Lim; Bong Sup

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lim; Bong Sup.The latest application filed is for "coil component".

Company Profile

2.10.22

Lim; Bong Sup - Suwon-si KR
Lim; Bong Sup - Busan-si KR
LIM; Bong Sup - Busan KR
Lim; Bong Sup - Jinhae KR
Lim, Bong-Sup - Kyungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packing materials for display apparatus and packing method for display apparatus Grant 11,129,288 - Baek , et al. September 21, 2	2021-09-21
Coil component Grant 10,998,119 - Lim May 4, 2	2021-05-04
Corrugated packaging box Grant 10,308,390 - Oh , et al.	2019-06-04
Coil Component App 20190156986 - LIM; Bong Sup	2019-05-23
Packing Materials For Display Apparatus And Packing Method For Display Apparatus App 20180153050 - BAEK; Seok Bong ; et al.	2018-05-31
Multilayer electronic component Grant 9,583,254 - Lim February 28, 2	2017-02-28
Box Grant D767,990 - Kim , et al. October 4, 2	2016-10-04
Corrugated Packaging Box App 20160144995 - OH; Woo-Seok ; et al.	2016-05-26
Multilayer Inductor App 20160126003 - LIM; Bong Sup	2016-05-05
Chip Component And Manufacturing Method Thereof App 20160111205 - LIM; Bong Sup	2016-04-21
Chip Coil Component App 20160012957 - LIM; Bong Sup	2016-01-14
Multilayer Electronic Component App 20150294779 - LIM; Bong Sup	2015-10-15
Chip Coil Component And Board For Mounting The Same App 20150287514 - LIM; Bong Sup	2015-10-08
Automatic packing apparatus and automatic packing method using the same Grant 9,114,897 - Kim , et al. August 25, 2	2015-08-25
Multilayer Electronic Component And Manufacturing Method Thereof App 20150187486 - LIM; Bong Sup	2015-07-02
Coupling structure for multi-layered chip filter, and multi-layered chip filter with the structure Grant 9,041,493 - Ahn , et al. May 26, 2	2015-05-26
Multilayer Type Inductor And Method Of Manufacturing The Same App 20150061810 - LIM; Bong Sup	2015-03-05
Multilayer Inductor App 20150015357 - LIM; Bong Sup	2015-01-15
Multilayered Ceramic Electronic Component And Fabrication Method Thereof App 20130093556 - LIM; Bong Sup	2013-04-18
Chip Inductor App 20130063238 - LIM; Bong Sup ; et al.	2013-03-14
Package member for flat panel display apparatus Grant 8,215,484 - Lim July 10, 2	2012-07-10
Coupling Structure For Multi-layered Chip Filter, And Multi-layered Chip Filter With The Structure App 20120092090 - AHN; Young Ghyu ; et al.	2012-04-19
Automatic Packing Apparatus And Automatic Packing Method Using The Same App 20120079796 - Kim; Jin Ho ; et al.	2012-04-05
Multilayer Filter App 20110309895 - AHN; Young Ghyu ; et al.	2011-12-22
Package Member For Flat Panel Display Apparatus App 20110220543 - Lim; Bong Sup	2011-09-15
Foamed Resin Product And Foamed Resin Molding Machine To Manufacture The Same App 20110086216 - LIM; Bong Sup ; et al.	2011-04-14
Multi-layered packaging film, packaging bag, and package and packaging method using the multi-layered packaging film and the packaging bag App 20070199855 - Lim; Bong-sup	2007-08-30
Box openable at a side thereof App 20030038171 - Lim, Bong-Sup ; et al.	2003-02-27

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