| Patent | Date |
|---|
Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same
Grant 11,291,146 - Lin , et al. March 29, 2 | 2022-03-29 |
Interconnect Substrate Having Buffer Material And Crack Stopper And Semiconductor Assembly Using The Same
App 20210289678 - LIN; Charles W. C. ; et al. | 2021-09-16 |
Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same
Grant 10,804,205 - Lin , et al. October 13, 2 | 2020-10-13 |
Thermally Enhanced Assembly With Metallic Interfacial Structure Between Heat Generating Component And Heat Spreader
App 20200303280 - LIN; Charles W. C. | 2020-09-24 |
Semiconductor Assembly Having Dual Wiring Structures And Warp Balancer
App 20200146192 - LIN; Charles W. C. ; et al. | 2020-05-07 |
Interconnect Substrate With Etching Stoppers Within Cavity And Metal Leads Around Cavity And Semiconductor Assembly Using The Sa
App 20200135630 - LIN; Charles W. C. ; et al. | 2020-04-30 |
3-d Stacking Semiconductor Assembly Having Heat Dissipation Characteristics
App 20200091116 - LIN; Charles W. C. ; et al. | 2020-03-19 |
Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly
Grant 10,546,808 - Lin , et al. Ja | 2020-01-28 |
Wiring Board Having Bridging Element Straddling Over Interfaces
App 20190333850 - Lin; Charles W. C. ; et al. | 2019-10-31 |
Face-to-face semiconductor assembly having semiconductor device in dielectric recess
Grant 10,446,526 - Lin , et al. Oc | 2019-10-15 |
Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same
Grant 10,420,204 - Lin , et al. Sept | 2019-09-17 |
Heat Conductive Wiring Board And Semiconductor Assembly Using The Same
App 20190267307 - LIN; Charles W. C. ; et al. | 2019-08-29 |
Wiring board having isolator and bridging element and method of making wiring board
Grant 10,361,151 - Lin , et al. | 2019-07-23 |
Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same
Grant 10,354,984 - Lin , et al. July 16, 2 | 2019-07-16 |
Leadframe Substrate Having Modulator And Crack Inhibiting Structure And Flip Chip Assembly Using The Same
App 20190182997 - LIN; Charles W. C. ; et al. | 2019-06-13 |
Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same
Grant 10,306,777 - Lin , et al. | 2019-05-28 |
Wiring board having component integrated with leadframe and method of making the same
Grant 10,269,722 - Lin , et al. | 2019-04-23 |
Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same
Grant 10,242,964 - Lin , et al. | 2019-03-26 |
Interconnect Substrate Having Stress Modulator And Flip Chip Assembly Thereof
App 20190090391 - LIN; Charles W. C. ; et al. | 2019-03-21 |
Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same
Grant 10,217,710 - Lin , et al. Feb | 2019-02-26 |
Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly
Grant 10,211,067 - Lin , et al. Feb | 2019-02-19 |
Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same
Grant 10,199,321 - Lin , et al. Fe | 2019-02-05 |
Face-to-face Semiconductor Assembly Having Semiconductor Device In Dielectric Recess
App 20190019778 - LIN; Charles W. C. ; et al. | 2019-01-17 |
Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener
Grant 10,177,130 - Lin , et al. J | 2019-01-08 |
Package-on-package semiconductor assembly having bottom device confined by dielectric recess
Grant 10,177,090 - Lin , et al. J | 2019-01-08 |
Semiconductor Assembly With Three Dimensional Integration And Method Of Making The Same
App 20180374827 - Lin; Charles W. C. ; et al. | 2018-12-27 |
Methods Of Making Interconnect Substrate Having Stress Modulator And Crack Inhibiting Layer And Making Flip Chip Assembly Thereof
App 20180359886 - LIN; Charles W. C. ; et al. | 2018-12-13 |
Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same
Grant 10,134,711 - Lin , et al. November 20, 2 | 2018-11-20 |
Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same
Grant 10,121,768 - Lin , et al. November 6, 2 | 2018-11-06 |
Face-to-face semiconductor assembly having semiconductor device in dielectric recess
Grant 10,096,573 - Lin , et al. October 9, 2 | 2018-10-09 |
Method Of Making Wiring Board With Dual Routing Circuitries Integrated With Leadframe
App 20180261535 - LIN; Charles W. C. ; et al. | 2018-09-13 |
Method Of Making Thermally Enhanced Wiring Board Having Isolator Incorporated Therein
App 20180263146 - LIN; Charles W. C. ; et al. | 2018-09-13 |
Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same
Grant 10,062,663 - Lin , et al. August 28, 2 | 2018-08-28 |
Wiring Board Having Component Integrated With Leadframe And Method Of Making The Same
App 20180204802 - LIN; Charles W. C. ; et al. | 2018-07-19 |
Wiring Board With Embedded Component And Integrated Stiffener, Method Of Making The Same And Face-to-face Semiconductor Assembly Using The Same
App 20180197818 - Lin; Charles W. C. ; et al. | 2018-07-12 |
3-d Stacking Semiconductor Assembly Having Heat Dissipation Characteristics
App 20180190622 - Lin; Charles W. C. ; et al. | 2018-07-05 |
Method Of Making Wiring Board With Interposer And Electronic Component Incorporated With Base Board
App 20180166373 - LIN; Charles W. C. ; et al. | 2018-06-14 |
Methods Of Making Wiring Substrate For Stackable Semiconductor Assembly And Making Stackable Semiconductor Assembly
App 20180158770 - LIN; Charles W. C. ; et al. | 2018-06-07 |
Methods Of Making Stackable Wiring Board Having Electronic Component In Dielectric Recess
App 20180146559 - Lin; Charles W. C. ; et al. | 2018-05-24 |
Leadframe Substrate With Electronic Component Incorporated Therein And Semiconductor Assembly Using The Same
