Lim; Victor Seng Keong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Victor Seng Keong.The latest application filed is for "defect detection recipe definition".

Company Profile

0.13.9

Lim; Victor Seng Keong - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Defect monitoring in semiconductor device fabrication Grant 8,339,449 - Lim , et al. December 25, 2	2012-12-25
Defect detection recipe definition Grant 8,289,508 - Lim , et al. October 16, 2	2012-10-16
Test chiplets for devices Grant 8,178,368 - Lim , et al. May 15, 2	2012-05-15
Defect Detection Recipe Definition App 20110116085 - LIM; Victor Seng Keong ; et al.	2011-05-19
Test Chiplets For Devices App 20110114949 - LIM; Victor Seng Keong ; et al.	2011-05-19
E-beam inspection structure for leakage analysis Grant 7,939,348 - Lim , et al. May 10, 2	2011-05-10
Defect Monitoring In Semiconductor Device Fabrication App 20110032348 - LIM; Barbara Fong Chin ; et al.	2011-02-10
E-beam Inspection Structure For Leakage Analysis App 20090057664 - LIM; Victor Seng Keong ; et al.	2009-03-05
Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures Grant 7,323,406 - Lim , et al. January 29, 2	2008-01-29
Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures App 20060166402 - Lim; Victor Seng-Keong ; et al.	2006-07-27
Extended poly buffer STI scheme Grant 7,060,573 - Lim , et al. June 13, 2	2006-06-13
Copper metal structure for the reduction of intra-metal capacitance Grant 6,815,823 - Teh , et al. November 9, 2	2004-11-09
Novel copper metal structure for the reduction of intra-metal capacitance App 20040065956 - Teh, Young-Way ; et al.	2004-04-08
STI scheme to prevent fox recess during pre-CMP HF dip Grant 6,673,695 - Lim , et al. January 6, 2	2004-01-06
Multiple step CMP polishing Grant 6,663,472 - Lim , et al. December 16, 2	2003-12-16
Copper metal structure for the reduction of intra-metal capacitance Grant 6,649,517 - Teh , et al. November 18, 2	2003-11-18
Linear polishing for improving substrate uniformity App 20030203710 - Balakumar, Subramanian ; et al.	2003-10-30
Multiple step CMP polishing App 20030148712 - Lim, Victor Seng-Keong ; et al.	2003-08-07
Extended poly buffer STI scheme App 20020094648 - Lim, Victor Seng Keong ; et al.	2002-07-18
Method for fabricating an air gap shallow trench isolation (STI) structure Grant 6,406,975 - Lim , et al. June 18, 2	2002-06-18
Method to achieve STI planarization Grant 6,403,484 - Lim , et al. June 11, 2	2002-06-11
Method to prevent CU dishing during damascene formation Grant 6,376,376 - Lim , et al. April 23, 2	2002-04-23

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