| Patent | Date |
|---|
Ai-based Floorplanning For Printed Circuit Board Design
App 20220300692 - Yan; Jin ; et al. | 2022-09-22 |
Thermal Management Systems For Electronic Devices And Related Methods
App 20220300048 - Lim; Min Suet ; et al. | 2022-09-22 |
Chassis interconnect for an electronic device
Grant 11,445,608 - Lim , et al. September 13, 2 | 2022-09-13 |
Multi-die Stacks With Power Management
App 20220253119 - Baskaran; Rajashree ; et al. | 2022-08-11 |
Floating-bridge interconnects and methods of assembling same
Grant 11,393,760 - Koh , et al. July 19, 2 | 2022-07-19 |
Fan On Printed Circuit Board
App 20220225530 - Ku; Jeff ; et al. | 2022-07-14 |
Flexible Vapor Chamber With Shape Memory Material
App 20220186716 - Ku; Jeff ; et al. | 2022-06-16 |
Multi-use Package Architecture
App 20220181227 - Goh; Eng Huat ; et al. | 2022-06-09 |
Through-substrate Underfill Formation For An Integrated Circuit Assembly
App 20220181289 - Goh; Eng Huat ; et al. | 2022-06-09 |
Systems, Methods, And Apparatuses For Implementing A Pad On Solder Mask (posm) Semiconductor Substrate Package
App 20220173027 - GOH; Eng Huat ; et al. | 2022-06-02 |
Co-planar Interconnection Mechanisms For Circuit Boards
App 20220174820 - Chang; Mooi Ling ; et al. | 2022-06-02 |
Multi-die packages with efficient memory storage
Grant 11,348,909 - Gupta Hyde , et al. May 31, 2 | 2022-05-31 |
Stacked scalable voltage regulator module for platform area miniaturization
Grant 11,343,906 - Wong , et al. May 24, 2 | 2022-05-24 |
Electronic Package With Passive Component Between Substrates
App 20220139814 - Goh; Eng Huat ; et al. | 2022-05-05 |
Multi-die stacks with power management
Grant 11,320,883 - Baskaran , et al. May 3, 2 | 2022-05-03 |
Stepped Package And Recessed Circuit Board
App 20220110214 - Chang; Martin M. ; et al. | 2022-04-07 |
Radiation Shield With Radiation Shield Gap
App 20220110229 - Koh; Boon Ping ; et al. | 2022-04-07 |
Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package
Grant 11,289,414 - Goh , et al. March 29, 2 | 2022-03-29 |
Vapor Chamber With Ionized Fluid
App 20220095484 - Loo; Twan Sing ; et al. | 2022-03-24 |
System In Package Dual Connector
App 20220078911 - CHUAH; Tin Poay ; et al. | 2022-03-10 |
Diagonal Printed Circuit Boards Systems
App 20220075410 - LIM; Min Suet ; et al. | 2022-03-10 |
Elevated Docking Station For Different Mobile Devices
App 20220066506 - KU; Jeff ; et al. | 2022-03-03 |
Wrappable Emi Shields
App 20220068834 - GOH; Eng Huat ; et al. | 2022-03-03 |
System For Dual Displays
App 20220066509 - YEE; Chee Chun ; et al. | 2022-03-03 |
Electronic package with passive component between substrates
Grant 11,264,315 - Goh , et al. March 1, 2 | 2022-03-01 |
Extended package air core inductor
Grant 11,264,160 - Goh , et al. March 1, 2 | 2022-03-01 |
Slot Antenna On A Printed Circuit Board (pcb)
App 20220052458 - GOH; Eng Huat ; et al. | 2022-02-17 |
Radiation Shield With Zipper
App 20220015272 - Lim; Yew San ; et al. | 2022-01-13 |
Methods And Apparatus For Allocating A Workload To An Accelerator Using Machine Learning
App 20210406085 - Vijayaraghavan; Divya ; et al. | 2021-12-30 |
Slot antenna on a printed circuit board (PCB)
Grant 11,211,714 - Goh , et al. December 28, 2 | 2021-12-28 |
Electronic Devices With Moveable Display Screens
App 20210397219 - Ku; Jeff ; et al. | 2021-12-23 |
Integrated Voltage Regulator For High Performance Devices
App 20210385938 - LAU; Wei Cheang ; et al. | 2021-12-09 |
Stacked Scalable Voltage Regulator Module For Platform Area Miniaturization
App 20210385942 - Wong; Tai Loong ; et al. | 2021-12-09 |
