Lim; Shoa-Siong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Shoa-Siong.The latest application filed is for "semiconductor structure and semiconductor package device using the same".

Company Profile

1.17.15

Lim; Shoa-Siong - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor structure and semiconductor package device using the same Grant 10,763,133 - Chew , et al. Sep	2020-09-01
Multi-layer substrate for semiconductor packaging Grant 10,446,457 - Lim , et al. Oc	2019-10-15
Semiconductor Structure And Semiconductor Package Device Using The Same App 20190035643 - CHEW; Jimmy Hwee-Seng ; et al.	2019-01-31
Multi-Layer Substrate For Semiconductor Packaging App 20180323121 - LIM; Shoa Siong ; et al.	2018-11-08
Method of manufacturing semiconductor package device Grant 10,109,503 - Chew , et al. October 23, 2	2018-10-23
Multi-layer substrate for semiconductor packaging Grant 10,049,950 - Lim , et al. August 14, 2	2018-08-14
Semiconductor Substrate App 20180108584 - Lim; Shoa-Siong ; et al.	2018-04-19
Semiconductor package and manufacturing method thereof Grant 9,847,268 - Lim , et al. December 19, 2	2017-12-19
Manufacturing method of forming an etch-back type semiconductor package with locking anchorages Grant 9,305,868 - Chew , et al. April 5, 2	2016-04-05
Semiconductor Package App 20150287673 - Lim; Shoa-Siong ; et al.	2015-10-08
Manufacturing method for semiconductor package Grant 9,136,215 - Lim , et al. September 15, 2	2015-09-15
Method for device packaging Grant 9,120,169 - Chew , et al. September 1, 2	2015-09-01
Manufacturing methods of semiconductor substrate, package and device Grant 9,059,050 - Lim , et al. June 16, 2	2015-06-16
Multi-Layer Substrate For Semiconductor Packaging App 20150155214 - Lim; Shoa Siong ; et al.	2015-06-04
Etch-back Type Semiconductor Package, Substrate And Manufacturing Method Thereof App 20150111345 - CHEW; Hwee-Seng Jimmy ; et al.	2015-04-23
Etch-back type semiconductor package, substrate and manufacturing method thereof Grant 8,917,521 - Chew , et al. December 23, 2	2014-12-23
Manufacturing Methods Of Semiconductor Substrate, Package And Device App 20140134806 - Lim; Shoa-Siong ; et al.	2014-05-15
Semiconductor substrate, package and device Grant 8,664,750 - Lim , et al. March 4, 2	2014-03-04
Semiconductor Substrate, Package And Device And Manufacturing Methods Thereof App 20130020710 - Chew; Jimmy Hwee-Seng ; et al.	2013-01-24
In-situ Melt And Reflow Process For Forming Flip-chip Interconnections And Systems Thereof App 20110287560 - Chew; Hwee Seng ; et al.	2011-11-24
Etch-back Type Semiconductor Package, Substrate And Manufacturing Method Thereof App 20110267789 - CHEW; Hwee-Seng Jimmy ; et al.	2011-11-03
Semiconductor Package and Trace Substrate with Enhanced Routing Design Flexibility and Method of Manufacturing Thereof App 20110210442 - Lim; Shoa Siong ; et al.	2011-09-01
Semiconductor Substrate, Package and Device and Manufacturing Methods Thereof App 20110210429 - Lim; Shoa Siong ; et al.	2011-09-01
Semiconductor Package and Manufacturing Method Thereof App 20110210439 - Lim; Shoa Siong ; et al.	2011-09-01
Method For Forming And Releasing Interconnects App 20090091025 - Wong; Ee Hua ; et al.	2009-04-09

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