Lim; Lay Yeap

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Lay Yeap.The latest application filed is for "extended contact area for leadframe strip testing".

Company Profile

0.10.11

Lim; Lay Yeap - Melaka MY
Lim; Lay Yeap - Batu Berendam MY
Lim; Lay Yeap - Penang MY
Lim; Lay Yeap - Gelugor MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Strip testing of semiconductor devices Grant 9,728,492 - See , et al. August 8, 2	2017-08-08
Electric component with an electrophoretically deposited film Grant 9,303,327 - Yeong , et al. April 5, 2	2016-04-05
Lead frame strips with electrical isolation of die paddles Grant 9,263,419 - Khoo , et al. February 16, 2	2016-02-16
Extended contact area for leadframe strip testing Grant 9,252,063 - Khoo , et al. February 2, 2	2016-02-02
Extended Contact Area For Leadframe Strip Testing App 20160005663 - Khoo; Nee Wan ; et al.	2016-01-07
Semiconductor die package and method for making the same Grant 9,159,656 - Jeon , et al. October 13, 2	2015-10-13
Lead Frame Strips with Electrical Isolation of Die Paddles App 20150064849 - Khoo; Nee Wan ; et al.	2015-03-05
Method of Electrophoretic Depositing (EPD) a Film on an Exposed Conductive Surface and an Electric Component Thereof App 20140192500 - Yeong; Sung Hoe ; et al.	2014-07-10
Semiconductor Die Package And Method For Making The Same App 20140167238 - Jeon; Oseob ; et al.	2014-06-19
Semiconductor die package and method for making the same Grant 8,664,752 - Jeon , et al. March 4, 2	2014-03-04
Semiconductor Die Package And Method For Making The Same App 20120181675 - Jeon; Oseob ; et al.	2012-07-19
Method of making and designing lead frames for semiconductor packages Grant 8,110,447 - Lim , et al. February 7, 2	2012-02-07
Etched leadframe structure Grant 7,923,301 - Lim April 12, 2	2011-04-12
Semiconductor Die Package And Method For Making The Same App 20100258925 - Jeon; Oseob ; et al.	2010-10-14
Etched Leadframe Structure App 20100136750 - Lim; Lay Yeap	2010-06-03
Etched leadframe structure including recesses Grant 7,683,463 - Lim March 23, 2	2010-03-23
Method Of Making And Designing Lead Frames For Semiconductor Packages App 20090236711 - Lim; Lay Yeap ; et al.	2009-09-24
Ultra-Thin Semiconductor Package App 20090189261 - Lim; Lay Yeap ; et al.	2009-07-30
Etched Leadframe Structure App 20080258272 - Lim; Lay Yeap	2008-10-23
Semiconductor die package and method for making the same App 20070001278 - Jeon; Oseob ; et al.	2007-01-04

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