Lim; Chu Aun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lim; Chu Aun.The latest application filed is for "multi-use package architecture".
- Lim; Chu Aun - Hillsboro OR
- Lim; Chu Aun - Bayan Lepas MY
- Lim; Chu Aun - Penang MY
| Patent | Date |
|---|---|
| Multi-use Package Architecture App 20220181227 - Goh; Eng Huat ; et al. | 2022-06-09 |
| Stepped Package And Recessed Circuit Board App 20220110214 - Chang; Martin M. ; et al. | 2022-04-07 |
| System And Method For Stacking Wire-bond Converted Flip-chip Die App 20210202441 - GOH; ENG HUAT ; et al. | 2021-07-01 |
| Multi-use Package Architecture App 20190287872 - Goh; Eng Huat ; et al. | 2019-09-19 |
| Apparatus utilizing computer on package construction Grant 10,317,938 - Goh , et al. | 2019-06-11 |
| Apparatus Utilizing Computer On Package Construction App 20160216731 - Goh; Eng Huat ; et al. | 2016-07-28 |
| Method and apparatus for testing electronic devices Grant 6,885,207 - Chan , et al. April 26, 2 | 2005-04-26 |
| Method and apparatus for testing electronic devices App 20030206033 - Chan, Kok Hong ; et al. | 2003-11-06 |
| Method and apparatus for testing electronic devices Grant 6,597,190 - Chan , et al. July 22, 2 | 2003-07-22 |
| Method and apparatus for testing electronic devices App 20020105349 - Chan, Kok Hong ; et al. | 2002-08-08 |
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