Lim; Kian-Hock

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Kian-Hock.The latest application filed is for "semiconductor structure and semiconductor package device using the same".

Company Profile

2.17.14

Lim; Kian-Hock - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor structure and semiconductor package device using the same Grant 10,763,133 - Chew , et al. Sep	2020-09-01
Semiconductor Structure And Semiconductor Package Device Using The Same App 20190035643 - CHEW; Jimmy Hwee-Seng ; et al.	2019-01-31
Method of manufacturing semiconductor package device Grant 10,109,503 - Chew , et al. October 23, 2	2018-10-23
Semiconductor Substrate App 20180108584 - Lim; Shoa-Siong ; et al.	2018-04-19
Semiconductor package and manufacturing method thereof Grant 9,847,268 - Lim , et al. December 19, 2	2017-12-19
Semiconductor package Grant 9,583,449 - Chew , et al. February 28, 2	2017-02-28
Semiconductor Package App 20160118349 - CHEW; Hwee-Seng Jimmy ; et al.	2016-04-28
Manufacturing method of forming an etch-back type semiconductor package with locking anchorages Grant 9,305,868 - Chew , et al. April 5, 2	2016-04-05
Semiconductor device carrier and semiconductor package using the same Grant 9,219,027 - Chew , et al. December 22, 2	2015-12-22
Semiconductor Package App 20150287673 - Lim; Shoa-Siong ; et al.	2015-10-08
Method for device packaging Grant 9,120,169 - Chew , et al. September 1, 2	2015-09-01
Manufacturing methods of semiconductor substrate, package and device Grant 9,059,050 - Lim , et al. June 16, 2	2015-06-16
Etch-back Type Semiconductor Package, Substrate And Manufacturing Method Thereof App 20150111345 - CHEW; Hwee-Seng Jimmy ; et al.	2015-04-23
Etch-back type semiconductor package, substrate and manufacturing method thereof Grant 8,917,521 - Chew , et al. December 23, 2	2014-12-23
Semiconductor Device Carrier And Semiconductor Package Using The Same App 20140167240 - Chew; Hwee-Seng Jimmy ; et al.	2014-06-19
Manufacturing Methods Of Semiconductor Substrate, Package And Device App 20140134806 - Lim; Shoa-Siong ; et al.	2014-05-15
Manufacturing method for semiconductor device carrier and semiconductor package using the same Grant 8,709,874 - Chew , et al. April 29, 2	2014-04-29
Semiconductor substrate, package and device Grant 8,664,750 - Lim , et al. March 4, 2	2014-03-04
Semiconductor Substrate, Package And Device And Manufacturing Methods Thereof App 20130020710 - Chew; Jimmy Hwee-Seng ; et al.	2013-01-24
Manufacturing Method For Semiconductor Device Carrier And Manufacturing Method For Semiconductor Package Using The Same App 20120058604 - Chew; Hwee-Seng Jimmy ; et al.	2012-03-08
In-situ Melt And Reflow Process For Forming Flip-chip Interconnections And Systems Thereof App 20110287560 - Chew; Hwee Seng ; et al.	2011-11-24
Etch-back Type Semiconductor Package, Substrate And Manufacturing Method Thereof App 20110267789 - CHEW; Hwee-Seng Jimmy ; et al.	2011-11-03
Semiconductor Substrate, Package and Device and Manufacturing Methods Thereof App 20110210429 - Lim; Shoa Siong ; et al.	2011-09-01
Semiconductor Package and Manufacturing Method Thereof App 20110210439 - Lim; Shoa Siong ; et al.	2011-09-01

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