Lin; Che-Kai
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Che-Kai.The latest application filed is for "gan-based field effect transistor".
- Lin; Che-Kai - Tao Yuan TW
- LIN; Che-Kai - Tao Yuan City TW
- Lin; Che-Kai - Taoyuan TW
- LIN; Che-Kai - TAOYUAN CITY TW
- Lin; Che-Kai - Taoyuan Hsien TW
- Lin; Che-Kai - Taoyuan County TW
- Lin; Che-Kai - Taipei TW
- Lin; Che-Kai - Taipei City TW
| Patent | Date |
|---|---|
| Semiconductor structure for improving thermal stability and Schottky behavior Grant 10,886,392 - Du , et al. January 5, 2 | 2021-01-05 |
| GaN-BASED FIELD EFFECT TRANSISTOR App 20200303532 - LIN; Che-Kai ; et al. | 2020-09-24 |
| Semiconductor Structure For Improving Thermal Stability And Schottky Behavior App 20200203517 - DU; Jhih-Han ; et al. | 2020-06-25 |
| Passivation Structure For GaN Field Effect Transistor App 20190148498 - LEE; Eric ; et al. | 2019-05-16 |
| Semiconductor structure for improving the gate adhesion and Schottky stability Grant 10,084,109 - Du , et al. September 25, 2 | 2018-09-25 |
| Method of fabricating housing and housing Grant 9,713,889 - Hsu , et al. July 25, 2 | 2017-07-25 |
| Method Of Fabricating Housing And Housing App 20170113385 - HSU; Hsi-Hsing ; et al. | 2017-04-27 |
| Method of fabricating housing and housing Grant 9,582,029 - Hsu , et al. February 28, 2 | 2017-02-28 |
| Fixing sheet and electronic apparatus Grant 9,537,122 - Lin , et al. January 3, 2 | 2017-01-03 |
| Method Of Fabricating Housing And Housing App 20160007493 - HSU; Hsi-Hsing ; et al. | 2016-01-07 |
| Handheld electronic device Grant 8,824,139 - Chen , et al. September 2, 2 | 2014-09-02 |
| Fixing Sheet And Electronic Apparatus App 20140113505 - Lin; Che-Kai ; et al. | 2014-04-24 |
| Handheld Electronic Device App 20130016457 - Chen; Chih-Wei ; et al. | 2013-01-17 |
| Multi-layer structure with a transparent gate Grant 7,745,853 - Chiu , et al. June 29, 2 | 2010-06-29 |
| Multi-layer Structure With A Transparent Gate App 20090315077 - Chiu; Hsien-Chin ; et al. | 2009-12-24 |
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