Flexible shield for semiconductor devices
Grant 11,177,226 - Cheah , et al. November 16, 2 | 2021-11-16 |
Multi-planar circuit board having reduced z-height
Grant 11,172,581 - Goh , et al. November 9, 2 | 2021-11-09 |
Computer-assisted Or Autonomous Driving Assisted By Roadway Navigation Broadcast
App 20210302997 - BASKARAN; Rajashree ; et al. | 2021-09-30 |
Electronic device packaging
Grant 11,133,261 - Goh , et al. September 28, 2 | 2021-09-28 |
Reverse-bridge Multi-die Interconnect For Integrated-circuit Packages
App 20210183775 - Lim; Min Suet ; et al. | 2021-06-17 |
Methods and apparatus for allocating a workload to an accelerator using machine learning
Grant 11,030,012 - Vijayaraghavan , et al. June 8, 2 | 2021-06-08 |
Electromagnetic Interference Shielding Enclosure With Thermal Conductivity
App 20210153340 - Lee; Jaejin ; et al. | 2021-05-20 |
Computer-assisted or autonomous driving assisted by roadway navigation broadcast
Grant 11,009,890 - Baskaran , et al. May 18, 2 | 2021-05-18 |
Metallic Regions To Shield A Magnetic Field Source
App 20210144844 - Lee; Jaejin ; et al. | 2021-05-13 |
Three-dimensional decoupling integration within hole in motherboard
Grant 11,006,514 - Go , et al. May 11, 2 | 2021-05-11 |
Chassis Interconnect For An Electronic Device
App 20210100101 - Lim; Chee How ; et al. | 2021-04-01 |
Overpass dice stacks and methods of using same
Grant 10,957,649 - Cheah , et al. March 23, 2 | 2021-03-23 |
Programmable redistribution die
Grant 10,943,864 - Goh , et al. March 9, 2 | 2021-03-09 |
3D stacked-in-recess system in package
Grant 10,943,792 - Cheah , et al. March 9, 2 | 2021-03-09 |
Semiconductor package having integrated stiffener region
Grant 10,923,415 - Goh , et al. February 16, 2 | 2021-02-16 |
Electronic Device Package On Package (pop)
App 20210035880 - Goh; Eng Huat ; et al. | 2021-02-04 |
Combination Stiffener And Capacitor
App 20210035738 - Goh; Eng Huat ; et al. | 2021-02-04 |
Interposer With Flexible Portion
App 20210028094 - Cheah; Bok Eng ; et al. | 2021-01-28 |
Rfi Free Picture Frame Metal Stiffener
App 20200411448 - GOH; Eng Huat ; et al. | 2020-12-31 |
Floating-bridge Interconnects And Methods Of Assembling Same
App 20200411438 - Koh; Boon Ping ; et al. | 2020-12-31 |
Electronic Device And Crosstalk Mitigating Substrate
App 20200388578 - Lim; Min Suet ; et al. | 2020-12-10 |
Electromagnetic interference (EMI) shield for circuit card assembly (CCA)
Grant 10,856,454 - Lim , et al. December 1, 2 | 2020-12-01 |
Interposer with flexible portion
Grant 10,840,177 - Cheah , et al. November 17, 2 | 2020-11-17 |
Disaggregated Die Interconnection With On-silicon Cavity Bridge
App 20200357744 - YONG; Khang Choong ; et al. | 2020-11-12 |
Micro-hinge For An Electronic Device
App 20200325711 - Cheah; Bok Eng ; et al. | 2020-10-15 |
Floating-bridge interconnects and methods of assembling same
Grant 10,796,999 - Koh , et al. October 6, 2 | 2020-10-06 |
Fiber weave-sandwiched differential pair routing technique
Grant 10,716,209 - Cheah , et al. | 2020-07-14 |
Multi-orientation Display Device
App 20200192432 - Yee; Chee Chun ; et al. | 2020-06-18 |
Extended stiffener for platform miniaturization
Grant 10,643,983 - Goh , et al. | 2020-05-05 |
Fiber Weave-sandwiched Differential Pair Routing Technique
App 20200137886 - Cheah; Bok Eng ; et al. | 2020-04-30 |
Micro-hinge for an electronic device
Grant 10,633,898 - Cheah , et al. | 2020-04-28 |
Devices And Methods For Signal Integrity Protection Technique
App 20200126928 - Cheah; Bok Eng ; et al. | 2020-04-23 |
Capacitive interconnect in a semiconductor package
