Lim; Kyeongbin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lim; Kyeongbin.The latest application filed is for "chip bonding apparatus and method of manufacturing semiconductor device using the apparatus".
- Lim; Kyeongbin - Yongin-si KR
- Lim; Kyeongbin - Seoul KR
| Patent | Date |
|---|---|
| Wafer to wafer bonding apparatuses Grant 11,443,965 - Lim , et al. September 13, 2 | 2022-09-13 |
| Chip Bonding Apparatus And Method Of Manufacturing Semiconductor Device Using The Apparatus App 20210398935 - Kim; Junhyung ; et al. | 2021-12-23 |
| Wafer To Wafer Bonding Apparatus, Wafer To Wafer Bonding System, And Wafer To Wafer Bonding Method App 20210143030 - Lim; Kyeongbin ; et al. | 2021-05-13 |
| Substrate Bonding Apparatus App 20210104405 - Kim; Junhyung ; et al. | 2021-04-08 |
| Wafer To Wafer Bonding Methods And Wafer To Wafer Bonding Apparatuses App 20210005475 - LIM; Kyeongbin ; et al. | 2021-01-07 |
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