App 20180130723 - Lin; Charles W. C. ; et al. | 2018-05-10 |
Wiring board with embedded component and integrated stiffener and method of making the same
Grant 9,947,625 - Lin , et al. April 17, 2 | 2018-04-17 |
Methods of making stackable wiring board having electronic component in dielectric recess
Grant 9,913,385 - Lin , et al. March 6, 2 | 2018-03-06 |
Interconnect Substrate Having Cavity For Stackable Semiconducotr Assembly, Manufacturing Method Thereof And Vertically Stacked Semiconductor Assembly Using The Same
App 20180040551 - Lin; Charles W. C. ; et al. | 2018-02-08 |
Method Of Making Interconnect Substrate Having Routing Circuitry Connected To Posts And Terminals
App 20180040531 - Lin; Charles W. C. ; et al. | 2018-02-08 |
Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same
Grant 9,825,009 - Lin , et al. November 21, 2 | 2017-11-21 |
Leadframe Substrate With Isolator Incorporated Therein And Semiconductor Assembly And Manufacturing Method Thereof
App 20170301617 - Lin; Charles W. C. ; et al. | 2017-10-19 |
Wiring Board With Electrical Isolator And Base Board Incorporated Therein And Semiconductor Assembly And Manufacturing Method Thereof
App 20170263546 - Lin; Charles W. C. ; et al. | 2017-09-14 |
Thermally Enhanced Semiconductor Assembly With Three Dimensional Integration And Method Of Making The Same
App 20170243803 - Lin; Charles W. C. ; et al. | 2017-08-24 |
Thermally Enhanced Semiconductor Assembly With Three Dimensional Integration And Method Of Making The Same
App 20170207200 - Lin; Charles W. C. ; et al. | 2017-07-20 |
Thermally Enhanced Semiconductor Assembly With Three Dimensional Integration And Method Of Making The Same
App 20170194300 - Lin; Charles W. C. ; et al. | 2017-07-06 |
Semiconductor Assembly Having Anti-warping Controller And Vertical Connecting Element In Stiffener
App 20170162556 - Lin; Charles W. C. ; et al. | 2017-06-08 |
Semiconductor Assembly With Three Dimensional Integration And Method Of Making The Same
App 20170133353 - Lin; Charles W. C. ; et al. | 2017-05-11 |
Thermally Enhanced Semiconductor Assembly With Three Dimensional Integration And Method Of Making The Same
App 20170133352 - Lin; Charles W. C. ; et al. | 2017-05-11 |
Wiring Board Having Isolator And Bridging Element And Method Of Making Wiring Board
App 20170084530 - Lin; Charles W. C. ; et al. | 2017-03-23 |
Interconnect Substrate Having Cavity For Stackable Semiconducotr Assembly, Manufacturing Method Thereof And Vertically Stacked Semiconductor Assembly Using The Same
App 20170069602 - Lin; Charles W. C. ; et al. | 2017-03-09 |
Semiconductor Assembly With Electromagnetic Shielding And Thermally Enhanced Characteristics And Method Of Making The Same
App 20170062394 - Lin; Charles W. C. ; et al. | 2017-03-02 |
Thermally enhanced semiconductor assembly with heat spreader and integrated dual build-up circuitries and method of making the same
Grant 9,570,372 - Lin , et al. February 14, 2 | 2017-02-14 |
Methods Of Making Stackable Wiring Board Having Electronic Component In Dielectric Recess
App 20170034923 - Lin; Charles W. C. ; et al. | 2017-02-02 |
Package-on-package Semiconductor Assembly Having Bottom Device Confined By Dielectric Recess
App 20170033083 - Lin; Charles W. C. ; et al. | 2017-02-02 |
Face-to-face Semiconductor Assembly Having Semiconductor Device In Dielectric Recess
App 20170033082 - Lin; Charles W.C. ; et al. | 2017-02-02 |
Thermally Enhanced Face-to-face Semiconductor Assembly With Heat Spreader And Method Of Making The Same
App 20170025393 - Lin; Charles W. C. ; et al. | 2017-01-26 |
Wiring Board With Embedded Component And Integrated Stiffener And Method Of Making The Same
App 20170018505 - Lin; Charles W. C. ; et al. | 2017-01-19 |
Wiring Board With Dual Stiffeners And Dual Routing Circuitries Integrated Together And Method Of Making The Same
App 20160366762 - Lin; Charles W. C. ; et al. | 2016-12-15 |
Thermally Enhanced Face-to-face Semiconductor Assembly With Built-in Heat Spreader And Method Of Making The Same
App 20160351549 - Lin; Charles W. C. ; et al. | 2016-12-01 |
Semiconductor Assembly With Built-in Stiffener And Integrated Dual Routing Circuitries And Method Of Making The Same
App 20160293514 - Lin; Charles W. C. ; et al. | 2016-10-06 |
Low Warping Coreless Substrate And Semiconductor Assembly Using The Same
App 20160254220 - Lin; Charles W. C. ; et al. | 2016-09-01 |
Semiconductor Assembly Having Wiring Board With Electrical Isolator And Moisture Inhibiting Cap Incorporated Therein And Method Of Making Wiring Board
App 20160211207 - Lin; Charles W. C. ; et al. | 2016-07-21 |
Wiring Board With Interposer And Dual Wiring Structures Integrated Together And Method Of Making The Same
App 20160204056 - Lin; Charles W. C. ; et al. | 2016-07-14 |
Wiring Board With Embedded Interposer Integrated With Stiffener And Method Of Making The Same
App 20160205778 - Lin; Charles W. C. ; et al. | 2016-07-14 |
Semiconductor Package With Package-on-package Stacking Capability And Method Of Manufacturing The Same
App 20160197063 - Lin; Charles W. C. ; et al. | 2016-07-07 |
Wiring Board With Dual Wiring Structures Integrated Together And Method Of Making The Same
App 20160174365 - Lin; Charles W. C. ; et al. | 2016-06-16 |
Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
Grant 9,349,711 - Lin , et al. May 24, 2 | 2016-05-24 |
Semiconductor package with package-on-package stacking capability and method of manufacturing the same
Grant 9,318,411 - Lin , et al. April 19, 2 | 2016-04-19 |
Semiconductor assembly and method of manufacturing the same