Grant 10,609,813 - Goh , et al. | 2020-03-31 |
Flexible Shield For Semiconductor Devices And Methods
App 20200091093 - Cheah; Bok Eng ; et al. | 2020-03-19 |
Programmable Redistribution Die
App 20200083157 - Goh; Eng Huat ; et al. | 2020-03-12 |
Extended Package Air Core Inductor
App 20200027639 - Goh; Eng Huat ; et al. | 2020-01-23 |
Interposer With Flexible Portion
App 20200006204 - Cheah; Bok Eng ; et al. | 2020-01-02 |
Three-dimensional Decoupling Integration Within Hole In Motherboard
App 20190394871 - GO; Jia Yan ; et al. | 2019-12-26 |
Integrated circuit packages
Grant 10,515,912 - Lim , et al. Dec | 2019-12-24 |
Multi-orientation display device
Grant 10,503,211 - Yee , et al. Dec | 2019-12-10 |
Electromagnetic Interference (emi) Shield For Circuit Card Assembly (cca)
App 20190364702 - Lim; Min Suet ; et al. | 2019-11-28 |
Slot Antenna On A Printed Circuit Board (pcb)
App 20190348766 - GOH; Eng Huat ; et al. | 2019-11-14 |
Floating-bridge Interconnects And Methods Of Assembling Same
App 20190304914 - Koh; Boon Ping ; et al. | 2019-10-03 |
Multi-use Package Architecture
App 20190287872 - Goh; Eng Huat ; et al. | 2019-09-19 |
Overpass Dice Stacks And Methods Of Using Same
App 20190229057 - Cheah; Bok Eng ; et al. | 2019-07-25 |
On-package Integrated Stiffener Antenna
App 20190221529 - Yong; Khang Choong ; et al. | 2019-07-18 |
Semiconductor Package Having Integrated Stiffener Region
App 20190214338 - GOH; Eng Huat ; et al. | 2019-07-11 |
3d Stacked-in-recess System In Package
App 20190206698 - Cheah; Bok Eng ; et al. | 2019-07-04 |
Vertical Embedded Component In A Printed Circuit Board Blind Hole
App 20190208643 - CHUAH; Tin Poay ; et al. | 2019-07-04 |
Microelectronic device package having alternately stacked die
Grant 10,319,698 - Cheah , et al. | 2019-06-11 |
Apparatus utilizing computer on package construction
Grant 10,317,938 - Goh , et al. | 2019-06-11 |
Multiple-component substrate for a microelectronic device
Grant 10,297,541 - Lim , et al. | 2019-05-21 |
Systems, Methods, And Apparatuses For Implementing A Pad On Solder Mask (posm) Semiconductor Substrate Package
App 20190122974 - GOH; Eng Huat ; et al. | 2019-04-25 |
Stranded transmission line and uses thereof
Grant 10,256,519 - Song , et al. | 2019-04-09 |
Reduced-height electronic memory system and method
Grant 10,256,213 - Goh , et al. | 2019-04-09 |
Electronic Package With Passive Component Between Substrates
App 20190103346 - Goh; Eng Huat ; et al. | 2019-04-04 |
Methods Of Forming Package On Package Assemblies With Reduced Z Height And Structures Formed Thereby
App 20190103357 - Lim; Min Suet ; et al. | 2019-04-04 |
Electronic Device Packaging
App 20190103358 - Goh; Eng Huat ; et al. | 2019-04-04 |
Integrated Circuit Packages
App 20190096833 - Lim; Min Suet ; et al. | 2019-03-28 |
Micro-hinge For An Electronic Device
App 20190093402 - Cheah; Bok Eng ; et al. | 2019-03-28 |
Multi-die Packages With Efficient Memory Storage
App 20190051642 - Gupta Hyde; Maruti ; et al. | 2019-02-14 |
Methods And Apparatus To Improve Data Training Of A Machine Learning Model Using A Field Programmable Gate Array
App 20190050715 - Ooi; Kooi Chi ; et al. | 2019-02-14 |
Multi-die Stacks With Power Management
App 20190050040 - Baskaran; Rajashree ; et al. | 2019-02-14 |
Computer-assisted Or Autonomous Driving Assisted By Roadway Navigation Broadcast
App 20190049993 - BASKARAN; Rajashree ; et al. | 2019-02-14 |
Methods And Apparatus For Allocating A Workload To An Accelerator Using Machine Learning
App 20190050265 - Vijayaraghavan; Divya ; et al. | 2019-02-14 |
Wirebond Interconnect Structures For Stacked Die Packages
