loadpatents
name:-0.016066074371338
name:-0.014782905578613
name:-0.00059890747070312
Lin; Chao-Yen Patent Filings

Lin; Chao-Yen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chao-Yen.The latest application filed is for "chip package and method for forming the same".

Company Profile
0.14.14
  • Lin; Chao-Yen - New Taipei TW
  • LIN; Chao-Yen - New Taipei City TW
  • Lin; Chao-Yen - Ruifang Township, Taipei County N/A TW
  • Lin; Chao-Yen - Ruifang Township Taipei County TW
  • LIN; Chao-Yen - Taipei TW
  • Lin; Chao-Yen - Luzhou City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Chip package and method for forming the same
Grant 9,437,478 - Ho , et al. September 6, 2
2016-09-06
Chip package
Grant 9,425,134 - Ho , et al. August 23, 2
2016-08-23
Chip package and method for forming the same
Grant 9,355,970 - Huang , et al. May 31, 2
2016-05-31
Chip package and method for forming the same
Grant 9,355,975 - Ho , et al. May 31, 2
2016-05-31
Chip Package And Method For Forming The Same
App 20160086896 - HUANG; Yu-Lung ;   et al.
2016-03-24
Chip package
Grant 9,209,124 - Huang , et al. December 8, 2
2015-12-08
Chip package and method for forming the same
Grant 9,196,594 - Lin , et al. November 24, 2
2015-11-24
Chip package and method for forming the same
Grant 9,030,011 - Lin , et al. May 12, 2
2015-05-12
Stacked chip package and method for forming the same
Grant 8,963,312 - Ho , et al. February 24, 2
2015-02-24
Chip package and method for forming the same
Grant 8,952,501 - Huang , et al. February 10, 2
2015-02-10
Stacked Chip Package And Method For Forming The Same
App 20140332983 - HO; Yen-Shih ;   et al.
2014-11-13
Chip Package
App 20140332968 - HO; Yen-Shih ;   et al.
2014-11-13
Chip Package And Method For Forming The Same
App 20140332969 - HO; Yen-Shih ;   et al.
2014-11-13
Chip Package And Method For Forming The Same
App 20140332908 - HO; Yen-Shih ;   et al.
2014-11-13
Chip Package And Method For Forming The Same
App 20140328523 - LIN; Chao-Yen ;   et al.
2014-11-06
Chip Package And Method For Forming The Same
App 20140054786 - HUANG; Yu-Lung ;   et al.
2014-02-27
Chip Package And Method For Forming The Same
App 20130320532 - LIN; Chao-Yen ;   et al.
2013-12-05
Chip Package And Method For Forming The Same
App 20130307125 - HUANG; Yu-Lung ;   et al.
2013-11-21
Chip package and method for forming the same
Grant 8,507,321 - Lin , et al. August 13, 2
2013-08-13
Chip package and method for forming the same
Grant 8,502,393 - Lin , et al. August 6, 2
2013-08-06
Chip Package And Method For Forming The Same
App 20130043570 - LIN; Chao-Yen ;   et al.
2013-02-21
Chip package and method for forming the same
Grant 8,294,275 - Lin , et al. October 23, 2
2012-10-23
Chip Package And Method For Forming The Same
App 20110278724 - LIN; Chao-Yen ;   et al.
2011-11-17
Chip Package And Method For Forming The Same
App 20110198732 - LIN; Chao-Yen ;   et al.
2011-08-18
Map location system
App 20060255970 - Lin; Chao-Yen ;   et al.
2006-11-16

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