Lim; Seol-Hee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Seol-Hee.The latest application filed is for "organic metal compound, composition for depositing thin film comprising the organic metal compound, manufacturing method for thin film using the composition, thin film manufactured from the composition, and semiconductor device including the thin film".

Company Profile

12.11.18

Lim; Seol-Hee - Seoul KR
LIM; Seol Hee - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polyester resin composition and preparation method thereof Grant 11,267,934 - Lim , et al. March 8, 2	2022-03-08
Heat shrinkable film composition comprising polyethyleneterephtalate resin and polyester based copolymer, and heat shrinkable film Grant 11,236,210 - Lim , et al. February 1, 2	2022-02-01
Heat shrinkable film comprising polyester based copolymer Grant 11,203,676 - Lim , et al. December 21, 2	2021-12-21
Organic Metal Compound, Composition For Depositing Thin Film Comprising The Organic Metal Compound, Manufacturing Method For Thin Film Using The Composition, Thin Film Manufactured From The Composition, And Semiconductor Device Including The Thin Film App 20210193459 - IM; Sangkyun ; et al.	2021-06-24
Thermo-shrinkable polyester film Grant 11,020,947 - Lim , et al. June 1, 2	2021-06-01
Composition For Depositing Thin Film, Manufacturing Method For Thin Film Using The Composition, Thin Film Manufactured From The Composition, And Semiconductor Device Including The Thin Film App 20210111244 - KIM; Yong Tae ; et al.	2021-04-15
Polyester Based Copolymer Resin And Molded Product Comprising The Same App 20200299457 - LIM; Seol-Hee ; et al.	2020-09-24
Heat Shrinkable Film Comprising Polyester Based Copolymer App 20200277459 - LIM; Seol-Hee ; et al.	2020-09-03
Heat Shrinkable Film Composition Comprising Polyethyleneterephtalate Resin And Copolymer Polyester Resin, And Heat Shrinkable Fi App 20200255611 - Kind Code	2020-08-13
Heat shrinkable film composition comprising polyethyleneterephtalate resin and polyester based copolymer, and heat shrinkable film Grant 10,723,852 - Lim , et al.	2020-07-28
Polyester based copolymer resin and molded product comprising the same Grant 10,717,811 - Lim , et al.	2020-07-21
Heat shrinkable film comprising polyester based copolymer Grant 10,696,806 - Lim , et al. June 30, 2	2020-06-30
Polyester Resin Composition And Preparation Method Thereof App 20200109240 - LIM; Seol-Hee ; et al.	2020-04-09
Mdo Thermoresistant Heat-shrinkable Film App 20200062954 - LIM; Seol-Hee ; et al.	2020-02-27
Polyester resin composition and preparation method thereof Grant 10,550,223 - Lim , et al. Fe	2020-02-04
Mdo Thermoresistant Heat-shrinkable Multilayer Film App 20190329538 - LIM; Seol-Hee ; et al.	2019-10-31
Heat Shrinkable Film Composition Comprising Polyethyleneterephtalate Resin And Polyester Based Copolymer, And Heat Shrinkable Film App 20180223060 - LIM; Seol-Hee ; et al.	2018-08-09
Semiconductor memory card, printed circuit board for memory card and method of fabricating the same Grant 9,867,288 - Lim January 9, 2	2018-01-09
Printed circuit board for memory card Grant 9,788,438 - Lim , et al. October 10, 2	2017-10-10
Polyester Resin Composition And Preparation Method Thereof App 20170275419 - LIM; Seol-Hee ; et al.	2017-09-28
Thermo-shrinkable Polyester Film App 20170232721 - LIM; Seol-Hee ; et al.	2017-08-17
Multilayer Polyester Sheet And Molded Product Made Of The Same App 20170144420 - LIM; Seol-Hee ; et al.	2017-05-25
Printed circuit board and method of manufacturing the same Grant 9,661,750 - Jo , et al. May 23, 2	2017-05-23
Heat Shrinkable Film Comprising Polyester Based Copolymer App 20160130414 - LIM; Seol-Hee ; et al.	2016-05-12
Heat Shrinkable Film Composition Comprising Polyethyleneterephtalate Resin And Polyester Based Copolymer, And Heat Shrinkable Film App 20160122485 - LIM; Seol-Hee ; et al.	2016-05-05
Polyester Based Copolymer Resin And Molded Product Comprising The Same App 20160068629 - LIM; Seol-Hee ; et al.	2016-03-10
Semiconductor Memory Card, Printed Circuit Board For Memory Card And Method Of Fabricating The Same App 20150016049 - Lim; Seol Hee	2015-01-15
Printed Circuit Board And Method Of Manufacturing The Same App 20150000966 - JO; Yun Kyoung ; et al.	2015-01-01
Printed Circuit Board For Memory Card And Method Of Manufacturing The Same App 20140369016 - Lim; Seol Hee ; et al.	2014-12-18

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