Grant 9,299,651 - Lin , et al. March 29, 2 | 2016-03-29 |
Semiconductor Device With Face-to-face Chips On Interposer And Method Of Manufacturing The Same
App 20160005717 - Lin; Charles W. C. ; et al. | 2016-01-07 |
Semiconductor device having chip embedded in heat spreader and electrically connected to interposer and method of manufacturing the same
Grant 9,230,901 - Lin , et al. January 5, 2 | 2016-01-05 |
Wiring Board Having Electrical Isolator And Moisture Inhibiting Cap Incorporated Therein And Method Of Making The Same
App 20150382468 - Lin; Charles W. C. ; et al. | 2015-12-31 |
Thermally Enhanced Wiring Board Having Metal Slug And Moisture Inhibiting Cap Incorporated Therein And Method Of Making The Same
App 20150382444 - Lin; Charles W. C. ; et al. | 2015-12-31 |
Semiconductor package with package-on-package stacking capability and method of manufacturing the same
Grant 9,209,154 - Lin , et al. December 8, 2 | 2015-12-08 |
Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
Grant 9,147,667 - Lin , et al. September 29, 2 | 2015-09-29 |
Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
Grant 9,147,587 - Lin , et al. September 29, 2 | 2015-09-29 |
Method Of Making Thermally Enhanced Wiring Board Having Isolator Incorporated Therein
App 20150257316 - Lin; Charles W. C. ; et al. | 2015-09-10 |
Semiconducor Device And Method Of Manufacturing The Same
App 20150235935 - Lin; Charles W. C. ; et al. | 2015-08-20 |
Thermally enhanced interconnect substrate with embedded semiconductor device and built-in stopper and method of making the same
Grant 9,087,847 - Lin , et al. July 21, 2 | 2015-07-21 |
Wiring board with shielding lid and shielding slots as electromagnetic shields for embedded device
Grant 9,064,878 - Lin , et al. June 23, 2 | 2015-06-23 |
Semiconductor Package With Package-on-package Stacking Capability And Method Of Manufacturing The Same
App 20150155256 - Lin; Charles W. C. ; et al. | 2015-06-04 |
Semiconductor Assembly And Method Of Manufacturing The Same
App 20150137338 - Lin; Charles W. C. ; et al. | 2015-05-21 |
Semiconductor Package With Package-on-package Stacking Capability And Method Of Manufacturing The Same
App 20150130046 - Lin; Charles W. C. ; et al. | 2015-05-14 |
Semiconducor Device And Method Of Manufacturing The Same
App 20150115433 - LIN; Charles W.C. ; et al. | 2015-04-30 |
Semiconductor Device With Face-to-face Chips On Interposer And Method Of Manufacturing The Same
App 20150118794 - Lin; Charles W. C. ; et al. | 2015-04-30 |
Semiconductor chip assembly with post/base heat spreader and dual adhesives
Grant 9,018,667 - Lin , et al. April 28, 2 | 2015-04-28 |
Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
Grant 8,952,526 - Lin , et al. February 10, 2 | 2015-02-10 |
Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
Grant 8,927,339 - Lin , et al. January 6, 2 | 2015-01-06 |
Hybrid wiring board with built-in stopper, interposer and build-up circuitry
Grant 8,901,435 - Lin , et al. December 2, 2 | 2014-12-02 |
Method of making semiconductor assembly with built-in stiffener and semiconductor assembly manufactured thereby
Grant 8,895,380 - Lin , et al. November 25, 2 | 2014-11-25 |
Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
Grant 8,865,525 - Lin , et al. October 21, 2 | 2014-10-21 |
Method Of Making Hybrid Wiring Board With Built-in Stiffener And Interposer And Hybrid Wiring Board Manufactured Thereby
App 20140291001 - LIN; Charles W.C. ; et al. | 2014-10-02 |
Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
Grant 8,841,171 - Lin , et al. September 23, 2 | 2014-09-23 |
Thermally Enhanced Wiring Board With Built-in Heat Sink And Build-up Circuitry
App 20140251658 - LIN; Charles W.C. ; et al. | 2014-09-11 |
Method Of Making Cavity Substrate With Built-in Stiffener And Cavity Substrate Manufactured Thereby
App 20140246227 - LIN; Charles W.C. ; et al. | 2014-09-04 |
Semiconductor Assembly With Built-in Stopper, Semiconductor Device And Build-up Circuitry And Method Of Making The Same
App 20140183752 - LIN; Charles W.C. ; et al. | 2014-07-03 |
Thermally Enhanced Semiconductor Assembly With Embedded Chip And Interposer And Method Of Manufacturing The Same
App 20140175633 - LIN; Charles W.C. ; et al. | 2014-06-26 |
Method Of Making Hybrid Wiring Board With Built-in Stopper, Interposer And Build-up Circuitry
App 20140157593 - LIN; Charles W.C. ; et al. | 2014-06-12 |
Wiring Board With Embedded Device, Built-in Stopper And Electromagnetic Shielding
App 20140061877 - LIN; Charles W.C. ; et al. | 2014-03-06 |
Semiconductor Assembly With Dual Connecting Channels Between Interposer And Coreless Substrate
App 20140048951 - LIN; Charles W.C. ; et al. | 2014-02-20 |
Wiring Board With Embedded Device And Electromagnetic Shielding
App 20140048914 - LIN; Charles W.C. ; et al. | 2014-02-20 |
Hybrid Wiring Board With Built-in Stopper, Interposer And Build-up Circuitry
App 20140048324 - LIN; Charles W.C. ; et al. | 2014-02-20 |
Thermally Enhanced Interconnect Substrate With Embedded Semiconductor Device And Built-in Stopper And Method Of Making The Same
App 20140048949 - LIN; Charles W.C. ; et al. | 2014-02-20 |
Thermally Enhanced Wiring Board With Thermal Pad And Electrical Post
App 20140048313 - PAN; Wei-Kuang ; et al. | 2014-02-20 |
Wiring Board With Hybrid Core And Dual Build-up Circuitries
App 20140048319 - PAN; Wei-Kuang ; et al. | 2014-02-20 |
Thermally Enhanced Semiconductor Assembly With Embedded Semiconductor Device And Built-in Stopper And Method Of Making The Same
