Lin; Chang-Fu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Chang-Fu.The latest application filed is for "electronic package and fabrication method thereof".

Company Profile

29.50.69

Lin; Chang-Fu - Taichung TW
Lin; Chang-Fu - Taichung City TW
- Taichung TW
Lin; Chang-Fu - Taichung Hsien TW
Lin; Chang-Fu - Taiwan N/A CN
Lin; Chang-Fu - Hsinchu TW
Lin; Chang-Fu - Hsin-Chu TW
LIN; Chang-Fu - Hsinchu City TW
Lin; Chang-Fu - Hsin-Chu City TW
Lin, Chang-Fu - Keelung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic package, manufacturing method thereof and conductive structure Grant 11,410,954 - Huang , et al. August 9, 2	2022-08-09
Electronic package and manufacturing method thereof Grant 11,398,429 - Chang , et al. July 26, 2	2022-07-26
Electronic package and method for fabricating the same Grant 11,380,978 - Zhou , et al. July 5, 2	2022-07-05
Electronic Package And Fabrication Method Thereof App 20220189900 - Kuo; Chia-Yu ; et al.	2022-06-16
Electronic Package And Manufacturing Method Thereof App 20220181225 - Chen; Chi-Jen ; et al.	2022-06-09
Electronic Package And Manufacturing Method Thereof App 20220148975 - Chen; Wei-Jhen ; et al.	2022-05-12
Method for fabricating electronic package Grant 11,289,346 - Huang , et al. March 29, 2	2022-03-29
Electronic package Grant 11,289,794 - Lin , et al. March 29, 2	2022-03-29
Electronic Package And Manufacturing Method Thereof App 20220093518 - Chang; Cheng Kai ; et al.	2022-03-24
Electronic Package And Manufacturing Method Thereof App 20220068663 - Huang; Yu-Lung ; et al.	2022-03-03
Electronic package and substrate structure having chamfers Grant 11,227,842 - Wang , et al. January 18, 2	2022-01-18
Electronic Package And Method For Fabricating The Same App 20210343546 - Li; Yung-Ta ; et al.	2021-11-04
Electronic package and method for fabricating the same Grant 11,164,755 - Li , et al. November 2, 2	2021-11-02
Electronic Package, Manufacturing Method Thereof And Conductive Structure App 20210320076 - Huang; Yu-Lung ; et al.	2021-10-14
Method For Fabricating Electronic Package App 20210296295 - Ng; Kong-Toon ; et al.	2021-09-23
Electronic Package And Fabrication Method Thereof App 20210287962 - Huang; Yu-Lung ; et al.	2021-09-16
Electronic Package App 20210280530 - Chen; Chi-Jen ; et al.	2021-09-09
Electronic package and method for manufacturing the same Grant 11,102,890 - Tseng , et al. August 24, 2	2021-08-24
Method for fabricating electronic package Grant 11,101,566 - Chen , et al. August 24, 2	2021-08-24
Electronic package Grant 11,069,661 - Chen , et al. July 20, 2	2021-07-20
Electronic package and method for fabricating the same Grant 11,056,470 - Ng , et al. July 6, 2	2021-07-06
Electronic Package App 20210203057 - Lin; Rung-Jeng ; et al.	2021-07-01
Electronic package, method for fabricating the same, and heat dissipator Grant 10,950,520 - Huang , et al. March 16, 2	2021-03-16
Method For Fabricating Carrier Structure App 20210068260A1 -	2021-03-04
Electronic Package And Method For Fabricating The Same App 20200402965 - Ng; Kong-Toon ; et al.	2020-12-24
Electronic package carrier structure thereof, and method for fabricating the carrier structure Grant 10,863,626 - Huang , et al. December 8, 2	2020-12-08
Electronic Package And Substrate Structure Having Chamfers App 20200350261 - Wang; Po-Hao ; et al.	2020-11-05
Method For Fabricating Electronic Package App 20200343641 - Chen; Han-Hung ; et al.	2020-10-29
Method For Fabricating Electronic Package App 20200335447 - Huang; Chen-Yu ; et al.	2020-10-22
Substrate structure having chamfers Grant 10,763,223 - Wang , et al. Sep	2020-09-01
Method for manufacturing electronic package Grant 10,763,237 - Lo , et al. Sep	2020-09-01
Electronic package and method for fabricating the same Grant 10,756,438 - Chen , et al. A	2020-08-25
Package Stack Structure And Method For Manufacturing The Same App 20200258871 - A1	2020-08-13
Electronic package Grant 10,741,500 - Huang , et al. A	2020-08-11
Semiconductor package and a substrate for packaging Grant 10,679,932 - Lin , et al.	2020-06-09
Electronic Package, Method For Fabricating The Same, And Heat Dissipator App 20200168523 - Huang; Yu-Lung ; et al.	2020-05-28
Electronic package and method for fabricating the same Grant 10,600,708 - Tsai , et al.	2020-03-24
Method For Manufacturing Electronic Package App 20200091109 - Lo; Yu-Min ; et al.	2020-03-19
