Lim; Thiam B.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lim; Thiam B..The latest application filed is for "integrated circuit device and method to prevent cracking during surface mount".
- Lim; Thiam B. - Singapore SG
- Lim; Thiam B. - Pasir Ris Gardens SG
- Lim; Thiam B. - #02-04 Pasir Ris Gardens SG
| Patent | Date |
|---|---|
| Integrated circuit device and method to prevent cracking during surface mount Grant 5,434,106 - Lim , et al. July 18, 1 | 1995-07-18 |
| Lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution Grant 5,319,241 - Lim June 7, 1 | 1994-06-07 |
| Integrated circuit device having a polyimide moisture barrier coating Grant 5,313,102 - Lim , et al. May 17, 1 | 1994-05-17 |
| Comb insert for semiconductor packaged devices Grant 5,206,536 - Lim April 27, 1 | 1993-04-27 |
| Integrated circuit device and method to prevent cracking during surface mount Grant 5,164,815 - Lim November 17, 1 | 1992-11-17 |
| Insulated lead frame for semiconductor packaged devices Grant 5,146,312 - Lim September 8, 1 | 1992-09-08 |
| Plug drawing Grant 4,745,787 - Sansome , et al. May 24, 1 | 1988-05-24 |
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