App 20140048950 - LIN; Charles W.C. ; et al. | 2014-02-20 |
Wiring Board With Shielding Lid And Shielding Slots As Electromagnetic Shields For Embedded Device
App 20140048916 - LIN; Charles W.C. ; et al. | 2014-02-20 |
Multi-cavity Wiring Board For Semiconductor Assembly With Internal Electromagnetic Shielding
App 20140048326 - LIN; Charles W.C. ; et al. | 2014-02-20 |
Semiconductor Assembly Board With Back-to-back Embedded Semiconductor Devices And Built-in Stoppers
App 20140048955 - LIN; Charles W.C. ; et al. | 2014-02-20 |
Interconnect Substrate With Embedded Semiconductor Device And Built-in Stopper And Method Of Making The Same
App 20140048944 - LIN; Charles W.C. ; et al. | 2014-02-20 |
Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
Grant 8,614,502 - Lin , et al. December 24, 2 | 2013-12-24 |
Method Of Making Cavity Substrate With Built-in Stiffener And Cavity
App 20130337648 - LIN; Charles W.C. ; et al. | 2013-12-19 |
Method Of Making Semiconductor Assembly With Built-in Stiffener And Semiconductor Assembly Manufactured Thereby
App 20130292826 - LIN; Charles W.C. ; et al. | 2013-11-07 |
Method Of Making Cavity Substrate With Built-in Stiffener And Cavity Substrate Manufactured Thereby
App 20130277832 - LIN; Charles W.C. ; et al. | 2013-10-24 |
Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump
Grant 8,535,985 - Lin , et al. September 17, 2 | 2013-09-17 |
Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
Grant 8,531,024 - Lin , et al. September 10, 2 | 2013-09-10 |
Semiconductor chip assembly with post/base heat spreader with thermal via
Grant 8,525,214 - Lin , et al. September 3, 2 | 2013-09-03 |
Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
Grant 8,415,703 - Lin , et al. April 9, 2 | 2013-04-09 |
Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
Grant 8,378,372 - Wang , et al. February 19, 2 | 2013-02-19 |
Three Dimensional Semiconductor Assembly Board With Bump/flange Supporting Board, Coreless Build-up Circuitry And Built-in Electronic Device
App 20130032938 - LIN; Charles W.C. ; et al. | 2013-02-07 |
Method Of Making Cavity Substrate With Built-in Stiffener And Cavity Substrate Manufactured Thereby
App 20130032388 - LIN; Charles W.C. ; et al. | 2013-02-07 |
Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump
Grant 8,354,688 - Lin , et al. January 15, 2 | 2013-01-15 |
Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump
Grant 8,354,283 - Lin , et al. January 15, 2 | 2013-01-15 |
Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
Grant 8,343,808 - Lin , et al. January 1, 2 | 2013-01-01 |
Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
Grant 8,329,510 - Lin , et al. December 11, 2 | 2012-12-11 |
Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
Grant 8,324,723 - Lin , et al. December 4, 2 | 2012-12-04 |
Semiconductor chip assembly with ceramic/metal substrate
Grant 8,324,653 - Lin , et al. December 4, 2 | 2012-12-04 |
Semiconductor chip assembly with bump/base heat spreader and cavity in bump
Grant 8,314,438 - Lin , et al. November 20, 2 | 2012-11-20 |
Semiconductor chip assembly with post/base heat spreader with ESD protection layer
Grant 8,310,043 - Lin , et al. November 13, 2 | 2012-11-13 |
Method of making a semiconductor chip assembly with a ceramic/metal substrate
Grant 8,304,292 - Lin , et al. November 6, 2 | 2012-11-06 |
Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole
Grant 8,298,868 - Lin , et al. October 30, 2 | 2012-10-30 |
Semiconductor chip assembly with post/base/post heat spreader
Grant 8,288,792 - Lin , et al. October 16, 2 | 2012-10-16 |
Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump
Grant 8,283,211 - Lin , et al. October 9, 2 | 2012-10-09 |
Semiconductor chip assembly with post/base heat spreader and signal post
Grant 8,269,336 - Lin , et al. September 18, 2 | 2012-09-18 |
Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity
Grant 8,241,962 - Lin , et al. August 14, 2 | 2012-08-14 |
Method of making a semiconductor chip assembly with a post/base/post heat spreader
Grant 8,236,618 - Lin , et al. August 7, 2 | 2012-08-07 |
Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
Grant 8,236,619 - Lin , et al. August 7, 2 | 2012-08-07 |
Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace
Grant 8,232,573 - Lin , et al. July 31, 2 | 2012-07-31 |
Semiconductor chip assembly with post/base heat spreader and ceramic block in post
Grant 8,232,576 - Lin , et al. July 31, 2 | 2012-07-31 |
Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal
Grant 8,227,270 - Lin , et al. July 24, 2 | 2012-07-24 |
Semiconductor chip assembly with post/base heat spreader, signal post and cavity
Grant 8,212,279 - Lin , et al. July 3, 2 | 2012-07-03 |
Semiconductor chip assembly with base heat spreader and cavity in base
Grant 8,207,553 - Lin , et al. June 26, 2 | 2012-06-26 |
Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts
Grant 8,207,019 - Lin , et al. June 26, 2 | 2012-06-26 |
Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
Grant 8,203,167 - Lin , et al. June 19, 2 | 2012-06-19 |
Semiconductor chip assembly with post/base heat spreader and cavity in post
Grant 8,193,556 - Lin , et al. June 5, 2 | 2012-06-05 |
Stackable Semiconductor Assembly With Bump/flange Heat Spreader And Dual Build-up Circuitry
App 20120126388 - LIN; Charles W. C. ; et al. | 2012-05-24 |
Thermally Enhanced Semiconductor Assembly With Bump/base/flange Heat Spreader And Build-up Circuitry
App 20120126399 - LIN; Charles W. C. ; et al. | 2012-05-24 |
