Lim; Fong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lim; Fong.The latest application filed is for "electrical interconnect structure with radial spokes for improved solder void control".
- Lim; Fong - Melaka MY
- Lim; Fong - Ayer Keroh N/A MY
| Patent | Date |
|---|---|
| Electrical interconnect structure with radial spokes for improved solder void control Grant 11,355,429 - Calo , et al. June 7, 2 | 2022-06-07 |
| Electrical Interconnect Structure with Radial Spokes for Improved Solder Void Control App 20210233839 - Calo; Paul Armand Asentista ; et al. | 2021-07-29 |
| Semiconductor device using diffusion soldering Grant 8,975,117 - Otremba , et al. March 10, 2 | 2015-03-10 |
| Semiconductor Device Using Diffusion Soldering App 20130200532 - Otremba; Ralf ; et al. | 2013-08-08 |
| Semiconductor chip assembly Grant 8,482,119 - Lim , et al. July 9, 2 | 2013-07-09 |
| Semiconductor package with ribbon with metal layers Grant 8,022,558 - Law , et al. September 20, 2 | 2011-09-20 |
| Semiconductor Package With Ribbon With Metal Layers App 20100207279 - Law; Chee Soon ; et al. | 2010-08-19 |
| Semiconductor chip assembly App 20090315172 - Lim; Fong ; et al. | 2009-12-24 |
| Semiconductor Device App 20090230519 - OTREMBA; Ralf ; et al. | 2009-09-17 |
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