Lin; Bih-tiao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lin; Bih-tiao.The latest application filed is for "post-cmp cleaning system".

Company Profile

0.7.6

Lin; Bih-tiao - Hsin-Chu TW
Lin; Bih-tiao - Hsin-Chu City TW
Lin; Bih-Tiao - Ping-Tung TW
Lin; Bih-Tiao - Ping-Tung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Post-CMP cleaning system Grant 7,685,667 - Lin , et al. March 30, 2	2010-03-30
Post-CMP cleaning system App 20060277702 - Lin; Bih-tiao ; et al.	2006-12-14
Reverse electroplating for damascene conductive region formation App 20040235297 - Lin, Bih-Tiao	2004-11-25
Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP Grant 6,821,895 - Lin , et al. November 23, 2	2004-11-23
Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP App 20040166686 - Lin, Bih-Tiao ; et al.	2004-08-26
Chemical mechanical polishing method for fabricating copper damascene structure Grant 6,660,629 - Lin December 9, 2	2003-12-09
Slurry dilution system with an ultrasonic vibrator capable of in-situ adjustment of slurry concentration Grant 6,604,849 - Lin , et al. August 12, 2	2003-08-12
Fabrication method of shallow trench isolation App 20020137305 - Lin, Bih-Tiao ; et al.	2002-09-26
Chemical Mechanical Polishing Method For Fabricating Cooper Damascene Structure App 20020098675 - Lin, Bih-Tiao	2002-07-25
Slurry dilution system with an ultrasonic vibrator capable of in-situ adjustment of slurry concentration App 20020048214 - Lin, Bih-Tiao ; et al.	2002-04-25
Method for simultaneously fabricating a DRAM capacitor and metal interconnections Grant 6,071,789 - Yang , et al. June 6, 2	2000-06-06
Chemical mechanical polishing pad with controlled polish rate Grant 6,054,017 - Yang , et al. April 25, 2	2000-04-25
Method for forming identifying characters on a silicon wafer Grant 6,037,259 - Lin , et al. March 14, 2	2000-03-14

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