Method Of Making Stackable Semiconductor Assembly With Bump/flange Heat Spreader And Dual Build-up Circuitry
App 20120129298 - LIN; Charles W. C. ; et al. | 2012-05-24 |
Method Of Making Stackable Semiconductor Assembly With Bump/base/flange Heat Spreader And Build-up Circuitry
App 20120129300 - LIN; Charles W.C. ; et al. | 2012-05-24 |
Stackable Semiconductor Assembly With Bump/base/flange Heat Spreader And Electromagnetic Shielding
App 20120126401 - LIN; Charles W.C. ; et al. | 2012-05-24 |
Method Of Making Thermally Enhanced Semiconductor Assembly With Bump/base/flange Heat Spreader And Build-up Circuitry
App 20120129299 - LIN; Charles W.C. ; et al. | 2012-05-24 |
Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via
Grant 8,178,395 - Lin , et al. May 15, 2 | 2012-05-15 |
Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding
Grant 8,163,603 - Lin , et al. April 24, 2 | 2012-04-24 |
Method Of Making A Semiconductor Chip Assembly With A Bump/base/ledge Heat Spreader, Dual Adhesives And A Cavity In The Bump
App 20120094442 - Lin; Charles W.C. ; et al. | 2012-04-19 |
Semiconductor Chip Assembly With Bump/base/ledge Heat Spreader, Dual Adhesives And Cavity In Bump
App 20120091493 - Lin; Charles W.C. ; et al. | 2012-04-19 |
Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
Grant 8,153,477 - Lin , et al. April 10, 2 | 2012-04-10 |
Semiconductor chip assembly with post/base/cap heat spreader
Grant 8,148,747 - Lin , et al. April 3, 2 | 2012-04-03 |
Method of making a semiconductor chip assembly with a post/base/cap heat spreader
Grant 8,148,207 - Lin , et al. April 3, 2 | 2012-04-03 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And A Substrate Using Grinding
App 20120064672 - Lin; Charles W.C. ; et al. | 2012-03-15 |
Semiconductor chip assembly with post/base heat spreader and plated through-hole
Grant 8,129,742 - Lin , et al. March 6, 2 | 2012-03-06 |
Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
Grant 8,110,446 - Lin , et al. February 7, 2 | 2012-02-07 |
Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post
Grant 8,076,182 - Lin , et al. December 13, 2 | 2011-12-13 |
Semiconductor chip assembly with post/base heat spreader and substrate
Grant 8,067,784 - Lin , et al. November 29, 2 | 2011-11-29 |
Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate
Grant 8,067,270 - Lin , et al. November 29, 2 | 2011-11-29 |
Method Of Making A Semiconductor Chip Assembly With A Post/dielectric/post Heat Spreader
App 20110287563 - Lin; Charles W.C. ; et al. | 2011-11-24 |
Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing
Grant 8,062,912 - Wang , et al. November 22, 2 | 2011-11-22 |
Semiconductor Chip Assembly With Post/dielectric/post Heat Spreader
App 20110278638 - Lin; Charles W.C. ; et al. | 2011-11-17 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader With A Thermal Via
App 20110275180 - Lin; Charles W.C. ; et al. | 2011-11-10 |
Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader
Grant 8,034,645 - Lin , et al. October 11, 2 | 2011-10-11 |
Semiconductor Chip Assembly With Post/base Heat Spreader With Thermal Via
App 20110227122 - Lin; Charles W.C. ; et al. | 2011-09-22 |
Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives
Grant 8,003,416 - Lin , et al. August 23, 2 | 2011-08-23 |
Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing
Grant 8,003,415 - Wang , et al. August 23, 2 | 2011-08-23 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And A Multilevel Conductive Trace
App 20110201157 - Lin; Charles W.C. ; et al. | 2011-08-18 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Multilevel Conductive Trace
App 20110198662 - Lin; Charles W.C. ; et al. | 2011-08-18 |
Method of making a semiconductor chip assembly with chip and encapsulant grinding
Grant 7,993,983 - Lin August 9, 2 | 2011-08-09 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And A Plated Through-hole
App 20110183472 - Lin; Charles W.C. ; et al. | 2011-07-28 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Plated Through-hole
App 20110175136 - Lin; Charles W.C. ; et al. | 2011-07-21 |
Method Of Making A Semiconductor Chip Assembly With A Bump/base Heat Spreader And An Inverted Cavity In The Bump
App 20110171785 - Lin; Charles W.C. ; et al. | 2011-07-14 |
Semiconductor Chip Assembly With Bump/base Heat Spreader And Inverted Cavity In Bump
App 20110163348 - Lin; Charles W.C. ; et al. | 2011-07-07 |
Semiconductor Chip Assembly With Post/base/post Heat Spreader And Asymmetric Posts
App 20110156090 - Lin; Charles W.C. ; et al. | 2011-06-30 |
Method Of Making A Semiconductor Chip Assembly With A Post/base/post Heat Spreader And Asymmetric Posts
App 20110151626 - Lin; Charles W.C. ; et al. | 2011-06-23 |
Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post
Grant 7,951,622 - Lin , et al. May 31, 2 | 2011-05-31 |
Semiconductor chip assembly with post/base heat spreader and vertical signal routing
Grant 7,948,076 - Wang , et al. May 24, 2 | 2011-05-24 |
Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
Grant 7,939,375 - Lin , et al. May 10, 2 | 2011-05-10 |
Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
App 20110104855 - Lin; Charles W.C. ; et al. | 2011-05-05 |
Method Of Making A Semiconductor Chip Assembly With A Post/base/post Heat Spreader
App 20110104856 - Lin; Charles W.C. ; et al. | 2011-05-05 |
Semiconductor Chip Assembly With Post/base/post Heat Spreader
App 20110101410 - Lin; Charles W.C. ; et al. | 2011-05-05 |
Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base
