Lim; Tony K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lim; Tony K..The latest application filed is for "microphone assembly with standoffs for die bonding".
- Lim; Tony K. - Naperville IL
| Patent | Date |
|---|---|
| Microphone Assembly With Standoffs For Die Bonding App 20210392442 - Lim; Tony K. ; et al. | 2021-12-16 |
| Microphone package Grant 10,924,867 - Lim , et al. February 16, 2 | 2021-02-16 |
| Insert Molded Or Over Molded Insulating Layers On Enclosures For Microphone Assemblies App 20210037330 - Talag; Norman Dennis ; et al. | 2021-02-04 |
| Microphone Package App 20200245078 - Kind Code | 2020-07-30 |
| Sensor Package With Ingress Protection App 20200209024 - LIM; Tony K. ; et al. | 2020-07-02 |
| Microelectromechanical system (MEMS) device packaging Grant 10,640,371 - Lim , et al. | 2020-05-05 |
| Microphone package Grant 10,631,099 - Lim , et al. | 2020-04-21 |
| Sensor package with ingress protection Grant 10,591,326 - Lim , et al. | 2020-03-17 |
| Microphone package for fully encapsulated ASIC and wires Grant 10,547,955 - Lim , et al. Ja | 2020-01-28 |
| Microelectromechanical System (mems) Device Packaging App 20190169022 - Lim; Tony K. ; et al. | 2019-06-06 |
| Sensor Package With Ingress Protection App 20190145806 - Lim; Tony K. ; et al. | 2019-05-16 |
| Sensor device with ingress protection Grant 10,291,973 - Lim , et al. | 2019-05-14 |
| Microelectromechanical system (MEMS) device packaging Grant 10,227,232 - Lim , et al. | 2019-03-12 |
| Microphone Package App 20190014421 - Lim; Tony K. ; et al. | 2019-01-10 |
| Microphone Package For Fully Encapsulated Asic And Wires App 20180343524 - Lim; Tony K. ; et al. | 2018-11-29 |
| Sensor Device With Ingress Protection App 20180070162 - Lim; Tony K. ; et al. | 2018-03-08 |
| Microelectromechanical System (mems) Device Packaging App 20180029880 - Lim; Tony K. ; et al. | 2018-02-01 |
| Microphone with coined area Grant 9,883,270 - Lim January 30, 2 | 2018-01-30 |
| Microphone With Coined Area App 20160337735 - Lim; Tony K. | 2016-11-17 |
| Housing and method to control solder creep on housing Grant 9,402,118 - Lim , et al. July 26, 2 | 2016-07-26 |
| Method and Apparatus for an Acoustic Device Having a Coating App 20150172825 - Lim; Tony K. ; et al. | 2015-06-18 |
| Microphone Assembly App 20140037120 - Lim; Tony K. ; et al. | 2014-02-06 |
| Housing And Method To Control Solder Creep On Housing App 20140037124 - Lim; Tony K. ; et al. | 2014-02-06 |
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