Lim; Hwan-Sik

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Hwan-Sik.The latest application filed is for "semiconductor package and method for fabricating the same".

Company Profile

0.11.13

Lim; Hwan-Sik - Gunpo-si N/A KR
Lim; Hwan-Sik - Hwasung KR
LIM; HWAN-SIK - Hwasung-City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bump structures having an extension Grant 9,312,213 - Cho , et al. April 12, 2	2016-04-12
Multi-chip package and method of manufacturing the same Grant 8,928,150 - Cho , et al. January 6, 2	2015-01-06
Semiconductor package and method for fabricating the same Grant 8,823,172 - Lim , et al. September 2, 2	2014-09-02
Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packages Grant 8,759,221 - Park , et al. June 24, 2	2014-06-24
Semiconductor Package And Method For Fabricating The Same App 20140151877 - LIM; HWAN-SIK ; et al.	2014-06-05
Bump Structures, Electrical Connection Structures, And Methods Of Forming The Same App 20140084457 - CHO; Moon Gi ; et al.	2014-03-27
Semiconductor package and method for fabricating the same Grant 8,680,685 - Lim , et al. March 25, 2	2014-03-25
Multi-chip Package And Method Of Manufacturing The Same App 20140015145 - CHO; Moon-Gi ; et al.	2014-01-16
Package Substrates, Semiconductor Packages Having The Same, And Methods Of Fabricating The Semiconductor Packages App 20130288431 - PARK; Jin-Woo ; et al.	2013-10-31
Semiconductor Package App 20130256876 - LEE; Ui-hyoung ; et al.	2013-10-03
Semiconductor chip, and semiconductor package and system each including the semiconductor chip Grant 8,519,470 - Kang , et al. August 27, 2	2013-08-27
Package substrates and semiconductor packages having the same Grant 8,497,569 - Park , et al. July 30, 2	2013-07-30
Methods Of Forming Connection Bump Of Semiconductor Device App 20130082090 - CHO; Moon-gi ; et al.	2013-04-04
Semiconductor Chip And Flip-chip Package Comprising The Same App 20130009286 - Kim; Young-lyong ; et al.	2013-01-10
Method For Manufacturing Semiconductor Package And Semiconductor Package Manufactured Using The Same App 20120129333 - YIM; Ha-Young ; et al.	2012-05-24
Semiconductor Chip, And Semiconductor Package And System Each Including The Semiconductor Chip App 20110283034 - KANG; Sun-won ; et al.	2011-11-17
Package Substrates, Semiconductor Packages Having The Same, And Methods Of Fabricating The Semiconductor Packages App 20110215444 - PARK; Jin-Woo ; et al.	2011-09-08
Semiconductor Package And Method For Fabricating The Same App 20110095418 - LIM; HWAN-SIK ; et al.	2011-04-28

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.