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name:-0.033430814743042
name:-0.017148017883301
Lim; Jae-Soon Patent Filings

Lim; Jae-Soon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Jae-Soon.The latest application filed is for "organometallic precursors, methods of forming a layer using the same and methods of manufacturing semiconductor devices using th".

Company Profile
15.34.50
  • Lim; Jae-Soon - Seoul KR
  • Lim, Jae-Soon - Seoul-city KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Organometallic precursors, methods of forming a layer using the same and methods of manufacturing semiconductor devices using the same
Grant 11,062,940 - Sun , et al. July 13, 2
2021-07-13
Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compound
Grant 10,913,754 - Park , et al. February 9, 2
2021-02-09
Method of forming tin-containing material film and method of synthesizing a tin compound
Grant 10,882,873 - Ryu , et al. January 5, 2
2021-01-05
Method of forming a thin film
Grant 10,752,645 - Park , et al. A
2020-08-25
Tantalum compound
Grant 10,651,031 - Ryu , et al.
2020-05-12
Method of forming thin film and method of manufacturing integrated circuit device using the same
Grant 10,600,643 - Park , et al.
2020-03-24
Method of fabricating semiconductor device
Grant 10,468,264 - Lim , et al. No
2019-11-05
Organometallic Precursors, Methods Of Forming A Layer Using The Same And Methods Of Manufacturing Semiconductor Devices Using Th
App 20190304835 - Sun; Chang-Woo ;   et al.
2019-10-03
Method Of Forming A Thin Film
App 20190292207 - PARK; Gyu-hee ;   et al.
2019-09-26
Organometallic precursors, methods of forming a layer using the same and methods of manufacturing semiconductor devices using the same
Grant 10,361,118 - Sun , et al.
2019-07-23
Lanthanum compound, method of synthesizing lanthanum compound, lanthanum precursor composition, method of forming thin film, and method of manufacturing integrated circuit device
Grant 10,329,312 - Park , et al.
2019-06-25
Lanthanum Compound And Methods Of Forming Thin Film And Integrated Circuit Device Using The Lanthanum Compound
App 20190152996 - PARK; Gyu-hee ;   et al.
2019-05-23
Method Of Forming Tin-containing Material Film And Method Of Synthesizing A Tin Compound
App 20190144472 - RYU; Seung-min ;   et al.
2019-05-16
Methods of forming thin film and fabricating integrated circuit device using niobium compound
Grant 10,259,836 - Lim , et al.
2019-04-16
Aluminum compound and methods of forming thin film and fabricating integrated circuit device by using the same
Grant 10,242,877 - Park , et al.
2019-03-26
Tantalum Compound
App 20190074175 - RYU; Seung-min ;   et al.
2019-03-07
Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit device
Grant 10,224,200 - Park , et al.
2019-03-05
Method Of Forming Thin Film And Method Of Manufacturing Integrated Circuit Device Using The Same
App 20180342391 - PARK; Gyu-hee ;   et al.
2018-11-29
Tantalum compound and methods of forming thin film and fabricating integrated circuit device by using the same
Grant 10,134,582 - Ryu , et al. November 20, 2
2018-11-20
Tin Compound, Method Of Synthesizing The Same, Tin Precursor Compound For Atomic Layer Deposition, And Method Of Forming Tin-containing Material Film
App 20180155372 - RYU; Seung-min ;   et al.
2018-06-07
Organometallic Precursors, Methods Of Forming A Layer Using The Same And Methods Of Manufacturing Semiconductor Devices Using The Same
App 20180102284 - Sun; Chang-Woo ;   et al.
2018-04-12
Aluminum Compound, Method Of Forming Thin Film By Using The Same, And Method Of Fabricating Integrated Circuit Device
App 20180076024 - PARK; Gyu-hee ;   et al.
2018-03-15
Aluminum Compound And Methods Of Forming Thin Film And Fabricating Integrated Circuit Device By Using The Same
App 20180019135 - PARK; Gyu-hee ;   et al.
2018-01-18
Method Of Fabricating Semiconductor Device
App 20180005836 - LIM; JAE SOON ;   et al.
2018-01-04
Tantalum Compound And Methods Of Forming Thin Film And Fabricating Integrated Circuit Device By Using The Same
App 20170178961 - RYU; Seung-min ;   et al.
