Lim; Ji Hyuk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Ji Hyuk.The latest application filed is for "multilayer ceramic electronic component and method of manufacturing the same".

Company Profile

2.35.43

Lim; Ji Hyuk - Suwon-si KR
Lim; Ji Hyuk - Gyunggi-do N/A KR
Lim; Ji Hyuk - Suwon KR
Lim; Ji-Hyuk - Gyeonggi-do KR
Lim; Ji-hyuk - Sumon-si N/A KR
Lim; Ji-hyuk - Yongin-si KR
Lim; Ji-hyuk - Suwon-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multilayer Ceramic Electronic Component And Method Of Manufacturing The Same App 20220093339 - Noh; Jung Eun ; et al.	2022-03-24
Coil Component And Method For Manufacturing The Same App 20210398738 - KIM; Yong Min ; et al.	2021-12-23
Coil Electronic Component App 20200402699 - KIM; Yong Min ; et al.	2020-12-24
Coil Electronic Component App 20200402704 - KIM; Yong Min ; et al.	2020-12-24
Electronic Device And Power Managing Method Thereof App 20160349831 - Lim; Ji Hyuk	2016-12-01
Multilayer ceramic electronic component and method of manufacturing the same Grant 9,263,187 - Lee , et al. February 16, 2	2016-02-16
Touch sensor Grant 9,189,105 - Park , et al. November 17, 2	2015-11-17
Organic light emitting device with a protective layer including at least one of a nano-clay and a graphite oxide formed on the anode Grant 9,065,071 - Lee , et al. June 23, 2	2015-06-23
Multilayer Thin Film For Ceramic Electronic Component And Method For Manufacturing The Same App 20150162134 - LEE; Kwang Jik ; et al.	2015-06-11
Multilayer thin film for ceramic electronic component and method of manufacturing the same Grant 8,974,901 - Lee , et al. March 10, 2	2015-03-10
Multilayer laminate package and method of manufacturing the same Grant 8,872,041 - Lee , et al. October 28, 2	2014-10-28
Thermally Conductive Film And Circuit Board Module App 20140185244 - LEE; Jae Sang ; et al.	2014-07-03
Touch Sensor App 20140176506 - PARK; Hee Jin ; et al.	2014-06-26
Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component Grant 8,755,167 - Lee , et al. June 17, 2	2014-06-17
Measurement Device Of Degree Of Cure App 20140139835 - KIM; Ji Hoon ; et al.	2014-05-22
Apparatus and method for improving communication sound quality in mobile terminal Grant 8,682,657 - Lim , et al. March 25, 2	2014-03-25
Energy harvesting device using pyroelectric material Grant 8,552,617 - Lim October 8, 2	2013-10-08
Multilayer Ceramic Electronic Component And Method Of Manufacturing The Same App 20130050901 - LEE; Kwang Jik ; et al.	2013-02-28
Organic Light Emitting Diode And Fabrication Method Thereof App 20130048943 - Lee; Kwang Jik ; et al.	2013-02-28
Multilayer Ceramic Condenser And Method For Manufacturing The Same App 20130038982 - Lee; Kwang Jik ; et al.	2013-02-14
Organic Light Emitting Diode And Method Of Manufacturing The Same App 20120286248 - LEE; Kwang Jik ; et al.	2012-11-15
Multilayer Thin Film For Ceramic Electronic Component And Method Of Manufacturing The Same App 20120276372 - LEE; Kwang Jik ; et al.	2012-11-01
Ceramic Sheet Product For Ceramic Electronic Component, Multilayer Ceramic Electronic Component Using The Same And Method Of Manufacturing Multilayer Ceramic Electronic Component App 20120268861 - LEE; Kwang Jik ; et al.	2012-10-25
Ultrasonic motor and conveying apparatus having the same Grant 8,274,198 - Park , et al. September 25, 2	2012-09-25
Vibrating element, fabrication method thereof, and ultrasonic motor having the same Grant 8,237,330 - Cho , et al. August 7, 2	2012-08-07
Multilayer Laminate Package And Method Of Manufacturing The Same App 20120024583 - LEE; Baik-Woo ; et al.	2012-02-02
Apparatus And Method For Improving Communication Sound Quality In Mobile Terminal App 20110282659 - LIM; Ji-Hyuk ; et al.	2011-11-17
Piezoelectric ultrasonic motor and method of manufacturing the same Grant 8,049,396 - Park , et al. November 1, 2	2011-11-01
Tunable capacitor using electrowetting phenomenon Grant 8,045,318 - Choi , et al. October 25, 2	2011-10-25
Energy Harvesting Device Using Pyroelectric Material App 20110169372 - LIM; Ji-hyuk	2011-07-14
Wafer level incapsulation chip and encapsulation chip manufacturing method Grant 7,906,841 - Jeong , et al. March 15, 2	2011-03-15
Piezoelectric Ultrasonic Motor And Method Of Manufacturing The Same App 20100194242 - PARK; Sunghyuk ; et al.	2010-08-05
Wafer level package for surface acoustic wave device and fabrication method thereof Grant 7,755,151 - Lim , et al. July 13, 2	2010-07-13
