Lim; Boon Kian
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lim; Boon Kian.The latest application filed is for "method of fabricating a semiconductor package with mold lock opening".
- Lim; Boon Kian - Melacca MY
- Lim; Boon Kian - Melaka MY
| Patent | Date |
|---|---|
| Method of fabricating a semiconductor package with mold lock opening Grant 8,466,009 - Goller , et al. June 18, 2 | 2013-06-18 |
| Electronic device having profiled elements extending from planar surfaces Grant 8,030,742 - Lim , et al. October 4, 2 | 2011-10-04 |
| Method Of Fabricating A Semiconductor Package With Mold Lock Opening App 20100227436 - Goller; Bernd ; et al. | 2010-09-09 |
| Semiconductor package with mold lock vent Grant 7,732,937 - Goller , et al. June 8, 2 | 2010-06-08 |
| Semiconductor Package With Mold Lock Vent App 20090224382 - Goller; Bernd ; et al. | 2009-09-10 |
| Electronic Device App 20090140403 - Lim; Boon Kian ; et al. | 2009-06-04 |
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