Lim; Kwangmo Chris

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Kwangmo Chris.The latest application filed is for "rf amplifiers having shielded transmission line structures".

Company Profile

5.4.15

Lim; Kwangmo Chris - San Jose CA
Lim; Kwangmo Chris - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Rf Amplifiers Having Shielded Transmission Line Structures App 20220263482 - Lim; Kwangmo Chris ; et al.	2022-08-18
RF amplifiers having shielded transmission line structures Grant 11,356,070 - Lim , et al. June 7, 2	2022-06-07
Packaging For Rf Transistor Amplifiers App 20220084950 - Noori; Basim ; et al.	2022-03-17
Multi-zone Radio Frequency Transistor Amplifiers App 20210408976 - Lim; Kwangmo Chris ; et al.	2021-12-30
Rf Amplifiers Having Shielded Transmission Line Structures App 20210376807 - Lim; Kwangmo Chris ; et al.	2021-12-02
Rf Amplifier Devices And Methods Of Manufacturing App 20210313293 - Noori; Basim ; et al.	2021-10-07
Group Iii Nitride-based Radio Frequency Amplifiers Having Back Side Source, Gate And/or Drain Terminals App 20210313286 - Watts; Michael E. ; et al.	2021-10-07
Stacked Rf Circuit Topology Using Transistor Die With Through Silicon Carbide Vias On Gate And/or Drain App 20210313285 - Noori; Basim ; et al.	2021-10-07
Rf Amplifier Devices And Methods Of Manufacturing App 20210313282 - Noori; Basim ; et al.	2021-10-07
Group Iii Nitride-based Radio Frequency Transistor Amplifiers Having Source, Gate And/or Drain Conductive Vias App 20210313935 - Noori; Basim ; et al.	2021-10-07
Stacked Rf Circuit Topology App 20210313284 - Noori; Basim ; et al.	2021-10-07
Method Of Manufacturing An Electronic Device And Electronic Device Manufactured Thereby App 20210225802 - Kim; Hwan Kyu ; et al.	2021-07-22
Method of manufacturing an electronic device and electronic device manufactured thereby Grant 10,943,884 - Kim , et al. March 9, 2	2021-03-09
Package Substrate With High-density Interconnect Layer Having Pillar And Via Connections For Fan Out Scaling App 20210066232 - May; Robert Alan ; et al.	2021-03-04
Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling Grant 10,872,872 - May , et al. December 22, 2	2020-12-22
Method Of Manufacturing An Electronic Device And Electronic Device Manufactured Thereby App 20200227378 - Kim; Hwan Kyu ; et al.	2020-07-16
Method of manufacturing an electronic device and electronic device manufactured thereby Grant 10,600,755 - Kim , et al.	2020-03-24
Package Substrate With High-density Interconnect Layer Having Pillar And Via Connections For Fan Out Scaling App 20190363063 - MAY; Robert Alan ; et al.	2019-11-28
Method Of Manufacturing An Electronic Device And Electronic Device Manufactured Thereby App 20190051629 - Kim; Hwan Kyu ; et al.	2019-02-14

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