Backlight module including at least one luminescence element, and method of fabricating the same Grant 7,741,774 - Choi , et al. June 22, 2	2010-06-22
Ultrasonic motor having lightweight vibrating element Grant 7,732,981 - Lim , et al. June 8, 2	2010-06-08
Tunable Capacitor Using Electrowetting Phenomenon App 20100110606 - CHOI; Seung-tae ; et al.	2010-05-06
Ultrasonic Motor And Conveying Apparatus Having The Same App 20100084946 - PARK; Sunghyuk ; et al.	2010-04-08
Vibrating Element, Fabrication Method Thereof, And Ultrasonic Motor Having The Same App 20100072861 - Cho; Jin-woo ; et al.	2010-03-25
Tunable capacitor using electrowetting phenomenon Grant 7,667,946 - Choi , et al. February 23, 2	2010-02-23
Ultrasonic Motor Having Lightweight Vibrating Element App 20100033056 - LIM; Ji-hyuk ; et al.	2010-02-11
Cap wafer, semiconductor chip having the same, and fabrication method thereof Grant 7,626,258 - Lim , et al. December 1, 2	2009-12-01
Wafer level package for surface acoustic wave device and fabrication method thereof Grant 7,545,017 - Lee , et al. June 9, 2	2009-06-09
Method for manufacturing monolithic ink-jet printhead having heater disposed between dual ink chambers Grant 7,487,590 - Song , et al. February 10, 2	2009-02-10
Wafer level packaging cap and fabrication method thereof Grant 7,449,366 - Lee , et al. November 11, 2	2008-11-11
Micro-package, multi-stack micro-package, and manufacturing method therefor Grant 7,374,972 - Kwon , et al. May 20, 2	2008-05-20
Tunable capacitor using electrowetting phenomenon App 20080089005 - Choi; Seung-tae ; et al.	2008-04-17
Cap wafer, semiconductor chip having the same, and fabrication method thereof App 20080067664 - Lim; Ji-hyuk ; et al.	2008-03-20
Backlight module including at least one luminescence element, and method of fabricating the same App 20070290613 - Choi; Seung-tae ; et al.	2007-12-20
Micro-package, Multi-stack Micro-package, And Manufacturing Method Therefor App 20070264757 - KWON; Jong-oh ; et al.	2007-11-15
Micro-package, multi-stack micro-package, and manufacturing method therefor Grant 7,285,865 - Kwon , et al. October 23, 2	2007-10-23
Thermally-driven ink-jet printhead capable of preventing cavitation damage to a heater App 20070188558 - Kuk; Keon ; et al.	2007-08-16
Wafer level package for surface acoustic wave device and fabrication method thereof App 20070176250 - Lee; Moon-chul ; et al.	2007-08-02
Apparatus and method for driving an ink-jet printhead Grant 7,216,959 - Lim , et al. May 15, 2	2007-05-15
Wafer level package for surface acoustic wave device and fabrication method thereof App 20070096227 - Lim; Ji-hyuk ; et al.	2007-05-03
Thermally-driven ink-jet printhead capable of preventing cavitation damage to a heater Grant 7,210,766 - Kuk , et al. May 1, 2	2007-05-01
Wafer level packaging cap and fabrication method thereof App 20070085195 - Lee; Moon-chul ; et al.	2007-04-19
Wafer level incapsulation chip and encapsulation chip manufacturing method App 20070020817 - Jeong; Byung-gil ; et al.	2007-01-25
Micro-package, multi-stack micro-package, and manufacturing method therefor App 20070012655 - Kwon; Jong-oh ; et al.	2007-01-18
Ink-jet printhead with improved ink ejection linearity and operating frequency Grant 7,163,278 - Lee , et al. January 16, 2	2007-01-16
Ink-jet printhead Grant 7,101,024 - Lim , et al. September 5, 2	2006-09-05
Method for manufacturing monolithic ink-jet printhead having heater disposed between dual ink chambers App 20060146093 - Song; Hoon ; et al.	2006-07-06
Monolithic ink-jet printhead having a heater disposed between dual ink chambers and method for manufacturing the same Grant 7,018,017 - Song , et al. March 28, 2	2006-03-28
Inkjet spotting apparatus for manufacturing microarrays and method of spotting using the same App 20060040404 - Lim; Ji-hyuk ; et al.	2006-02-23
Apparatus and method for driving an ink-jet printhead App 20050024440 - Lim, Ji-hyuk ; et al.	2005-02-03
Thermally-driven ink-jet printhead capable of preventing cavitation damage to a heater App 20050012783 - Kuk, Keon ; et al.	2005-01-20
Ink-jet printhead App 20040263578 - Lee, Yong-soo ; et al.	2004-12-30
Ink-jet printhead App 20040145633 - Lim, Ji-hyuk ; et al.	2004-07-29
Monolithic ink-jet printhead having a heater disposed between dual ink chambers and method for manufacturing the same App 20040100535 - Song, Hoon ; et al.	2004-05-27

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