Grant 7,932,165 - Lin , et al. April 26, 2 | 2011-04-26 |
Semiconductor Chip Assembly With Post/base Heat Spreader With Esd Protection Layer
App 20110089465 - Lin; Charles W.C. ; et al. | 2011-04-21 |
Semiconductor Chip Assembly With Bump/base Heat Spreader And Dual-angle Cavity In Bump
App 20110079811 - Lin; Charles W.C. ; et al. | 2011-04-07 |
Method Of Making A Semiconductor Chip Assembly With A Bump/base Heat Spreader And A Dual-angle Cavity In The Bump
App 20110065241 - Lin; Charles W.C. ; et al. | 2011-03-17 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader, A Signal Post And A Cavity
App 20110059578 - Lin; Charles W.C. ; et al. | 2011-03-10 |
Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace
Grant 7,901,993 - Lin , et al. March 8, 2 | 2011-03-08 |
Semiconductor Chip Assembly With Post/base Heat Spreader, Signal Post And Cavity
App 20110049558 - Lin; Charles W.C. ; et al. | 2011-03-03 |
Method Of Making A Semiconductor Chip Assembly With A Bump/base Heat Spreader And A Cavity In The Bump
App 20110039374 - Lin; Charles W.C. ; et al. | 2011-02-17 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And An Adhesive Between The Base And A Terminal
App 20110039357 - Lin; Charles W.C. ; et al. | 2011-02-17 |
Semiconductor Chip Assembly With Bump/base Heat Spreader And Cavity In Bump
App 20110037094 - Lin; Charles W.C. ; et al. | 2011-02-17 |
Method Of Making A Semiconductor Chip Assembly With A Post/base/flange Heat Spreader And A Cavity In The Flange
App 20110003437 - Lin; Charles W.C. ; et al. | 2011-01-06 |
Semiconductor Chip Assembly With Post/base/flange Heat Spreader And Cavity In Flange
App 20100327310 - Lin; Charles W.C. ; et al. | 2010-12-30 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Adhesive Between Base And Terminal
App 20100289054 - Lin; Charles W.C. ; et al. | 2010-11-18 |
Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base
Grant 7,833,827 - Lin , et al. November 16, 2 | 2010-11-16 |
Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment
Grant 7,811,863 - Lin , et al. October 12, 2 | 2010-10-12 |
Heat-sinking memory module device
App 20100214742 - Lin; Charles W.C. ; et al. | 2010-08-26 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And Dual Adhesives
App 20100210049 - Lin; Charles W.C. ; et al. | 2010-08-19 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And A Cavity Over The Post
App 20100203679 - Lin; Charles W.C. ; et al. | 2010-08-12 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Dual Adhesives
App 20100193830 - Lin; Charles W.C. ; et al. | 2010-08-05 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And A Cavity In The Post
App 20100190297 - Lin; Charles W.C. ; et al. | 2010-07-29 |
Method Of Making A Semiconductor Chip Assembly With A Base Heat Spreader And A Cavity In The Base
App 20100190300 - Lin; Charles W.C. ; et al. | 2010-07-29 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Cavity Over Post
App 20100181594 - Lin; Charles W.C. ; et al. | 2010-07-22 |
Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
Grant 7,750,483 - Lin , et al. July 6, 2 | 2010-07-06 |
Method Of Making A Semiconductor Chip Assembly With An Aluminum Post/base Heat Spreader And A Silver/copper Conductive Trace
App 20100167438 - Lin; Charles W.C. ; et al. | 2010-07-01 |
Semiconductor Chip Assembly With Aluminum Post/base Heat Spreader And Silver/copper Conductive Trace
App 20100163921 - Lin; Charles W.C. ; et al. | 2010-07-01 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And A Signal Post
App 20100167436 - Lin; Charles W.C. ; et al. | 2010-07-01 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Cavity In Post
App 20100155768 - Lin; Charles W.C. ; et al. | 2010-06-24 |
Semiconductor Chip Assembly With Base Heat Spreader And Cavity In Base
App 20100155769 - Lin; Charles W.C. ; et al. | 2010-06-24 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Signal Post
App 20100096662 - Lin; Charles W.C. ; et al. | 2010-04-22 |
Semiconductor Chip Assembly With Copper/aluminum Post/base Heat Spreader
App 20100087020 - Lin; Charles W.C. ; et al. | 2010-04-08 |
Method Of Making A Semiconductor Chip Assembly With A Post/base/cap Heat Spreader
App 20100075448 - Lin; Charles W.C. ; et al. | 2010-03-25 |
Semiconductor Chip Assembly With Post/base/cap Heat Spreader
App 20100072510 - Lin; Charles W.C. ; et al. | 2010-03-25 |
Semiconductor Chip Assembly With Copper/aluminum Post/base Heat Spreader
App 20100072511 - Lin; Charles W.C. ; et al. | 2010-03-25 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Substrate
App 20100059786 - Lin; Charles W.C. ; et al. | 2010-03-11 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And A Conductive Trace
App 20100055812 - Lin; Charles W.C. ; et al. | 2010-03-04 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And A Substrate
App 20100055811 - Lin; Charles W.C. ; et al. | 2010-03-04 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Conductive Trace
App 20100052005 - Lin; Charles W.C. ; et al. | 2010-03-04 |
Stackable semiconductor package having metal pin within through hole of package
Grant 7,656,031 - Chen , et al. February 2, 2 | 2010-02-02 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And Vertical Signal Routing
App 20100003788 - Wang; Chia-Chung ; et al. | 2010-01-07 |
Method Of Making A Semiconductor Chip Assembly With A Post/base Heat Spreader And Horizontal Signal Routing
App 20100003787 - Wang; Chia-Chung ; et al. | 2010-01-07 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Vertical Signal Routing
