Lim; Taeg Ki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Taeg Ki.The latest application filed is for "method of forming phosphor layer on light-emitting device chip wafer using wafer level mold".

Company Profile

2.15.13

Lim; Taeg Ki - Icheon N/A KR
Lim; Taeg Ki - Cheongju-si N/A KR
- Icheon KR
LIM; Taeg-ki - Hwaseong-si KR
Lim; Taeg Ki - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit package system with support carrier and method of manufacture thereof Grant 8,987,056 - Ha , et al. March 24, 2	2015-03-24
Integrated circuit package system with offset stack Grant 8,659,175 - Ju , et al. February 25, 2	2014-02-25
Integrated circuit package system with wafer scale heat slug Grant 8,618,653 - Ko , et al. December 31, 2	2013-12-31
Integrated circuit package system with wafer scale heat slug Grant 08618653 -	2013-12-31
Method Of Forming Phosphor Layer On Light-emitting Device Chip Wafer Using Wafer Level Mold App 20130183777 - LIM; Taeg-ki	2013-07-18
Integrated circuit package system including honeycomb molding Grant 8,409,921 - Kuan , et al. April 2, 2	2013-04-02
Integrated circuit package system including honeycomb molding Grant 8,217,501 - Kwon , et al. July 10, 2	2012-07-10
Integrated circuit package system with planar interconnects Grant 8,067,831 - Kwon , et al. November 29, 2	2011-11-29
Integrated circuit package system with package integration Grant 8,067,275 - Ko , et al. November 29, 2	2011-11-29
Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof Grant 7,969,023 - Lim , et al. June 28, 2	2011-06-28
Integrated Circuit Package System Including Honeycomb Molding App 20100279504 - Kuan; Heap Hoe ; et al.	2010-11-04
Integrated Circuit Package System Including Honeycomb Molding App 20100237488 - Kwon; Hyeog Chan ; et al.	2010-09-23
Integrated circuit package system including honeycomb molding Grant 7,737,539 - Kwon , et al. June 15, 2	2010-06-15
Integrated Circuit Package System With Support Carrier And Method Of Manufacture Thereof App 20100123242 - Ha; Jong-Woo ; et al.	2010-05-20
Integrated circuit package system with thermo-mechanical interlocking substrates Grant 7,656,017 - Kim , et al. February 2, 2	2010-02-02
System For Handling Semiconductor Dies App 20090191029 - Lim; Taeg Ki ; et al.	2009-07-30
Integrated Circuit Package System With Wafer Scale Heat Slug App 20090189275 - Ko; WonJun ; et al.	2009-07-30
Integrated Circuit Package System With Package Integration App 20090155961 - Ko; WonJun ; et al.	2009-06-18
Integrated Circuit Package System With Triple Film Spacer App 20090020893 - Lim; Taeg Ki ; et al.	2009-01-22
Stacked integrated circuit package system with connection protection Grant 7,443,037 - Kim , et al. October 28, 2	2008-10-28
Integrated Circuit Package System With Thermo-mechanical Interlocking Substrates App 20080142943 - Kim; Hyun Joung ; et al.	2008-06-19
Integrated Circuit Package System With Offset Stack App 20070296086 - Ju; Jong Wook ; et al.	2007-12-27
Stacked Integrated Circuit Package System With Connection Protection App 20070229107 - Kim; Hyun Joung ; et al.	2007-10-04
Integrated Circuit Package System Including Honeycomb Molding App 20070158806 - Kwon; Hyeog Chan ; et al.	2007-07-12
Integrated Circuit Package System With Planar Interconnects App 20070063331 - Kwon; Hyeog Chan ; et al.	2007-03-22

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