| Patent | Date |
|---|
Film Type Package Comprising A Plurality Of Test Pads Disposed On A Plurality Of Margin Areas And Separated From A Plurality Of First Connection Pads By A Cut Line
App 20220113577 - HAN; Byung Hun ; et al. | 2022-04-14 |
Film type package comprising a plurality of test pads disposed on a plurality of margin areas and separated from a plurality of first connection pads by a cut line
Grant 11,231,626 - Han , et al. January 25, 2 | 2022-01-25 |
Film for a package substrate
Grant 10,903,127 - Lim , et al. January 26, 2 | 2021-01-26 |
Film For A Package Substrate
App 20200303270 - LIM; So Young ; et al. | 2020-09-24 |
Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device
Grant 10,699,974 - Lim , et al. | 2020-06-30 |
Film Type Package And Display Apparatus Having The Same
App 20190371691 - HAN; Byung Hun ; et al. | 2019-12-05 |
Film For Package Substrate, Semiconductor Package, Display Device, And Methods Of Fabricating The Film, The Semiconductor Package, The Display Device
App 20190122943 - LIM; So Young ; et al. | 2019-04-25 |
Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same
Grant 9,869,717 - Lim , et al. January 16, 2 | 2018-01-16 |
Chip On Film Package And Display Device Including The Same
App 20160351155 - PARK; JIN-WOO ; et al. | 2016-12-01 |
Test Pad Structure, A Pad Structure For Inspecting A Semiconductor Chip And A Wiring Substrate For A Tape Packaging Having The Same
App 20160334463 - LIM; So-Young ; et al. | 2016-11-17 |
Chip on film package including distributed via plugs
Grant 9,437,526 - Lim , et al. September 6, 2 | 2016-09-06 |
Chip On Film Package And Display Device Including The Same
App 20160162091 - HA; JEONG-KYU ; et al. | 2016-06-09 |
Device And Method For Providing Poi Information Using Poi Grouping
App 20160132513 - Lim; So-Young ; et al. | 2016-05-12 |
Chip on film package and display device including the same
Grant 9,280,182 - Ha , et al. March 8, 2 | 2016-03-08 |
Chip on film (COF) substrate, COF package and display device including the same
Grant 9,059,162 - Ha , et al. June 16, 2 | 2015-06-16 |
Semiconductor device with interposer and method manufacturing same
Grant 9,059,067 - Choi , et al. June 16, 2 | 2015-06-16 |
Chip On Film Package Including Distributed Via Plugs
App 20140327148 - LIM; So-Young ; et al. | 2014-11-06 |
Chip On Film Package And Display Device Including The Same
App 20140246687 - Ha; Jeong-Kyu ; et al. | 2014-09-04 |
Chip on Film (COF) Substrate, COF Package and Display Device Including the Same
App 20140054793 - Ha; Jeong-Kyu ; et al. | 2014-02-27 |
Tape package
Grant 8,581,373 - Kim , et al. November 12, 2 | 2013-11-12 |
Semiconductor package including power ball matrix and power ring having improved power integrity
Grant 8,502,084 - Song , et al. August 6, 2 | 2013-08-06 |
Test Pad Structure, A Pad Structure For Inspecting A Semiconductor Chip And A Wiring Substrate For A Tape Package Having The Same
App 20130127486 - LIM; So-Young ; et al. | 2013-05-23 |
Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure
Grant 8,436,462 - Kim , et al. May 7, 2 | 2013-05-07 |
Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same
Grant 8,384,407 - Lim , et al. February 26, 2 | 2013-02-26 |
Semiconductor Package And Display Panel Assembly Having The Same
App 20120138968 - Shin; Na-Rae ; et al. | 2012-06-07 |
Semiconductor Package
App 20120126431 - KIM; Yong-Hoon ; et al. | 2012-05-24 |
Semiconductor Device With Interposer And Method Manufacturing Same
App 20120091468 - Choi; Yun-seok ; et al. | 2012-04-19 |
Solar Cell Module And Method Of Manufacturing The Same
App 20120085393 - Cho; Young-Sang ; et al. | 2012-04-12 |
Solar Cell Module And Method Of Manufacturing The Same
App 20120085383 - Cho; Young-Sang ; et al. | 2012-04-12 |
Tape Package
App 20120068349 - Kim; Dong-han ; et al. | 2012-03-22 |
Semiconductor Housing Package, Semiconductor Package Structure Including The Semiconductor Housing Package, And Processor-Based System Including The Semiconductor Package Structure
App 20110233755 - Kim; Dong-Han ; et al. | 2011-09-29 |
Substrate for semiconductor package
Grant 7,936,232 - Song , et al. May 3, 2 | 2011-05-03 |
Semiconductor Package Including Power Ball Matrix And Power Ring Having Improved Power Integrity
App 20100276189 - Song; Eun seok ; et al. | 2010-11-04 |
Substrate For Semiconductor Package
App 20100264524 - SONG; Eun-seok ; et al. | 2010-10-21 |
Substrate for semiconductor package
Grant 7,760,044 - Song , et al. July 20, 2 | 2010-07-20 |
Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same
App 20090322362 - Lim; So-Young ; et al. | 2009-12-31 |
Substrate For Semiconductor Package
App 20070285188 - SONG; Eun-seok ; et al. | 2007-12-13 |
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