2017-06-22
Methods of forming dielectric layers and methods of manufacturing semiconductor devices using the same
Grant 9,685,498 - Kang , et al. June 20, 2
2017-06-20
Methods Of Forming Thin Film And Fabricating Integrated Circuit Device Using Niobium Compound
App 20170152277 - LIM; Jae-soon ;   et al.
2017-06-01
Lanthanum Compound, Method Of Synthesizing Lanthanum Compound, Lanthanum Precursor Composition, Method Of Forming Thin Film, And Method Of Manufacturing Integrated Circuit Device
App 20170008914 - PARK; Gyu-hee ;   et al.
2017-01-12
Methods Of Forming Dielectric Layers And Methods Of Manufacturing Semiconductor Devices Using The Same
App 20160315137 - KANG; SANG-YEOL ;   et al.
2016-10-27
Method of fabricating semiconductor device
Grant 9,349,583 - Park , et al. May 24, 2
2016-05-24
Semiconductor Device And Method For Fabricating The Same
App 20150091133 - Cho; Kyu-Ho ;   et al.
2015-04-02
Method Of Fabricating Semiconductor Device Having Dielectric Layer With Improved Electrical Characteristics
App 20150031186 - KIM; Youn-soo ;   et al.
2015-01-29
Method of fabricating semiconductor device having dielectric layer with improved electrical characteristics
Grant 8,859,383 - Kim , et al. October 14, 2
2014-10-14
ALD method of forming thin film comprising a metal
Grant 8,685,494 - Lim , et al. April 1, 2
2014-04-01
Method of Fabricating Semiconductor Device
App 20130244445 - Park; Min-Young ;   et al.
2013-09-19
Methods Of Forming Dielectric Layers And Methods Of Manufacturing Semiconductor Devices Using The Same
App 20120225548 - KANG; SANG-YEOL ;   et al.
2012-09-06
Method Of Fabricating Semiconductor Device Having Dielectric Layer With Improved Electrical Characteristics
App 20120178254 - KIM; Youn-soo ;   et al.
2012-07-12
Method Of Forming Metal Thin Film
App 20120094022 - Lim; Jae-Soon ;   et al.
2012-04-19
Semiconductor Device, Method Of Fabricating The Same, Semiconductor Module, Electronic Circuit Board, And Electronic System Including The Device
App 20110151639 - Lim; Jae-Soon ;   et al.
2011-06-23
Semiconductor device, method of fabricating the same, and semicondutor module, electronic circuit board, and electronic system including the device
App 20110136317 - Kang; Sang-Yeol ;   et al.
2011-06-09
Multilayer Structure, Capacitor Including The Multilayer Structure And Method Of Forming The Same
App 20110102968 - CHOI; Jae-Hyoung ;   et al.
2011-05-05
Semiconductor Structures Including Dielectric Layers and Capacitors Including Semiconductor Structures
App 20110095397 - Chung; Suk-jin ;   et al.
2011-04-28
Semiconductor device having dielectric layer with improved electrical characteristics and associated methods
App 20100200950 - Kim; Youn-soo ;   et al.
2010-08-12
Methods Of Fabricating Capacitors Including Low-temperature Capping Layers
App 20100196592 - Kim; Wan-Don ;   et al.
2010-08-05
Organometallic compounds and methods of forming thin films including the use of the same
Grant 7,722,926 - Cho , et al. May 25, 2
2010-05-25
Trench capacitors with insulating layer collars in undercut regions
Grant 7,531,861 - Chung , et al. May 12, 2
2009-05-12
Methods for Operating Liquid Chemical Delivery Systems Having Recycling Elements
App 20090050210 - Choi; Han-Mei ;   et al.
2009-02-26
Method Of Forming High Dielectric Film Using Atomic Layer Deposition And Method Of Manufacturing Capacitor Having The High Dielectric Film
App 20080268653 - KIM; Kyoung-seok ;   et al.
2008-10-30
Methods of manufacturing a thin film including zirconium titanium oxide and methods of manufacturing a gate structure, a capacitor and a flash memory device including the same
Grant 7,432,183 - Lim , et al. October 7, 2
2008-10-07
Method of forming high dielectric film using atomic layer deposition and method of manufacturing capacitor having the high dielectric film
Grant 7,396,719 - Kim , et al. July 8, 2
2008-07-08
Trench Capacitors With Insulating Layer Collars In Undercut Regions
App 20080135876 - Chung; Suk-jin ;   et al.