App 20100001395 - Wang; Chia-Chung ; et al. | 2010-01-07 |
Semiconductor Chip Assembly With Post/base Heat Spreader And Horizontal Signal Routing
App 20100001309 - Wang; Chia-Chung ; et al. | 2010-01-07 |
Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry
App 20090284932 - LIN; Charles W.C. | 2009-11-19 |
Chip-scale Packaged Light-emitting Devices
App 20090218588 - Panaccione; Paul ; et al. | 2009-09-03 |
Semiconductor chip assembly with bumped terminal, filler and insulative base
Grant 7,538,415 - Lin , et al. May 26, 2 | 2009-05-26 |
Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
Grant 7,494,843 - Lin , et al. February 24, 2 | 2009-02-24 |
Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler
Grant 7,459,385 - Lin , et al. December 2, 2 | 2008-12-02 |
Semiconductor chip assembly with laterally aligned filler and insulative base
Grant 7,453,140 - Lin , et al. November 18, 2 | 2008-11-18 |
Semiconductor chip assembly with welded metal pillar of stacked metal balls
Grant 7,446,419 - Lin , et al. November 4, 2 | 2008-11-04 |
Semiconductor chip assembly with bumped terminal and filler
Grant 7,425,759 - Lin , et al. September 16, 2 | 2008-09-16 |
Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal
Grant 7,419,851 - Lin , et al. September 2, 2 | 2008-09-02 |
Semiconductor chip assembly with laterally aligned bumped terminal and filler
Grant 7,417,314 - Lin , et al. August 26, 2 | 2008-08-26 |
Semiconductor chip assembly with metal containment wall and solder terminal
Grant 7,414,319 - Lin , et al. August 19, 2 | 2008-08-19 |
Method of manufacturing semiconductor chip assembly with sacrificial metal-based core carrier
App 20080188037 - Lin; Charles W.C. | 2008-08-07 |
Stackable semiconductor package having metal pin within through hole of package
App 20080185708 - Chen; Cheng-Chung ; et al. | 2008-08-07 |
Method of making a semiconductor chip assembly with a bumped terminal and a filler
Grant 7,396,703 - Lin , et al. July 8, 2 | 2008-07-08 |
Semiconductor chip assembly with precision-formed metal pillar
Grant 7,319,265 - Wang , et al. January 15, 2 | 2008-01-15 |
Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
Grant 7,268,421 - Lin September 11, 2 | 2007-09-11 |
Method of connecting a conductive trace to a semiconductor chip using conductive adhesive
Grant 7,264,991 - Lin September 4, 2 | 2007-09-04 |
Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture
Grant 7,262,082 - Lin , et al. August 28, 2 | 2007-08-28 |
Semiconductor chip assembly with solder-attached ground plane
Grant 7,245,023 - Lin July 17, 2 | 2007-07-17 |
Method of making a semiconductor chip assembly with a precision-formed metal pillar
Grant 7,232,706 - Wang , et al. June 19, 2 | 2007-06-19 |
Method of making a semiconductor chip assembly with an interlocked contact terminal
Grant 7,232,707 - Wang , et al. June 19, 2 | 2007-06-19 |
Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line
Grant 7,229,853 - Lin June 12, 2 | 2007-06-12 |
Semiconductor chip assembly with pillar press-fit into ground plane
Grant 7,215,019 - Lin May 8, 2 | 2007-05-08 |
Method of making a semiconductor chip assembly with simultaneously formed interconnect and connection joint
Grant 7,192,803 - Lin , et al. March 20, 2 | 2007-03-20 |
Semiconductor chip assembly with embedded metal pillar
Grant 7,190,080 - Leu , et al. March 13, 2 | 2007-03-13 |
Semiconductor chip assembly with press-fit ground plane
Grant 7,157,791 - Lin January 2, 2 | 2007-01-02 |
Method of making a semiconductor chip assembly with a press-fit ground plane
Grant 7,148,082 - Lin December 12, 2 | 2006-12-12 |
Semiconductor chip assembly with carved bumped terminal
Grant 7,132,741 - Lin , et al. November 7, 2 | 2006-11-07 |
Semiconductor chip assembly with bumped metal pillar
Grant 7,129,575 - Lin , et al. October 31, 2 | 2006-10-31 |
Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture
Grant 7,129,113 - Lin , et al. October 31, 2 | 2006-10-31 |
Method of making a semiconductor chip assembly with a bumped metal pillar
Grant 7,112,521 - Lin , et al. September 26, 2 | 2006-09-26 |
Semiconductor chip assembly with embedded metal pillar
Grant 7,094,676 - Leu , et al. August 22, 2 | 2006-08-22 |
Method of making a semiconductor chip assembly with a solder-attached ground plane
Grant 7,087,466 - Lin August 8, 2 | 2006-08-08 |
Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line
App 20060166406 - Lin; Charles W.C. | 2006-07-27 |
Semiconductor chip assembly with interlocked contact terminal
Grant 7,075,186 - Wang , et al. July 11, 2 | 2006-07-11 |
Semiconductor chip assembly with welded metal pillar
Grant 7,071,573 - Lin July 4, 2 | 2006-07-04 |
Method of making a semiconductor chip assembly with a carved bumped terminal
Grant 7,071,089 - Lin , et al. July 4, 2 | 2006-07-04 |
Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture
Grant 7,067,911 - Lin , et al. June 27, 2 | 2006-06-27 |
Method of making a semiconductor chip assembly with a pillar and a routing line using multiple etch steps
Grant 7,064,012 - Lin June 20, 2 | 2006-06-20 |
Method of making a semiconductor chip assembly with an embedded metal particle
Grant 7,015,128 - Chiang , et al. March 21, 2 | 2006-03-21 |
Semiconductor chip assembly with embedded metal particle
Grant 7,009,297 - Chiang , et al. March 7, 2 | 2006-03-07 |
Semiconductor chip assembly with metal containment wall and solder terminal
App 20060012024 - Lin; Charles W.C. ; et al. | 2006-01-19 |
Method of making a semiconductor chip assemby with a metal containment wall and a solder terminal