App 20190035761 - Goh; Eng Huat ; et al. | 2019-01-31 |
Extended Stiffener For Platform Miniaturization
App 20190013303 - GOH; Eng Huat ; et al. | 2019-01-10 |
Multi-planar Circuit Board Having Reduced Z-height
App 20190008052 - Goh; Eng Huat ; et al. | 2019-01-03 |
Interconnects for semiconductor packages
Grant 10,163,777 - Lim , et al. Dec | 2018-12-25 |
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus
Grant 10,153,253 - Loo , et al. Dec | 2018-12-11 |
Interconnects For Semiconductor Packages
App 20180286804 - LIM; SEOK LING ; et al. | 2018-10-04 |
Microelectronic device having an air core inductor
Grant 10,085,342 - Cheah , et al. September 25, 2 | 2018-09-25 |
Inductor interconnect
Grant 10,083,922 - Lim , et al. September 25, 2 | 2018-09-25 |
Micro-hinge for an electronic device
Grant 10,041,282 - Cheah , et al. August 7, 2 | 2018-08-07 |
Micro-hinge for an electronic device
Grant 10,036,187 - Cheah , et al. July 31, 2 | 2018-07-31 |
Stranded Transmission Line And Uses Thereof
App 20180192509 - Song; Wil Choon ; et al. | 2018-07-05 |
Package-bottom Interposers For Land-side Configured Devices For System-in-package Apparatus
App 20180175002 - Loo; Howe Yin ; et al. | 2018-06-21 |
Microelectronic Device Having An Air Core Inductor
App 20180168043 - Cheah; Bok Eng ; et al. | 2018-06-14 |
Inductor Interconnect
App 20180145042 - Lim; Min Suet ; et al. | 2018-05-24 |
Package-bottom Through-mold Via Interposers For Land-side Configured Devices For System-in-package Apparatus
App 20180145051 - Loo; Howe Yin ; et al. | 2018-05-24 |
Multiple-component Substrate For A Microelectronic Device
App 20180145016 - Lim; Min Suet ; et al. | 2018-05-24 |
Microelectronic Device Package Having Alternately Stacked Die
App 20180138146 - Cheah; Bok Eng ; et al. | 2018-05-17 |
Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer
Grant 9,972,589 - Goh , et al. May 15, 2 | 2018-05-15 |
Three capacitor stack and associated methods
Grant 9,960,224 - Goh , et al. May 1, 2 | 2018-05-01 |
Three Capacitor Stack And Associated Methods
App 20180097056 - Goh; Eng Huat ; et al. | 2018-04-05 |
Substrate With Sub-interconnect Layer
App 20180005944 - Goh; Eng Huet ; et al. | 2018-01-04 |
Capacitive Interconnect In A Semiconductor Package
App 20170359893 - Goh; Eng Huat ; et al. | 2017-12-14 |
Microelectronic device package electromagnetic shield
Grant 9,836,095 - Lim , et al. December 5, 2 | 2017-12-05 |
Reduced-height Memory System And Method
App 20170170147 - Goh; Eng Huat ; et al. | 2017-06-15 |
Substrate Including Structures To Couple A Capacitor To A Packaged Device And Method Of Making Same
App 20170086298 - Chuah; Tin Poay ; et al. | 2017-03-23 |
Multi-orientation Display Device
App 20170075388 - Yee; Chee Chun ; et al. | 2017-03-16 |
Electronic device with flexible hinge
Grant D773,452 - Cheah , et al. December 6, 2 | 2016-12-06 |
Apparatus Utilizing Computer On Package Construction
App 20160216731 - Goh; Eng Huat ; et al. | 2016-07-28 |
Low-profile hinge for an electronic device
Grant 9,360,896 - Lim , et al. June 7, 2 | 2016-06-07 |
Portable computing device with low profile hinge
Grant D756,349 - Lim , et al. May 17, 2 | 2016-05-17 |
Micro-hinge for an electronic device
App 20160130849 - Cheah; Bok Eng ; et al. | 2016-05-12 |
Micro-hinge For An Electronic Device
App 20160132077 - Cheah; Bok Eng ; et al. | 2016-05-12 |
Micro-hinge For An Electronic Device
App 20150277506 - Cheah; Bok Eng ; et al. | 2015-10-01 |
Low-profile Hinge For An Electronic Device
App 20150277505 - Lim; Min Suet ; et al. | 2015-10-01 |
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