Hua ; et al.	2002-07-11
Printhead of ink jet printing apparatus and manufacturing method therefor Grant 6,364,455 - Yang , et al. April 2, 2	2002-04-02