App 20060014316 - Lin; Charles W.C. ; et al. | 2006-01-19 |
Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip
Grant 6,984,576 - Lin , et al. January 10, 2 | 2006-01-10 |
Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
Grant 6,949,408 - Lin , et al. September 27, 2 | 2005-09-27 |
Method of connecting a conductive trace to a semiconductor chip using a metal base
Grant 6,908,788 - Lin June 21, 2 | 2005-06-21 |
Semiconductor chip assembly with chip in substrate cavity
Grant 6,876,072 - Wang , et al. April 5, 2 | 2005-04-05 |
Method of making a semiconductor chip assembly with a conductive trace and a substrate
Grant 6,872,591 - Wang , et al. March 29, 2 | 2005-03-29 |
Compliant test probe with jagged contact surface
Grant 6,846,735 - Lin , et al. January 25, 2 | 2005-01-25 |
Semiconductor chip assembly with bumped conductive trace
Grant 6,809,414 - Lin , et al. October 26, 2 | 2004-10-26 |
Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly
Grant 6,800,506 - Lin , et al. October 5, 2 | 2004-10-05 |
Three-dimensional stacked semiconductor package with pillars in pillar cavities
Grant 6,794,741 - Lin , et al. September 21, 2 | 2004-09-21 |
Three-dimensional stacked semiconductor package
Grant 6,765,287 - Lin July 20, 2 | 2004-07-20 |
Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly
Grant 6,740,576 - Lin , et al. May 25, 2 | 2004-05-25 |
Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching
Grant 6,699,780 - Chiang , et al. March 2, 2 | 2004-03-02 |
Method of connecting a conductive trace and an insulative base to a semiconductor chip
Grant 6,673,710 - Lin January 6, 2 | 2004-01-06 |
Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip
Grant 6,667,229 - Lin , et al. December 23, 2 | 2003-12-23 |
Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
Grant 6,660,626 - Lin December 9, 2 | 2003-12-09 |
Method of connecting a conductive trace to a semiconductor chip
Grant 6,653,217 - Lin November 25, 2 | 2003-11-25 |
Semiconductor chip assembly with interlocked conductive trace
Grant 6,653,742 - Lin November 25, 2 | 2003-11-25 |
Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit
Grant 6,653,170 - Lin November 25, 2 | 2003-11-25 |
Support circuit with a tapered through-hole for a semiconductor chip assembly
Grant 6,627,824 - Lin September 30, 2 | 2003-09-30 |
Semiconductor chip assembly with bumped conductive trace
Grant 6,608,374 - Lin , et al. August 19, 2 | 2003-08-19 |
Method of manufacturing a multilayer interconnect substrate
Grant 6,593,224 - Lin July 15, 2 | 2003-07-15 |
Semiconductor chip assembly with interlocked conductive trace
Grant 6,576,539 - Lin June 10, 2 | 2003-06-10 |
Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
Grant 6,576,493 - Lin , et al. June 10, 2 | 2003-06-10 |
Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
Grant 6,562,657 - Lin May 13, 2 | 2003-05-13 |
Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive
Grant 6,551,861 - Lin April 22, 2 | 2003-04-22 |
Method of connecting a bumped compliant conductive trace to a semiconductor chip
Grant 6,537,851 - Lin , et al. March 25, 2 | 2003-03-25 |
Three-dimensional stacked semiconductor package
Grant 6,509,639 - Lin January 21, 2 | 2003-01-21 |
Three-dimensional stacked semiconductor package
Grant 6,451,626 - Lin September 17, 2 | 2002-09-17 |
Bumpless flip chip assembly with solder via
App 20020127772 - Lin, Charles W.C. | 2002-09-12 |
Bumpless flip chip assembly with solder via
App 20020125581 - Lin, Charles W.C. | 2002-09-12 |
Semiconductor chip assembly with bumped molded substrate
Grant 6,444,489 - Lin September 3, 2 | 2002-09-03 |
Method of connecting a conductive trace to a semiconductor chip
Grant 6,440,835 - Lin August 27, 2 | 2002-08-27 |
Semiconductor chip assembly with bumped molded substrate
App 20020076911 - Lin, Charles W.C. | 2002-06-20 |
Method of making a support circuit for a semiconductor chip assembly
Grant 6,402,970 - Lin June 11, 2 | 2002-06-11 |
Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly
Grant 6,350,386 - Lin February 26, 2 | 2002-02-26 |
Semiconductor chip assembly with ball bond connection joint
Grant 6,350,632 - Lin February 26, 2 | 2002-02-26 |
Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
Grant 6,350,633 - Lin February 26, 2 | 2002-02-26 |
Bumpless Flip Chip Assembly With Strips-in-via And Plating
App 20020005591 - LIN, CHARLES W.C. | 2002-01-17 |
Selective patterning of metallization on a dielectric substrate
Grant 5,830,533 - Lin , et al. November 3, 1 | 1998-11-03 |
Method for producing conductive patterns
Grant 5,358,604 - Lin , et al. October 25, 1 | 1994-10-25 |
Methods and apparatus for electroplating electrical contacts
Grant 5,271,822 - Nolan , et al. December 21, 1 | 1993-12-21 |
Protective layer for preventing electroless deposition on a dielectric
Grant 5,192,581 - Hirsch , et al. * March 9, 1 | 1993-03-09 |
Selective electroless plating process for metal conductors
Grant 5,167,992 - Lin , et al. December 1, 1 | 1992-12-01 |
Multilayer electrical interconnect fabrication with few process steps
Grant 5,118,385 - Kumar , et al. June 2, 1 | 1992-06-02 |
Detecting completion of electroless via fill
Grant 5,116,463 - Lin , et al. May 26, 1 | 1992-05-26 |
Method of patterning electroless plated metal on a polymer substrate
Grant 4,981,715 - Hirsch , et al. January 1, 1 | 1991-01-01 |
Copper etching solution and method
Grant 4,952,275 - Lin , et al. August 28, 1 | 1990-08-28 |
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