Lim; Sung Jae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lim; Sung Jae.The latest application filed is for "emi shielding for flip chip package with exposed die backside".
- Lim; Sung Jae - Incheon KR
- LIM; Sung-Jae - Seoul KR
- Lim; Sung-Jae - Asan-si KR
| Patent | Date |
|---|---|
| EMI Shielding for Flip Chip Package with Exposed Die Backside App 20220270983 - Son; Dong Won ; et al. | 2022-08-25 |
| EMI shielding for flip chip package with exposed die backside Grant 11,355,452 - Son , et al. June 7, 2 | 2022-06-07 |
| EMI Shielding for Flip Chip Package with Exposed Die Backside App 20210028122 - Son; Dong Won ; et al. | 2021-01-28 |
| Method For Payment Using Short Range Communication And Electronic Device Therefor App 20170004485 - LEE; Chang-Ho ; et al. | 2017-01-05 |
| Apparatus for testing a semiconductor package Grant 9,244,119 - Choi , et al. January 26, 2 | 2016-01-26 |
| Apparatus For Testing A Semiconductor Package App 20140253168 - CHOI; Gui-Heum ; et al. | 2014-09-11 |
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