Lim; Tiang Hock
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lim; Tiang Hock.The latest application filed is for "method of encapsulating thin semiconductor chip-scale packages".
- Lim; Tiang Hock - Singapore SG
| Patent | Date |
|---|---|
| Method of encapsulating thin semiconductor chip-scale packages Grant 6,544,816 - Lim , et al. April 8, 2 | 2003-04-08 |
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