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Patent applications and USPTO patent grants for Lin; Chao-Yen.The latest application filed is for "chip package and method for forming the same".
Patent | Date |
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Chip package and method for forming the same Grant 9,437,478 - Ho , et al. September 6, 2 | 2016-09-06 |
Chip package Grant 9,425,134 - Ho , et al. August 23, 2 | 2016-08-23 |
Chip package and method for forming the same Grant 9,355,970 - Huang , et al. May 31, 2 | 2016-05-31 |
Chip package and method for forming the same Grant 9,355,975 - Ho , et al. May 31, 2 | 2016-05-31 |
Chip Package And Method For Forming The Same App 20160086896 - HUANG; Yu-Lung ;   et al. | 2016-03-24 |
Chip package Grant 9,209,124 - Huang , et al. December 8, 2 | 2015-12-08 |
Chip package and method for forming the same Grant 9,196,594 - Lin , et al. November 24, 2 | 2015-11-24 |
Chip package and method for forming the same Grant 9,030,011 - Lin , et al. May 12, 2 | 2015-05-12 |
Stacked chip package and method for forming the same Grant 8,963,312 - Ho , et al. February 24, 2 | 2015-02-24 |
Chip package and method for forming the same Grant 8,952,501 - Huang , et al. February 10, 2 | 2015-02-10 |
Stacked Chip Package And Method For Forming The Same App 20140332983 - HO; Yen-Shih ;   et al. | 2014-11-13 |
Chip Package App 20140332968 - HO; Yen-Shih ;   et al. | 2014-11-13 |
Chip Package And Method For Forming The Same App 20140332969 - HO; Yen-Shih ;   et al. | 2014-11-13 |
Chip Package And Method For Forming The Same App 20140332908 - HO; Yen-Shih ;   et al. | 2014-11-13 |
Chip Package And Method For Forming The Same App 20140328523 - LIN; Chao-Yen ;   et al. | 2014-11-06 |
Chip Package And Method For Forming The Same App 20140054786 - HUANG; Yu-Lung ;   et al. | 2014-02-27 |
Chip Package And Method For Forming The Same App 20130320532 - LIN; Chao-Yen ;   et al. | 2013-12-05 |
Chip Package And Method For Forming The Same App 20130307125 - HUANG; Yu-Lung ;   et al. | 2013-11-21 |
Chip package and method for forming the same Grant 8,507,321 - Lin , et al. August 13, 2 | 2013-08-13 |
Chip package and method for forming the same Grant 8,502,393 - Lin , et al. August 6, 2 | 2013-08-06 |
Chip Package And Method For Forming The Same App 20130043570 - LIN; Chao-Yen ;   et al. | 2013-02-21 |
Chip package and method for forming the same Grant 8,294,275 - Lin , et al. October 23, 2 | 2012-10-23 |
Chip Package And Method For Forming The Same App 20110278724 - LIN; Chao-Yen ;   et al. | 2011-11-17 |
Chip Package And Method For Forming The Same App 20110198732 - LIN; Chao-Yen ;   et al. | 2011-08-18 |
Map location system App 20060255970 - Lin; Chao-Yen ;   et al. | 2006-11-16 |
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