Lin; Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chang.The latest application filed is for "package structure to enhance yield of tmi interconnections".

Company Profile

1.6.5

Lin; Chang - Ningde CN
Lin; Chang - Portland OR
Lin; Chang - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Massager Grant D949,419 - Lin April 19, 2	2022-04-19
Package structure to enhance yield of TMI interconnections Grant 10,049,971 - De Bonis , et al. August 14, 2	2018-08-14
Package Structure To Enhance Yield of TMI Interconnections App 20170207152 - De Bonis; Thomas J. ; et al.	2017-07-20
Package structure to enhance yield of TMI interconnections Grant 9,613,933 - De Bonis , et al. April 4, 2	2017-04-04
Package Structure To Enhance Yield of TMI Interconnections App 20150255415 - De Bonis; Thomas J. ; et al.	2015-09-10
System for dynamic provisioning for secure, scalable, and extensible networked computer environments Grant 7,792,125 - Miyamoto , et al. September 7, 2	2010-09-07
System for dynamic provisioning of secure, scalable, and extensible networked computer environments App 20060114842 - Miyamoto; Carleton ; et al.	2006-06-01
System for dynamic provisioning of secure, scalable, and extensible networked computer environments Grant 7,027,412 - Miyamoto , et al. April 11, 2	2006-04-11
System for dynamic provisioning of secure, scalable, and extensible networked computer environments App 20020057684 - Miyamoto, Carleton ; et al.	2002-05-16

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