2008-06-12
Methods of forming a capacitor using an atomic layer deposition process
Grant 7,361,548 - Lim , et al. April 22, 2
2008-04-22
Methods of fabricating trench capacitors with insulating layer collars in undercut regions
Grant 7,354,821 - Chung , et al. April 8, 2
2008-04-08
Methods of forming low leakage currents metal-insulator-metal (MIM) capacitors and related MIM capacitors
Grant 7,271,055 - Lee , et al. September 18, 2
2007-09-18
Electronic devices including dielectric layers with different densities of titanium
App 20070040207 - Nam; Gab-jin ;   et al.
2007-02-22
Organometallic Precursors And Methods Of Forming Thin Films Including The Use Of The Same
App 20070031597 - Cho; Kyu-Ho ;   et al.
2007-02-08
Methods of forming electronic devices including dielectric layers with different densities of titanium
Grant 7,144,771 - Nam , et al. December 5, 2
2006-12-05
Methods of forming a multi-layered structure using an atomic layer deposition process and methods of forming a capacitor of an integrated circuit device
Grant 7,135,422 - Nam , et al. November 14, 2
2006-11-14
Methods of manufacturing a thin film including zirconium titanium oxide and methods of manufacturing a gate structure, a capacitor and a flash memory device including the same
App 20060134849 - Lim; Jae-Soon ;   et al.
2006-06-22
Multi-layer film for thin film structure, capacitor using the same and fabrication method thereof
Grant 7,052,918 - Lim , et al. May 30, 2
2006-05-30
Methods of forming integrated circuit devices with metal-insulator-metal capacitors
App 20060060907 - Kim; Ki-Chul ;   et al.
2006-03-23
Methods of forming low leakage currents metal-insulator-metal (MIM) capacitors and related MIM capacitors
App 20060040457 - Lee; Kwang-Hee ;   et al.
2006-02-23
Integrated circuit devices with metal-insulator-metal capacitors
Grant 6,992,346 - Kim , et al. January 31, 2
2006-01-31
Trench capacitors with insulating layer collars in undercut regions and method of fabricating the same
App 20050212026 - Chung, Suk-jin ;   et al.
2005-09-29
Methods of forming a capacitor using an atomic layer deposition process
App 20050208718 - Lim, Jae-Soon ;   et al.
2005-09-22
Liquid chemical delivery system with recycling element and associated methods
App 20050031495 - Choi, Han-Mei ;   et al.
2005-02-10
Methods of forming a multi-layered structure using an atomic layer deposition process and methods of forming a capacitor of an integrated circuit device
App 20050009369 - Nam, Gab-Jin ;   et al.
2005-01-13
Integrated circuit devices with metal-insulator-metal capacitors and methods of forming the same
App 20040262661 - Kim, Ki-Chul ;   et al.
2004-12-30
Method of forming high dielectric film using atomic layer deposition and method of manufacturing capacitor having the high dielectric film
App 20040266217 - Kim, Kyoung-seok ;   et al.
2004-12-30
Methods for forming a capacitor on an integrated circuit device at reduced temperatures
App 20040166627 - Lim, Jae-Soon ;   et al.
2004-08-26
Methods of forming electronic devices including dielectric layers with different densities of titanium and related structures
App 20040075130 - Nam, Gab-Jin ;   et al.
2004-04-22
Multi-layer film for thin film structure, capacitor using the same and fabrication method thereof
App 20030207529 - Lim, Jae-Soon ;   et al.
2003-11-06
Method for manufacturing capacitor of semiconductor device having improved leakage current characteristics
Grant 6,599,807 - Lim , et al. July 29, 2
2003-07-29
Method of forming thin film using atomic layer deposition method
Grant 6,576,053 - Kim , et al. June 10, 2
2003-06-10
Method for manufacturing capacitor of semiconductor device having improved leakage current characteristics
App 20030036239 - Lim, Jae-soon ;   et al.
2003-02-20
Semiconductor device and method for manufacturing the same
App 20020195683 - Kim, Yeong-kwan ;   et al.
2002-12-26
Methods of manufacturing integrated circuit capacitors having hemispherical grain electrodes
Grant 6,448,146 - Lee , et al. September 10, 2
2002-09-10
Methods of manufacturing integrated circuit capacitors having hemispherical grain electrodes
App 20020068412 - Lee, Seung-Hwan ;   et al.
2002-06-06

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