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name:-0.015429973602295
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Lim; Young-Sam Patent Filings

Lim; Young-Sam

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Young-Sam.The latest application filed is for "etching composition for an under-bump metallurgy layer".

Company Profile
0.12.18
  • Lim; Young-Sam - Bucheon-si N/A KR
  • Lim; Young-Sam - Wonmi-gu KR
  • Lim; Young-Sam - Seoul KR
  • Lim; Young-Sam - Gyeonggi-do KR
  • Lim; Young-Sam - Seoul-city KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Etching composition for an under-bump metallurgy layer
Grant 8,395,270 - Kang , et al. March 12, 2
2013-03-12
Gettering structures and methods and their application
Grant 8,293,613 - Park , et al. October 23, 2
2012-10-23
Etching Composition For An Under-bump Metallurgy Layer
App 20120112123 - Kang; Dong-Min ;   et al.
2012-05-10
Method of forming a bump structure using an etching composition for an under bump metallurgy layer
Grant 8,110,508 - Kang , et al. February 7, 2
2012-02-07
Gettering structures and methods and their application
App 20110076838 - Park; Young-Soo ;   et al.
2011-03-31
Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
Grant 7,858,527 - Kim , et al. December 28, 2
2010-12-28
Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same
Grant 7,815,496 - Lim , et al. October 19, 2
2010-10-19
Composition For Chemical Mechanical Polishing
App 20100203729 - LEE; Ji-sung ;   et al.
2010-08-12
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
Grant 7,662,022 - Lim , et al. February 16, 2
2010-02-16
Etching composition for an under-bump metallurgy layer and method of forming a bump structure using the same
App 20090176363 - Kang; Dong-Min ;   et al.
2009-07-09
Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity
Grant 7,491,118 - Yun , et al. February 17, 2
2009-02-17
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
App 20090029630 - Lim; Young-Sam ;   et al.
2009-01-29
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
Grant 7,442,111 - Lim , et al. October 28, 2
2008-10-28
Gettering structures and methods and their application
App 20080224269 - Park; Young-Soo ;   et al.
2008-09-18
Method Of Fabricating Semiconductor Wafer
App 20080213982 - Park; Young-Soo ;   et al.
2008-09-04
Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution
App 20080045035 - Lee; Ji-Sung ;   et al.
2008-02-21
Additive Composition, Slurry Composition Including The Same, And Method Of Polishing An Object Using The Slurry Composition
App 20080014838 - KIM; Nam-Soo ;   et al.
2008-01-17
Composition for removing a photoresist and method of forming a bump electrode
App 20070287280 - Kang; Dong-Min ;   et al.
2007-12-13
Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
Grant 7,288,212 - Kim , et al. October 30, 2
2007-10-30
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
App 20070212980 - Lim; Young-Sam ;   et al.
2007-09-13
Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same
App 20070197143 - Lim; Young-Sam ;   et al.
2007-08-23
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
Grant 7,229,337 - Lim , et al. June 12, 2
2007-06-12
Chemical Mechanical Polishing Apparatus and Methods Using a Polishing Surface with Non-Uniform Rigidity
App 20060240749 - Yun; Hyun Joo ;   et al.
2006-10-26
Wafer carrier for minimizing contacting area with wafers
App 20060216942 - Kim; Gi-Jung ;   et al.
2006-09-28
Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity
Grant 7,090,570 - Yun , et al. August 15, 2
2006-08-15
Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity
App 20050095958 - Yun, Hyun Joo ;   et al.
2005-05-05
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
App 20040253910 - Lim, Young-Sam ;   et al.
2004-12-16
Preparation and use of an abrasive slurry composition
App 20040023491 - Lim, Young-Sam ;   et al.
2004-02-05
Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
App 20030092265 - Kim, Nam-Soo ;   et al.
2003-05-15

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