Lim; Ohk Kun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Ohk Kun.The latest application filed is for "mems module package".

Company Profile

0.4.7

Lim; Ohk Kun - Gyeonggi-do KR
Lim; Ohk-Kun - Suwon-si KR
Lim; Ohk Kun - Kyunggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical modulator module package using flip-chip mounting technology Grant 7,394,139 - Park , et al. July 1, 2	2008-07-01
Micro-electro-mechanical system (MEMS) package having metal sealing member Grant 7,368,816 - Lim , et al. May 6, 2	2008-05-06
Light modulator having variable blaze diffraction grating Grant 7,289,258 - Hong , et al. October 30, 2	2007-10-30
MEMS module package App 20070092179 - Park; Heung-Woo ; et al.	2007-04-26
Light modulator module package Grant 7,116,456 - Hwang , et al. October 3, 2	2006-10-03
Optical modulator module package using flip-chip mounting technology App 20060198000 - Park; Heung Woo ; et al.	2006-09-07
Light modulator module package App 20060114582 - Hwang; Young Nam ; et al.	2006-06-01
Micro-electro-mechanical system (MEMS) package having metal sealing member App 20060076670 - Lim; Ohk Kun ; et al.	2006-04-13
Package structure for optical modulator App 20060078247 - Lee; Yeong Gyu ; et al.	2006-04-13
Light modulator having variable blaze diffraction grating App 20060072183 - Hong; Yoon Shik ; et al.	2006-04-06
Micro-electro-mechanical system (MEMS) package with spacer for sealing and method of manufacturing the same App 20050275075 - Hong, Suk-Kee ; et al.	2005-12-15

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