LIM; Soyoung

Patent Applications and Registrations

Patent applications and USPTO patent grants for LIM; Soyoung.The latest application filed is for "package substrate film and semiconductor package including the same".

Company Profile

2.8.8

LIM; Soyoung - Hwaseong-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package Substrate Film And Semiconductor Package Including The Same App 20220173026 - YANG; Kyoungsuk ; et al.	2022-06-02
Film product, film packages and package modules using the same Grant 10,304,764 - Chung , et al.	2019-05-28
Film for semiconductor package, semiconductor package using film and display device including the same Grant 9,922,891 - Lim , et al. March 20, 2	2018-03-20
Film Product, Film Packages And Package Modules Using The Same App 20170372992 - CHUNG; Yechung ; et al.	2017-12-28
Film For Semiconductor Package, Semiconductor Package Using Film And Display Device Including The Same App 20170125314 - LIM; Soyoung ; et al.	2017-05-04
Film for semiconductor package, semiconductor package using film and display device including the same Grant 9,576,865 - Lim , et al. February 21, 2	2017-02-21
Film For Semiconductor Package, Semiconductor Package Using Film And Display Device Including The Same App 20160197020 - LIM; Soyoung ; et al.	2016-07-07
Display apparatus Grant 9,313,889 - Yang , et al. April 12, 2	2016-04-12
Display Apparatus App 20140328031 - YANG; KYOUNGSUK ; et al.	2014-11-06
Method of fabricating semiconductor package having substrate with solder ball connections Grant 8,828,795 - Jo , et al. September 9, 2	2014-09-09
Method Of Fabricating Semiconductor Package App 20130005092 - JO; Sang-Gui ; et al.	2013-01-03
Semiconductor package having substrate with solder ball connections and method of fabricating the same Grant 8,304,892 - Jo , et al. November 6, 2	2012-11-06
Semiconductor packages including heat slugs Grant 8,269,342 - Kim , et al. September 18, 2	2012-09-18
Semiconductor packages including heat slugs App 20110018119 - Kim; Yonghoon ; et al.	2011-01-27
Semiconductor Package And Method Of Fabricating The Same App 20100314760 - Jo; Sang Gui ; et al.	2010-12-16

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