Lim; Kay Leong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lim; Kay Leong.The latest application filed is for "method to form multi-material components".
- Lim; Kay Leong - Singapore SG
| Patent | Date |
|---|---|
| Method to form multi-material components Grant 7,347,968 - Lim , et al. March 25, 2 | 2008-03-25 |
| Net shaped articles having complex internal undercut features Grant 6,776,955 - Lim , et al. August 17, 2 | 2004-08-17 |
| Method to form multi-material components App 20040086414 - Lim, Kay Leong ; et al. | 2004-05-06 |
| Method to form multi-material components App 20040071581 - Lim, Kay Leong ; et al. | 2004-04-15 |
| Method to form multi-material components Grant 6,660,225 - Lim , et al. December 9, 2 | 2003-12-09 |
| Enclosure for a semiconductor device Grant 6,569,380 - Lim , et al. May 27, 2 | 2003-05-27 |
| Enclosure for a semiconductor device App 20030039571 - Lim, Kay-Leong ; et al. | 2003-02-27 |
| Method to form multi-material components App 20020071781 - Lim, Kay Leong ; et al. | 2002-06-13 |
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