| Patent | Date |
|---|
Method of forming interconnect structure
Grant 11,456,211 - Lin , et al. September 27, 2 | 2022-09-27 |
Interconnect structure and method
Grant 11,450,563 - Lin , et al. September 20, 2 | 2022-09-20 |
Method Of Forming Interconnect Structure
App 20220037202 - Lin; Bo-Jiun ; et al. | 2022-02-03 |
Interconnect Structure And Method
App 20210343588 - Lin; Bo-Jiun ; et al. | 2021-11-04 |
Porogen Bonded Gap Filling Material in Semiconductor Manufacturing
App 20210098378 - Lin; Bo-Jiun ; et al. | 2021-04-01 |
Porogen bonded gap filling material in semiconductor manufacturing
Grant 10,867,922 - Lin , et al. December 15, 2 | 2020-12-15 |
System and Method of Forming a Porous Low-K Structure
App 20200303184 - Lin; Bo-Jiun ; et al. | 2020-09-24 |
System and method of forming a porous low-K structure
Grant 10,679,846 - Lin , et al. | 2020-06-09 |
System and Method of Forming a Porous Low-K Structure
App 20180308689 - Lin; Bo-Jiun ; et al. | 2018-10-25 |
Interconnect Structure That Avoids Insulating Layer Damage and Methods of Making the Same
App 20180254212 - Lin; Bo-Jiun ; et al. | 2018-09-06 |
Porogen Bonded Gap Filling Material in Semiconductor Manufacturing
App 20180226293 - Lin; Bo-Jiun ; et al. | 2018-08-09 |
Semiconductor device having a porous low-k structure
Grant 10,008,382 - Lin , et al. June 26, 2 | 2018-06-26 |
Porogen bonded gap filling material in semiconductor manufacturing
Grant 9,941,157 - Lin , et al. April 10, 2 | 2018-04-10 |
High boiling temperature solvent additives for semiconductor processing
Grant 9,905,457 - Lin , et al. February 27, 2 | 2018-02-27 |
System and method for dark field inspection
Grant 9,709,905 - Lin , et al. July 18, 2 | 2017-07-18 |
Integrated circuit interconnects and methods of making same
Grant 9,627,256 - Tsai , et al. April 18, 2 | 2017-04-18 |
Semiconductor Device Having a Porous Low-K Structure
App 20170033043 - Lin; Bo-Jiun ; et al. | 2017-02-02 |
Porogen Bonded Gap Filling Material in Semiconductor Manufacturing
App 20160379874 - Lin; Bo-Jiun ; et al. | 2016-12-29 |
High Boiling Temperature Solvent Additives for Semiconductor Processing
App 20160190002 - Lin; Bo-Jiun ; et al. | 2016-06-30 |
System and Method for Dark Field Inspection
App 20150380321 - Lin; Bo-Jiun ; et al. | 2015-12-31 |
System and method for dark field inspection
Grant 9,134,633 - Lin , et al. September 15, 2 | 2015-09-15 |
System And Method For Dark Field Inspection
App 20150179532 - Lin; Bo-Jiun ; et al. | 2015-06-25 |
Interconnect with flexible dielectric layer
Grant 8,836,127 - Lo , et al. September 16, 2 | 2014-09-16 |
Interconnect Structure That Avoids Insulating Layer Damage And Methods Of Making The Same
App 20140252619 - Lin; Bo-Jiun ; et al. | 2014-09-11 |
Integrated Circuit Interconnects And Methods Of Making Same
App 20140239501 - Tsai; Cheng-Hsiung ; et al. | 2014-08-28 |
High mechanical strength additives for porous ultra low-k material
Grant 8,736,014 - Lin , et al. May 27, 2 | 2014-05-27 |
Interconnect With Flexible Dielectric Layer
App 20110115088 - Lo; Ching-Yu ; et al. | 2011-05-19 |
Adhesion Promotion Layer For A Semiconductor Device
App 20110073998 - Lin; Bo-Jiun | 2011-03-31 |
High Mechanical Strength Additives For Porous Ultra Low-k Material
App 20100123224 - Lin; Bo-Jiun ; et al. | 2010-05-20 |
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