Lim; Sang Joon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Sang Joon.The latest application filed is for "stacked semiconductor package having an interposer".

Company Profile

3.11.15

Lim; Sang Joon - Icheon-si KR
LIM; Sang Joon - Icheon-si Gyeonggi-do KR
Lim; Sang Joon - Gyeonggi-do N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor packages having EMI shielding layers Grant 10,923,434 - Choi , et al. February 16, 2	2021-02-16
Stacked Semiconductor Package Having An Interposer App 20200402959 - EOM; Ju Il ; et al.	2020-12-24
Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure Grant 10,615,129 - Jung , et al.	2020-04-07
Semiconductor Packages Having Emi Shielding Layers App 20190333865 - CHOI; Bok Kyu ; et al.	2019-10-31
Package Substrates With Signal Transmission Paths Relating To Parasitic Capacitance Values App 20190080999 - EOM; Juil ; et al.	2019-03-14
Semiconductor Package Having An Electro-magnetic Interference Shielding Or Electro-magnetic Wave Scattering Structure App 20190081009 - JUNG; Won Duck ; et al.	2019-03-14
Semiconductor package having an electro-magnetic interference shielding or electro-magnetic wave scattering structure Grant 10,157,858 - Jung , et al. Dec	2018-12-18
Semiconductor package having a redistribution line structure Grant 10,115,708 - Eom , et al. October 30, 2	2018-10-30
Semiconductor Package Having An Electro-magnetic Interference Shielding Or Electro-magnetic Wave Scattering Structure App 20180247897 - JUNG; Won Duck ; et al.	2018-08-30
Semiconductor Package Having A Redistribution Line Structure App 20180138150 - EOM; Ju Il ; et al.	2018-05-17
Electrical characteristics of package substrates and semiconductor packages including the same Grant 9,609,742 - Jang , et al. March 28, 2	2017-03-28
Package substrate with band stop filter and semiconductor package including the same Grant 9,231,286 - Bang , et al. January 5, 2	2016-01-05
Electrical Characteristics Of Package Substrates And Semiconductor Packages Including The Same App 20140175680 - JANG; Eul Chul ; et al.	2014-06-26
Package Substrate With Band Stop Filter And Semiconductor Package Including The Same App 20140176262 - BANG; Byung Jun ; et al.	2014-06-26
Semiconductor package having substrate for high speed semiconductor package Grant 8,441,116 - Lee , et al. May 14, 2	2013-05-14
Wafer Level Chip Scale Package Having An Enhanced Heat Exchange Efficiency With An Emf Shield And A Method For Fabricating The Same App 20130078807 - PARK; Chang Jun ; et al.	2013-03-28
Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same Grant 8,338,921 - Park , et al. December 25, 2	2012-12-25
Substrate For High Speed Semiconductor Package And Semiconductor Package Having The Same App 20120217637 - LEE; Woong Sun ; et al.	2012-08-30
Wafer Level Chip Scale Package Having An Enhanced Heat Exchange Efficiency With An Emf Shield And A Method For Fabricating The Same App 20120049385 - PARK; Chang Jun ; et al.	2012-03-01
Circuit board having conductive shield member and semiconductor package using the same Grant 8,084,839 - Choi , et al. December 27, 2	2011-12-27
Circuit Board Having Conductive Shield Member And Semiconductor Package Using The Same App 20100321900 - CHOI; Bok Kyu ; et al.	2010-12-23
Circuit board having conductive shield member and semiconductor package using the same Grant 7,808,072 - Choi , et al. October 5, 2	2010-10-05
Circuit Board Having Conductive Shield Member And Semiconductor Package Using The Same App 20090224376 - CHOI; Bok Kyu ; et al.	2009-09-10
Wafer Level Chip Scale Package Having An Enhanced Heat Exchange Efficiency With An Emf Shield And A Method For Fabricating The Same App 20090184414 - PARK; Chang Jun ; et al.	2009-07-23
Substrate For High Speed Semiconductor Package And Semiconductor Package Having The Same App 20090152708 - LEE; Woong Sun ; et al.	2009-06-18

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.