Electronic Package And Method For Manufacturing The Same App 20200093006 - Tseng; Ying-Chang ; et al.	2020-03-19
Method Of Manufacturing Substrate Structure With Filling Material Formed In Concave Portion App 20200091059 - Lin; Chang-Fu ; et al.	2020-03-19
Package Stacked Structure, Method For Fabricating The Same, And Package Structure App 20200043908 - Chung; Chee-Key ; et al.	2020-02-06
Substrate structure with filling material formed in concave portion Grant 10,522,453 - Lin , et al. Dec	2019-12-31
Method for manufacturing electronic package Grant 10,522,500 - Lo , et al. Dec	2019-12-31
Electronic package and method for fabricating the same Grant 10,510,720 - Lin , et al. Dec	2019-12-17
Electronic Package And Method For Fabricating The Same App 20190273321 - Chen; Han-Hung ; et al.	2019-09-05
Method For Manufacturing Electronic Package App 20190252344 - Lo; Yu-Min ; et al.	2019-08-15
Electronic Package And Method For Fabricating The Same App 20190237374 - Huang; Chen-Yu ; et al.	2019-08-01
Substrate construction and electronic package including the same Grant 10,361,150 - Chung , et al.	2019-07-23
Electronic package and method for fabricating the same Grant 10,354,891 - Wang , et al. July 16, 2	2019-07-16
Electronic Package And Method For Fabricating The Same App 20190181021 - Wang; Po-Hao ; et al.	2019-06-13
Electronic Package And Method For Fabricating The Same App 20190164861 - Tsai; Wen-Shan ; et al.	2019-05-30
Electronic Package And Method For Fabricating The Same App 20190123424 - Zhou; Shi-Min ; et al.	2019-04-25
Electronic Package And Method Of Fabricating The Same App 20190057917 - Tsai; Wen-Shan ; et al.	2019-02-21
Package Stack Structure And Method For Manufacturing The Same App 20180288886 - Chen; Han-Hung ; et al.	2018-10-04
Substrate Construction And Electronic Package Including The Same App 20180269142 - Chung; Chee-Key ; et al.	2018-09-20
Packaging substrate and electronic package having the same Grant 10,062,651 - Liang , et al. August 28, 2	2018-08-28
Package Stack Structure App 20180130774 - Lin; Chang-Fu ; et al.	2018-05-10
Electronic Package And Method For Fabricating The Same App 20180061810 - Lin; Chang-Fu ; et al.	2018-03-01
Package substrate and structure Grant 9,900,996 - Lin , et al. February 20, 2	2018-02-20
Semiconductor device and fabrication method thereof and semiconductor structure Grant 9,842,771 - Lin , et al. December 12, 2	2017-12-12
Electronic Package And Substrate Structure App 20170309579 - Wang; Po-Hao ; et al.	2017-10-26
Semiconductor Package And A Substrate For Packaging App 20170294371 - Lin; Chang-Fu ; et al.	2017-10-12
Substrate Structure And Method Of Manufacturing The Same App 20170207161 - Lin; Chang-Fu ; et al.	2017-07-20
Packaging Substrate And Electronic Package Having The Same App 20170186702 - Liang; Fang-Yu ; et al.	2017-06-29
Semiconductor package and a substrate for packaging Grant 9,666,453 - Lin , et al. May 30, 2	2017-05-30
Semiconductor Package, Semiconductor Substrate, Semiconductor Structure And Fabrication Method Thereof App 20170148679 - Lin; Chang-Fu ; et al.	2017-05-25
Semiconductor device and fabrication method thereof Grant 9,607,963 - Lin , et al. March 28, 2	2017-03-28
Packaging substrate and package structure Grant 9,520,351 - Lin , et al. December 13, 2	2016-12-13
Substrate structure and semiconductor package using the same Grant 9,368,467 - Lin , et al. June 14, 2	2016-06-14
Package Substrate, Package Structure, And Methods Of Fabricating The Same App 20160099204 - Lin; Chang-Fu ; et al.	2016-04-07
Packaging Substrate And Package Structure App 20150332998 - Lin; Chang-Fu ; et al.	2015-11-19
Flip-chip Packaging Substrate, Flip-chip Package And Fabrication Methods Thereof App 20150235914 - Lin; Chang-Fu ; et al.	2015-08-20
Interconnection structure for semiconductor package Grant 9,013,042 - Lin , et al. April 21, 2	2015-04-21
Semiconductor Device And Fabrication Method Thereof And Semiconductor Structure App 20150069605 - Lin; Chang-Fu ; et al.	2015-03-12
Semiconductor Device And Fabrication Method Thereof App 20150014848 - Lin; Chang-Fu ; et al.	2015-01-15
Semiconductor Package, Semiconductor Substrate, Semiconductor Structure And Fabrication Method Thereof App 20150004752 - Lin; Chang-Fu ; et al.	2015-01-01
Fabrication method of semiconductor package Grant 8,895,366 - Huang , et al. November 25, 2	2014-11-25
Fabrication Method Of Semiconductor Package App 20140179067 - Huang; Wen-Home ; et al.	2014-06-26
