Patent | Date |
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Etching composition for an under-bump metallurgy layer Grant 8,395,270 - Kang , et al. March 12, 2 | 2013-03-12 |
Gettering structures and methods and their application Grant 8,293,613 - Park , et al. October 23, 2 | 2012-10-23 |
Etching Composition For An Under-bump Metallurgy Layer App 20120112123 - Kang; Dong-Min ;   et al. | 2012-05-10 |
Method of forming a bump structure using an etching composition for an under bump metallurgy layer Grant 8,110,508 - Kang , et al. February 7, 2 | 2012-02-07 |
Gettering structures and methods and their application App 20110076838 - Park; Young-Soo ;   et al. | 2011-03-31 |
Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition Grant 7,858,527 - Kim , et al. December 28, 2 | 2010-12-28 |
Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same Grant 7,815,496 - Lim , et al. October 19, 2 | 2010-10-19 |
Composition For Chemical Mechanical Polishing App 20100203729 - LEE; Ji-sung ;   et al. | 2010-08-12 |
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting Grant 7,662,022 - Lim , et al. February 16, 2 | 2010-02-16 |
Etching composition for an under-bump metallurgy layer and method of forming a bump structure using the same App 20090176363 - Kang; Dong-Min ;   et al. | 2009-07-09 |
Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity Grant 7,491,118 - Yun , et al. February 17, 2 | 2009-02-17 |
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting App 20090029630 - Lim; Young-Sam ;   et al. | 2009-01-29 |
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting Grant 7,442,111 - Lim , et al. October 28, 2 | 2008-10-28 |
Gettering structures and methods and their application App 20080224269 - Park; Young-Soo ;   et al. | 2008-09-18 |
Method Of Fabricating Semiconductor Wafer App 20080213982 - Park; Young-Soo ;   et al. | 2008-09-04 |
Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution App 20080045035 - Lee; Ji-Sung ;   et al. | 2008-02-21 |
Additive Composition, Slurry Composition Including The Same, And Method Of Polishing An Object Using The Slurry Composition App 20080014838 - KIM; Nam-Soo ;   et al. | 2008-01-17 |
Composition for removing a photoresist and method of forming a bump electrode App 20070287280 - Kang; Dong-Min ;   et al. | 2007-12-13 |
Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition Grant 7,288,212 - Kim , et al. October 30, 2 | 2007-10-30 |
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting App 20070212980 - Lim; Young-Sam ;   et al. | 2007-09-13 |
Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same App 20070197143 - Lim; Young-Sam ;   et al. | 2007-08-23 |
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting Grant 7,229,337 - Lim , et al. June 12, 2 | 2007-06-12 |
Chemical Mechanical Polishing Apparatus and Methods Using a Polishing Surface with Non-Uniform Rigidity App 20060240749 - Yun; Hyun Joo ;   et al. | 2006-10-26 |
Wafer carrier for minimizing contacting area with wafers App 20060216942 - Kim; Gi-Jung ;   et al. | 2006-09-28 |
Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity Grant 7,090,570 - Yun , et al. August 15, 2 | 2006-08-15 |
Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity App 20050095958 - Yun, Hyun Joo ;   et al. | 2005-05-05 |
Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting App 20040253910 - Lim, Young-Sam ;   et al. | 2004-12-16 |
Preparation and use of an abrasive slurry composition App 20040023491 - Lim, Young-Sam ;   et al. | 2004-02-05 |
Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition App 20030092265 - Kim, Nam-Soo ;   et al. | 2003-05-15 |