Semiconductor package and fabrication method thereof Grant 8,698,326 - Huang , et al. April 15, 2	2014-04-15
Interconnection Structure For Semiconductor Package App 20140061928 - Lin; Chang-Fu ; et al.	2014-03-06
Substrate Structure And Semiconductor Package Using The Same App 20130341806 - Lin; Chang-Fu ; et al.	2013-12-26
Substrate Structure And Package Structure App 20130334684 - Lin; Chang-Fu ; et al.	2013-12-19
Semiconductor Package And A Substrate For Packaging App 20130299968 - Lin; Chang-Fu ; et al.	2013-11-14
Systems and methods for control signal and data transmission between various types of electronic modules Grant 8,207,973 - Lin , et al. June 26, 2	2012-06-26
Apparatuses for capturing and storing real-time images Grant 8,194,146 - Lin , et al. June 5, 2	2012-06-05
General purpose interface controller of resoure limited system Grant 7,937,520 - Lin , et al. May 3, 2	2011-05-03
Heat-dissipating structure and heat-dissipating semiconductor package having the same Grant 7,863,731 - Chen , et al. January 4, 2	2011-01-04
Electronic Carrier Board App 20090272563 - Tsai; Kuo-Ching ; et al.	2009-11-05
Processing modules with multilevel cache architecture Grant 7,596,661 - Hsu , et al. September 29, 2	2009-09-29
Apparatuses For Capturing And Storing Real-time Images App 20090179997 - LIN; Chang-Fu ; et al.	2009-07-16
Systems And Methods For Control Signal And Data Transmission Between Various Types Of Electronic Modules App 20090179905 - LIN; Chang-Fu ; et al.	2009-07-16
General Purpose Interface Controller Of Resoure Limited System App 20090182921 - Lin; Chang-Fu ; et al.	2009-07-16
Flip-chip semiconductor package and package substrate applicable thereto App 20080277802 - Tsai; Kuo-Ching ; et al.	2008-11-13
Heat-dissipating structure and heat-dissipating semiconductor package having the same App 20080142955 - Chen; Chin-Te ; et al.	2008-06-19
Semiconductor package and fabrication method thereof App 20080061451 - Huang; Wen-Home ; et al.	2008-03-13
Embedded system with instruction prefetching device, and method for fetching instructions in embedded systems Grant 7,299,341 - Lin November 20, 2	2007-11-20
Embedded system with instruction prefetching device, and method for fetching instructions in embedded systems Grant 7,234,041 - Lin June 19, 2	2007-06-19
Heat dissipating structure and semiconductor package with the same Grant 7,203,072 - Chen , et al. April 10, 2	2007-04-10
Semiconductor package with heat sink Grant 7,196,414 - Lin , et al. March 27, 2	2007-03-27
Processing Modules With Multilevel Cache Architecture App 20070050553 - Hsu; Ting-Cheng ; et al.	2007-03-01
Semiconductor package with heat sink Grant 7,177,155 - Lin , et al. February 13, 2	2007-02-13
Embedded System With Instruction Prefetching Device, And Method For Fetching Instructions In Embedded Systems App 20060200630 - Lin; Chang-Fu	2006-09-07
Chip carrier for semiconductor chip Grant 7,102,239 - Pu , et al. September 5, 2	2006-09-05
Semiconductor package with heat sink Grant 7,057,276 - Lin , et al. June 6, 2	2006-06-06
Semiconductor package with heat sink App 20060017145 - Lin; Chang-Fu ; et al.	2006-01-26
Semiconductor package with heat dissipating structure Grant 6,980,438 - Huang , et al. December 27, 2	2005-12-27
Semiconductor package with heat sink App 20050280132 - Lin, Chang-Fu ; et al.	2005-12-22
Semiconductor package with heat sink and method for fabricating the same and stiffener App 20050199998 - Chen, Chin-Te ; et al.	2005-09-15
Heat dissipating structure and semiconductor package with the same App 20050056926 - Chen, Chin-Te ; et al.	2005-03-17
Chip carrier for semiconductor chip App 20050040524 - Pu, Han-Ping ; et al.	2005-02-24
Semiconductor package with heat dissipating structure App 20050036291 - Huang, Chien-Ping ; et al.	2005-02-17
Semiconductor package with heat sink attached to substrate Grant 6,849,942 - Lin , et al. February 1, 2	2005-02-01
Semiconductor package with heat sink App 20040251538 - Lin, Chang-Fu ; et al.	2004-12-16
Semiconductor package with heat sink App 20040178494 - Lin, Chang-Fu ; et al.	2004-09-16
Semiconductor package with heat sink App 20040174682 - Lin, Chang-Fu ; et al.	2004-09-09
Wireless keyboard capable of implementing handwriting function App 20040155867 - Lin, Chang-Fu	2004-08-12
Embedded system with instruction prefetching device, and method for fetching instructions in embedded systems App 20030233531 - Lin, Chang-Fu	2003-12-18